TDK-MMZ2012S181AT000
| Part # | TDK-MMZ2012S181AT000 |
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Conformity to RoHS Directive
Chip Beads(SMD)
For Signal Line
MMZ Series
MMZ2012
T
y
pe
FEATURES
M
A
T
ERIAL CHARACTERISTICS
• Chip
bead(impeder), MMZ series offers 4 construction materials.
• Size
standardized for use by automatic assembly equipment.
No preferred orientation.
R material: For wide frequency applications calling for broad
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrit
y
.
I
mpedance values selected
for effectiveness at 10 to 200MHz.
• Either
flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
• High
reliability due to an entirely monolithic structure.
• Closed
magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low
DC resistance structure of electrode prevents wasteful
electric power consumption.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
• The
products contain no lead and also support lead-free
soldering.
Y material: High frequency range type intended for the 100MHz
region and above.
• It
is a product conforming to RoHS directive.
For signal line applications in which the signal fre-
quency is far from the cutoff frequenc
y
.
I
mpedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (200 to 500MHz) for signal line applications.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
TYPICAL MATERIAL CHARACTERISTICS
MMZ 2012
R
121
A
T
(1) (2)
(3) (4) (5) (6)
2500
(1) Series name
2000
(2) Dimensions L
×
W
(3) Material code
(4) Nominal impedance
121:120
Ω
at 100MHz
(5) Characteristic type
(6) Packaging style
T:
T
a
ping
Y
1500
1000
D
S
R
500
0
10
100
1000
Frequency(MHz)
HANDLING AND PRECAUTIONS
• Before
soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After
mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do
not expose the inductors to stray magnetic fields.
• Avoid
static electricity discharge during handling.
• When
hand soldering, apply the soldering iron to the printed cir-
cuit board onl
y
. T
e
mperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity
to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercur
y
,
h
exavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.
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SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
ELECTRICAL CHARACTERISTICS
Impedance
DC resistance
(
Ω
)max.
Rated current
(mA)max.
Part No.
(
Ω
) 25%
[100MHz]
∗
15
2
0.2
MMZ2012R150A
MMZ2012R300A
MMZ2012R600A
MMZ2012R121A
MMZ2012R301A
MMZ2012R601A
MMZ2012R102A
MMZ2012S400A
MMZ2012S800A
MMZ2012S121A
MMZ2012S181A
MMZ2012S301A
MMZ2012S601A
MMZ2012S102A
MMZ2012Y150B
MMZ2012Y300B
MMZ2012Y600B
MMZ2012Y121B
MMZ2012Y301B
MMZ2012Y601B
MMZ2012Y102B
MMZ2012Y152B
MMZ2012Y202B
MMZ2012D800B
MMZ2012D121B
MMZ2012D301B
∗
0.05
0.05
0.1
0.12
0.15
0.2
0.3
0.1
0.1
1500
1500
1000
800
600
500
500
1000
800
800
600
600
500
500
1500
1500
1000
800
600
500
500
500
400
500
500
400
30
60
120
300
600
1000
40
0.8
1
0.8
0.5 0.3
Weight: 8mg
Dimensions in mm
80
TEMPERATURE RANGES
Operating/storage –55
to +125°C
120
180
300
600
1000
15
0.15
0.15
0.2
0.3
PACKAGING STYLE AND QUANTITIES
0.35
0.05
0.05
0.1
0.12
0.15
0.2
0.3
0.4
0.5
0.3
Packaging style
Quantity
T
a
ping
4000 pieces/reel
30
60
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
120
300
600
1000
1500
2000
80
10s max.
250 to 260˚C
230˚C
Natural
cooling
120
300
0.3
0.5
180˚C
150˚C
T
e
st equipment
:
E4991A or equivalent
T
e
st tool
:
16192A or equivalent
T
e
st temperature: 25
10°C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ2012R150A
MMZ2012R300A
MMZ2012R600A
120
120
120
100
80
60
40
20
0
100
80
60
40
20
0
100
80
60
40
20
0
Z
R
Z
X
Z
R
R
X
X
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100
1000
)
10000
(
(
Frequency MHz
(
Frequency MHz
Frequency MHz
MMZ2012R121A
MMZ2012R301A
MMZ2012R601A
500
500
1000
900
800
700
600
500
400
300
200
100
0
400
300
200
100
0
400
300
200
100
0
Z
Z
R
R
Z
R
X
X
X
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100
1000
( )
Frequency MHz
10000
(
(
Frequency MHz
Frequency MHz
• All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.
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TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ2012R102A
MMZ2012S400A
MMZ2012S800A
300
300
250
200
150
100
50
1600
1400
1200
1000
800
250
200
150
100
50
Z
600
400
200
0
R
Z
R
X
Z
X
R
X
0
0
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100
1000
)
10000
(
(
(
Frequency MHz
Frequency MHz
Frequency MHz
MMZ2012S121A
MMZ2012S181A
MMZ2012S301A
300
1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
250
200
150
100
50
Z
Z
R
R
Z
R
X
X
X
0
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100
1000
)
10000
10000
10000
(
(
(
Frequency MHz
Frequency MHz
Frequency MHz
MMZ2012S601A
MMZ2012S102A
MMZ2012Y150B
120
1000
900
800
700
600
500
400
300
200
100
0
1600
1400
1200
1000
800
600
400
200
0
100
80
60
40
20
0
Z
Z
R
R
Z
X
X
R
X
1
10
100
(
1000
)
1
10
100
1000
)
10000
1
10
100
1000
)
10000
(
(
Frequency MHz
Frequency MHz
Frequency MHz
MMZ2012Y300B
MMZ2012Y600B
MMZ2012Y121B
800
700
600
500
400
300
200
100
0
120
120
100
80
60
40
20
0
100
80
60
40
20
0
Z
R
X
Z
Z
R
X
R
X
1
10
100
1000
)
1
10
100
1000
)
10000
1
10
100
1000
)
10000
(
Frequency MHz
(
(
Frequency MHz
Frequency MHz
• All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.
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TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ2012Y301B
MMZ2012Y601B
MMZ2012Y102B
800
700
600
500
400
300
200
100
0
1600
1400
1200
1000
800
600
400
200
0
800
700
600
500
400
300
200
100
0
Z
R
Z
Z
R
R
X
X
X
1
10
100
1000
)
10000
10000
10000
1
10
100
1000
)
10000
1
10
100
1000
)
10000
10000
10000
(
(
(
Frequency MHz
Frequency MHz
Frequency MHz
MMZ2012Y152B
MMZ2012Y202B
MMZ2012D800B
1600
1400
1200
1000
800
600
400
200
0
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
0
1000
900
800
700
600
500
400
300
200
100
0
Z
R
Z
R
Z
R
X
X
X
1
10
100
1000
)
1
10
100
1000
)
1
10
100
1000
)
10000
(
(
(
Frequency MHz
Frequency MHz
Frequency MHz
MMZ2012D121B
MMZ2012D301B
1600
1400
1200
1000
800
600
400
200
0
4000
3500
3000
2500
2000
1500
1000
500
R
X
Z
Z
R
X
0
1
10
100
1000
)
1
10
100
1000
( )
Frequency MHz
(
Frequency MHz
PACKAGING STYLES
REEL DIMENSIONS
T
A
PE DIMENSIONS
+0.1
1.5
Sprocket hole
Cavity
–0.0
1.0
1.1max.
1.5 0.2
4.0 0.1
2.0 0.05
4.0 0.1
+2.0
8.4
–0.0
2.0 0.5
160min.
Taping
200min.
ø13 0.2
ø21 0.8
14.4max.
ø180 2.0
Dimensions in mm
300min.
Dimensions in mm
Drawing direction
• All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.
