TECH-PUBLIC-TPM2101BC3

Part #TECH-PUBLIC-TPM2101BC3
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TECH-PUBLIC-TPM2101BC3
TPM2101B  
C3  
P-Channel Enhancement-Mode MOS FETs  
Features  
Applications  
●
V

DS  

●
I

D  

-20V  
-2.0A  
<
130 mohm  
<
170 mohm  
<
250 mohm  
Battery protection  
Load switch  
ƽ
ƽ
ƽ
●
R

DS(ON)

( at V

GS

=-4.5V)  
●
R

DS(ON)

( at V

GS

=-2.5V)  
●
R

DS(ON)

( at V

GS

=-1.8V)  
Power management  
D
S
G
SOT323  
Absolute Maximum Ratings (T

A

=25°C unless otherwise specified)  
Parameter  
Symbol  
V

DS  

Maximum  
-20  
Unit  
V
Drain-source Voltage  
Gate-source Voltage  
Drain Current  
V

GS  

±
10  
V
T

A

=25
℃
@ Steady
 
State  
T

A

=70
℃
@ Steady
 
State  
-2.0  
-1.6  
I

D  

A
Pulsed Drain Current

A  

Total Power Dissipation @ T

A

=25
℃  
I

DM  

-8  
0.45  
A
P

D  

W
Thermal Resistance Junction-to-Ambient

B  

Junction and Storage Temperature Range  
R

θ
JA  

278  
℃
/
W  
℃
T

J

,T

STG  

-55
~
+150  
1

TPM2101B  
C3  
P-Channel Enhancement-Mode MOS FETs  
(T =25°C
 
unless otherwise specified)  
Electrical Characteristics  
Parameter  
Static Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Units  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
Gate Threshold Voltage  
BV

DSS  

V

GS

= 0V, I

D

=-250
μA  
V

DS

=-20V,V

GS

=0V,T

C

=25
℃
 
V

GS

=
±
10V, V

DS

=0V  
V

DS

= V

GS

, I

D

=-250
μA  
V

GS

= -4.5V, I

D

=-1.5A  
V

GS

= -2.5V, I

D

=-1.2A  
V

GS

= -1.8V, I

D

=-1.0A  
I

S

=-2.0A,V

GS

=0V  
-20  
V
I

DSS  

-1  
±
100  
-1.0  
130  
170  
250  
-1.2  
-2.0  
μA  
nA  
V
I

GSS  

V

GS(th)  

-0.4  
-0.62  
100  
130  
165  
-0.8  
Static Drain-Source On-Resistance  
R

DS(ON)  

mΩ  
Diode Forward Voltage  
Maximum Body-Diode Continuous Current  
Dynamic Parameters  
Input Capacitance  
V

SD  

V
A
I

S  

C

iss  

C

oss  

C

rss  

290  
47  
Output Capacitance  
V

DS

=-10V,V

GS

=0V,f=1MHZ  
pF  
Reverse Transfer Capacitance  
Switching Parameters  
Total Gate Charge  
29  
Q

g  

Q

gs  

Q

gd  

t

D(on)  

t

r  

3.9  
0.7  
0.9  
12  
54  
15  
9
Gate Source Charge  
Gate Drain Charge  
V

GS

=-4.5V,V

DS

=-10V,I

D

=-1.0A  
nC  
Turn-on Delay Time  
Turn-on Rise Time  
V

GS

=-4.5V,V

DD

=-10V, I

D

=-1A,  
ns  
R

GEN

=2.5
Ω
 
Turn-off Delay Time  
t

D(off)  

Turn-off Fall Time  
t

f  

2

TPM2101B  
C3  
P-Channel Enhancement-Mode MOS FETs  
Outline Drawing – SOT323  
0.087(2.20)  
0.079(2.00)  
D
0.053(1.35)  
0.045(1.15)  
G
S
0.055(1.40)  
0.047(1.20)  
0.006(0.15)  
0.003(0.08)  
0.043(1.10)  
0.035(0.90)  
0.096(2.45)  
0.085(2.15)  
0.004(0.10)  
0.000(0.00)  
0.016(0.40)  
0.008(0.20)  
0.017(0.425)RE
F
.  
3