Texas-Instruments-CC2590RGVR
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CC2590
2.4-
G
Hz RF Front End, 14-dBm output power
1
FEATURES
APPLICATIONS
•
•
•
•
•
•
All 2.4-GHz ISM Band Systems
Wireless Sensor Networks
Wireless Industrial Systems
IEEE 802.15.4 and ZigBee Systems
Wireless Consumer Systems
Wireless Audio Systems
•
Seamless Interface to 2.4-GHz Low Power RF
Devices from Texas Instruments
•
•
Up to +14-dBm (25mW) Output Power
6-dB Typical Improved Sensitivity on CC24xx
and CC2500, CC2510, and CC2511
•
Few External Components
–
–
–
–
–
–
Integrated Switches
Integrated Matching Network
Integrated Balun
DESCRIPTION
CC2590
is a cost-effective and high performance RF
Front End for low-power and low-voltage 2.4-GHz
wireless applications.
Integrated Inductors
Integrated PA
CC2590
is a range extender for all existing and future
2.4-GHz low-power RF transceivers, transmitters and
System-on-Chip products from Texas Instruments.
Integrated LNA
•
•
•
Digital Control of LNA Gain by HGM Pin
100-nA in Power Down (EN = PAEN = 0)
Low Transmit Current Consumption
CC2590
increases the link budget by providing a
power amplifier for increased output power, and an
LNA with low noise figure for improved receiver
sensitivity.
–
22-mA at 3-V for +12-dBm, PAE = 23%
•
Low Receive Current Consumption
CC2590
provides a small size, high output power RF
design with its 4×4-mm QFN-16 package.
–
–
3.4-mA for High Gain Mode
1.8-mA for Low Gain Mode
CC2590
contains PA, LNA, switches, RF-matching,
and balun for simple design of high performance
wireless applications.
•
4.6-dB LNA Noise Figure, including T/R Switch
and external antenna match
•
•
RoHS Compliant 4×4-mm QFN-16 Package
2.0-V to 3.6-V Operation
CC2590 BLOCK DIAGRAM
PA
4
3
BALUN
RF_P
RXTX
11
ANT
LNA
2
RF_N
Logic
5
6
PAEN
EN
Bias
15
7
BIAS
HGM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
CC2590
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values
may cause permanent damage to the device.
PARAMETER
VALUE
UNIT
V
Supply voltage
All supply pins must have the same voltage
–0.3 to 3.6
Voltage on any digital pin
Input RF level
–0.3 to V
DD
+ 0.3, max 3.6
V
+10
–50 to 150
260
dBm
°C
°C
V
Storage temperature range
Reflow soldering temperature
According to IPC/JEDEC J-STD-020
Human Body Model, all pins except pin 10
Human Body Model, pin 10
2000
ESD
1900
V
Charged Device Model
1000
V
RECOMMENDED OPERATING CONDITIONS
The operating conditions for CC2590 are listed below.
PARAMETER
Ambient temperature range
MIN
–40
MAX
UNIT
85
3.6
°C
V
Operating supply voltage
2.0
Operating frequency range
2400
2483.5
MHz
ELECTRICAL CHARACTERISTICS
T
C
= 25°C, V
DD
= 3.0V , f
RF
= 2440MHz (unless otherwise noted). Measured on CC2590EM reference design including
external matching components.
PARAMETER
TEST CONDITIONS
MIN
TYP
3.4
MAX
4.0
UNIT
mA
mA
mA
mA
mA
µ
A
Receive current, High Gain Mode
Receive current, Low Gain Mode
HGM = 1
HGM = 0
1.8
22.1
16.8
8.0
2.0
P
IN
= 0.5 dBm, P
OUT
= 12.2 dBm
P
IN
= –3.5 dBm, P
OUT
= 10.0 dBm
No input signal
Transmit current
Transmit current
10.0
0.3
Power down current
EN = PAEN = 0
0.1
High input level (control pins)
Low input level (control pins)
EN, PAEN, HGM, RXTX
EN, PAEN, HGM, RXTX
1.3
V
DD
0.3
V
V
Power down – Receive mode switching
time
1.4
0.8
µ
s
µ
s
Power down – Transmit mode switching
time
RF Receive
Gain, High Gain Mode
Gain, Low Gain Mode
HGM = 1
HGM = 0
11.4
0
dB
dB
Gain variation, 2400 – 2483.5 MHz, High
Gain Mode
HGM = 1
HGM = 1
1.2
1.7
dB
dB
Gain variation, 2.0V – 3.6V, High Gain
Mode
HGM = 1, including internal T/R switch and external
antenna match
Noise figure, High Gain Mode
4.6
dB
Input 1 dB compression, High Gain Mode
HGM = 1
–21
dBm
2
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s):
CC2590
CC2590
ELECTRICAL CHARACTERISTICS (continued)
T
C
= 25°C, V
DD
= 3.0V , f
RF
= 2440MHz (unless otherwise noted). Measured on CC2590EM reference design including
external matching components.
PARAMETER
Input IP3, High Gain Mode
Input reflection coefficient, S11
RF Transmit
TEST CONDITIONS
MIN
TYP
–9
MAX
UNIT
dBm
dB
HGM = 1
HGM = 1, measured at antenna port
–19
Gain
14.1
13.8
12.2
10.0
23.5
10.4
23
dB
dBm
dBm
dBm
%
P
IN
= 4.5 dBm
P
IN
= 0.5 dBm
P
IN
= -3.5 dBm
P
IN
= 0.5 dBm
Output power, P
OUT
Power Added Efficiency, PAE
Output 1 dB compression
Output IP3
dBm
dBm
dB
Output power variation over frequency
2400 – 2483.5 MHz, P
IN
= 0.5 dBm
0.3
Output power variation over power supply
2.0V – 3.6V , P
IN
= 0.5 dBm
3.2
dB
Output power variation over temperature
-40°C – 85°C, P
IN
= 0.5 dBm
1.1
dB
The 2nd harmonic can be reduced to below regulatory
limits by using an external LC filter and antenna. See
application note AN032 for regulatory requirements.
2nd harmonic power
–14
–28
dBm
dBm
The 3rd harmonic can be reduced to below regulatory
limits by using an external LC filter and antenna. See
application note AN032 for regulatory requirements.
3rd harmonic power
Copyright © 2008, Texas Instruments Incorporated
3
Product Folder Link(s):
CC2590
CC2590
DEVICE INFORMATION
PIN AND I/O CONFIGURATION
(TOP VIEW)
16
15
14
13
12
NC
GND
1
2
RF_N
11
10
9
ANT
QFN-16 4x4mm
3
4
AVDD_PA2
GND
RXTX
RF_P
5
6
7
8
Figure 1.
NOTE:
The exposed die attach pad
must
be connected to a solid ground plane as this is the
primary ground connection for the chip. Inductance in vias to the pad should be
minimized. It is highly recommended to follow the reference layout. Changes will alter
the performance. Also see the PCB landpattern information in this data sheet.
For best performance, minimize the length of the ground vias, by using a 4-layer PCB
with ground plane as layer 2 when CC2590 is mounted onto layer 1.
4
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s):
CC2590
CC2590
Table 1.
PIN FUNCTIONS
PIN
TYPE
DESCRIPTION
NO.
NAME
The exposed die attach pad must be connected to a solid ground plane. See
CC2590EM reference design for recommended layout.
—
GND
Ground
1
2
NC
Not Connected
RF_N
RF
RF interface towards CC24xx or CC25xx device.
3
RXTX
Analog/Control
4
5
6
RF_P
PAEN
EN
RF
RF interface towards CC24xx or CC25xx device
Digital Input
Digital Input
Digital control pin.
7
HGM
GND
Digital Input
Ground
HGM=1
→
Device in High Gain Mode
HGM=0
→
Device in Low Gain Mode (RX only)
Secondary ground connections. Should be shorted to the die attach pad on the top
PCB layer.
8, 9, 12, 14
2.0-V – 3.6-V Power. PCB trace to this pin serves as inductive load to PA. See
CC2590EM reference design for recommended layout.
10
11
13
AVDD_PA2
ANT
Power
RF
Antenna interface.
2.0-V – 3.6-V Power. PCB trace to this pin serves as inductive load to LNA. See
CC2590EM reference design for recommended layout.
AVDD_LNA
Power
15
16
BIAS
Analog
Power
Biasing input. Resistor between this node and ground sets bias current to PAs.
2.0-V – 3.6-V Power.
AVDD_BIAS
Copyright © 2008, Texas Instruments Incorporated
5
Product Folder Link(s):
CC2590
CC2590
CC2590EM Evaluation Module
VDD
C101/C102
= PCB trace inductor
VDD
VDD
C131/C132
C161
LDB182G4520C-110
SMA
RF_P
Balun
C2
RXTX
C112
SMA
L111
RF_N
CC2590
ANT
C111
PAEN
EN
PAEN
EN
HGM
HGM
RXTX
R151
Figure 2. CC2590EM Evaluation Module
Table 2. List of Materials (See CC2590EM Reference Design)
DEVICE
L112
FUNCTION
VALUE
Part of antenna match.
Part of antenna match.
DC block.
1.5 nH: LQW15AN1N5B00 from Murata
0.5 pF, GRM1555C1HR50BZ01 from Murata
47 pF, GRM1555C1H470JZ01 from Murata
1 nF: GRM1555C1H102JA01 from Murata
C111
C112
C161
Decoupling capacitor.
27 pF || 1 nF. The smallest cap closest to CC2590.
27 pF: GRM1555C1H270JZ01 from Murata
1 nF: GRM1555C1H102JA01 from Murata
Decoupling. Will affect PA resonance. See CC2590EM reference
design for placement.
C101/C102
C131/C132
18 pF || 1 nF. The smallest cap closest to CC2590.
18 pF: GRM1555C1H180JZ01 from Murata
1 nF: GRM1555C1H102JA01 from Murata
Decoupling. Will affect LNA resonance. See CC2590EM reference
design for placement.
C2
Decoupling of external balun
1 nF: LWQ15AN1N5B00 from Murata
TL101
(1)
Transmission line. Will affect PA resonance. (simulated inductance:
0.87nH)
See CC2590EM reference design.
Transmission line: Length
≈
40 mil, Width = 8 mil
TL131
R151
Transmission line. Will affect LNA resonance. (simulated inductance:
See CC2590EM reference design.
1.64nH)
Transmission line: Length
≈
100 mil, Width = 8 mil
Bias resistor
4.3 k
Ω
: RK73H1ETTP4301F from Koa
(1) Transmission
lines are measured from edge of pad of the CC2590 footprint to edge of pad of DC coupling capacitor. The length of the
transmission lines depend on the distance to the ground plane. If another PCB stack up is chosen the length of the transmission lines
needs to be adjusted.
PCB description: 4 layer PCB 1.6mm
Copper 1: 35
µ
m
Dielectric 1-2: 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)
Copper 2: 18
µ
m
Dielectric 2-3: 0.76 mm (4 x 7628M 43% Resin)
Copper 3: 18
µ
m
Dielectric 3-4: 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)
Copper 4: 35
µ
m
DE104iML or equivalent substrate (Resin contents around 45%, which gives Er=4.42 at 2.4GHz, TanD=0.016)
6
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s):
CC2590
CC2590
TYPICAL CHARACTERISTICS
LNA GAIN AND NOISE FIGURE
LNA GAIN
vs
TEMPERATURE
vs
FREQUENCY
13
5.4
14
13
12
11
10
9
12
11
5.3
5.2
Gain HGM
HGM
10
9
5.1
5
8
4.9
4.8
8
7
7
6
4.7
4.6
4.5
4.4
4.3
4.2
4.1
4
6
Noise Figure HGM
5
5
4
4
3
3
2
2
1
LGM
1
0
Gain LGM
0
-1
-2
-3
-1
-2
3.9
2400 2410
2420 2430
2440 2450 2460 2470 2480
-40
-20
0
20
40
60
80
T
−
Temperature
−
o
C
f
−
Frequency
−
MHz
Figure 3.
Figure 4.
LNA GAIN
vs
POWER SUPPLY
13
12
11
m1
freq=2.440GHz
S(1,1)=0.129 / -31.279
impedance = 61.723 – j8.383
10
9
HGM
8
7
6
5
4
3
2
m1
1
0
LGM
2.4
-1
-2
-3
2
2.2
2.6
2.8
3
3.2
3.4
3.6
Power Supply
− V
freq (2.400GHz to 2.485GHz)
Figure 5.
Figure 6. Input Impedance of LNA Measured from Antenna
Port on CC2590EM
Copyright © 2008, Texas Instruments Incorporated
7
Product Folder Link(s):
CC2590
CC2590
TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
INPUT POWER
FREQUENCY
25
24
23
22
25
28
26
24
22
20
18
16
14
12
10
8
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
24.5
24
PAE
PAE
23.5
21
20
19
18
17
23
22.5
22
Pout
21.5
21
I_VDD
6
16
15
20.5
20
4
2
I_VDD
0
14
13
12
11
19.5
19
-2
-4
-6
-8
Pout
18.5
18
6
4
2400 2410
2420 2430 2440 2450 2460 2470
2480
-20 -18 -16
-14 -12 -10 -8
-6 -4 -2
0
2
4
6
f
−
Frequency
− MHz
Input Power
− dBm
Figure 7.
Figure 8.
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
OUTPUT POWER, PAE AND
CURRENT CONSUMPTION
vs
TEMPERATURE
POWER SUPPLY
28
26
24
22
20
18
16
14
23
26
26
25
24
23
22
21
PAE
22.8
22.6
22.4
24
22
20
PAE
22.2
22
I_VDD
I_VDD
18
16
14
12
10
8
21.8
21.6
21.4
21.2
21
20
19
P
OUT
Pout
12
10
8
18
17
-40 -30
-20 -10
0
10 20 30 40 50 60 70 80
T
− Temperature −
o
C
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Power Supply
− V
Figure 9.
Figure 10.
8
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s):
CC2590
CC2590
Controlling the Output Power from CC2590
The output power of CC2590 is controlled by controlling the input power. The CC2590 PA is designed to work in
compression (class AB), and the best efficiency is reached when a strong input signal is applied.
Input Levels on Control Pins
The four digital control pins (PAEN, EN, HGM, RXTX) have built-in level-shifting functionality, meaning that if the
CC2590 is operating from a 3.6-V supply voltage, the control pins will still sense 1.6-V – 1.8-V signals as logical
‘1’.
An example of the above would be that RXTX is connected directly to the RXTX pin on CC24xx, but the global
supply voltage is 3.6-V. The RXTX pin on CC24xx will switch between 0-V (RX) and 1.8-V(TX), which is still a
high enough voltage to control the mode of CC2590.
The input voltages should however not have logical ‘1’ level that is higher than the supply.
Connecting CC2590 to a CC24xx Device
Table 3. Control Logic for Connecting CC2590 to a CC24xx Device
PAEN = EN
RXTX
HGM
MODE OF OPERATION
Power Down
0
1
1
1
X
0
0
1
X
0
1
X
RX Low Gain Mode
RX High Gain Mode
TX
VDD
C101/C102
C131/C132
= PCB trace inductor
VDD
VDD
C161
CC24xx
RF_P
RF_P
L21
RXTX
TXRX_SWITCH
RF_N
C112
L111
CC2590
RF_N
ANT
PAEN
L112
C113
C111
RREG_OUT (CC243x, CC2480),
VREGOUT (CC2420), GIO1 (CC2400)
EN
P1_1 (CC243x), GPIO1 (CC2480),
GIO6 (CC2400)
HGM
Alternatively to
VDD/GND/MCU
(CC2420)
R151
Alternatively
from MCU
Figure 11. CC2590 + CC24xx Application Circuit
Copyright © 2008, Texas Instruments Incorporated
9
Product Folder Link(s):
CC2590
CC2590
Connecting CC2590 to the CC2500, CC2510, or CC2511 Device
Table 4. Control Logic for Connecting CC2590 to a CC2500/10/11 Devices
PAEN
EN
0
RXTX
NC
HGM
MODE OF OPERATION
Power Down
0
0
0
1
1
X
0
1
NC
RX Low Gain Mode
RX High Gain Mode
TX
1
NC
1
0
NC
X
X
1
NC
Not allowed
VDD
C101/C102
= PCB trace inductor
VDD
VDD
C131/C132
C161
CC2500
CC2510
CC2511
RF_P
RF_P
RXTX
NC
C112
L111
CC2590
RF_N
RF_N
GDO0
ANT
PAEN
L112
C113
C111
EN
GDO2
HGM
R151
Connected to
VDD/GND/MCU
Alternatively
from MCU
Figure 12. CC2590 + CC2500/10/11 Device Application Circuit
10
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s):
CC2590
CC2590
Connecting CC2590 to a CC2520 Device
Table 5. Control Logic for Connecting CC2590 to a CC2520 Device
PAEN
EN
0
RXTX
NC
HGM
MODE OF OPERATION
Power Down
0
0
0
1
1
X
0
1
NC
RX Low Gain Mode
RX High Gain Mode
TX
1
NC
1
0
NC
X
X
1
NC
Not allowed
VDD
C101/C102
= PCB trace inductor
VDD
VDD
C131/C132
C161
CC2520
R
F
_
P
RF_P
C1
RXTX
NC
C112
L111
CC2590
RF_N
RF_N
ANT
L112
C113
C111
PAEN
GPIO5
EN
GPIO4
GPIO3
HGM
R151
Alternatively to
VDD/GND/MCU
Alternatively
from MCU
Figure 13. CC2590 + CC2520 Application Circuit
PCB Layout Guidelines
The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection
for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference
layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet. For best
performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when
CC2590 is mounted onto layer 1.
PCB trace inductors are used to be able to optimize the inductance value, and they are too small to be replaced
by discrete inductors. The placement of the power supply decoupling capacitors C101/C102 and C131/C132 are
important to set the PCB trace inductance values accurately.
Copyright © 2008, Texas Instruments Incorporated
11
Product Folder Link(s):
CC2590
PACKAGE OPTION ADDENDUM
15-May-2015
PACKAGING INFORMATION
Orderable Device
CC2590RGVR
Status Package
Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
VQFN
VQFN
VQFN
VQFN
RGV
16
16
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CC2590
CC2590RGVRG4
CC2590RGVT
ACTIVE
ACTIVE
ACTIVE
RGV
RGV
RGV
2500
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CC2590
CC2590
CC2590
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
Call TI
Level-2-260C-1 YEAR
-40 to 85
CC2590RGVTG4
250
Green (RoHS
& no Sb/Br)
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan – The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) – please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based
die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines “Green” to mean Pb-Free (RoHS compatible), and free of Bromine (Br)
and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. – The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a “~” will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish – Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
15-May-2015
Important Information and Disclaimer:
The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
3-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width
(mm) (mm) (mm) (mm) (mm)
Quadrant
(mm) W1
(mm)
CC2590RGVR
CC2590RGVT
VQFN
VQFN
RGV
RGV
16
16
2500
250
330.0
180.0
12.4
12.4
4.3
4.3
4.3
4.3
1.5
1.5
8.0
8.0
12.0
12.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
3-Aug-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC2590RGVR
CC2590RGVT
VQFN
VQFN
RGV
RGV
16
16
2500
250
336.6
210.0
336.6
185.0
28.6
35.0
Pack Materials-Page 2
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