Texas-Instruments-CC2592RGVR
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CC2592 2.4-GHz Range Extender
1 Introduction
1.1 Features
1
• Seamless
Interface to 2.4-GHz Low-Power RF
Devices from Texas Instruments
• +22-dBm
Output Power
• 3-dB
Typical Improved Sensitivity on CC2520,
CC253X, and CC85XX
• Very
Few External Components
– Integrated
Switches
– Integrated
Matching Network
– Integrated
Balun
• Digital
Control of LNA Gain by HGM Terminal
• 100
nA in Power Down (LNA_EN = PA_EN = 0)
• Low-Transmit
Current Consumption
– 155
mA at 3 V for +22 dBm, PAE = 34%
• Low-Receive
Current Consumption
– 4.0-mA
for High-Gain Mode
– 1.9-mA
for Low-Gain Mode
• 4.7-dB
LNA Noise Figure, Including T/R Switch
and External Antenna Match
– Integrated
Inductors
– Integrated
PA
• RoHS
Compliant 4-mm × 4-mm QFN-16 Package
• 2.0-V
to 3.7-V Operation
– Integrated
LNA
• –40°C
to +125°C Operation
1.2 Applications
•
•
•
•
All 2.4-GHz ISM Band Systems
Wireless Sensor Networks
•
•
•
IEEE 802.15.4 and ZigBee Gateways
Wireless Consumer Systems
Wireless Audio Systems
Wireless Industrial Systems
IEEE 802.15.4 and ZigBee
®
Metering Systems
1.3 Description
The CC2592 device is a cost-effective and high-performance RF front end for low-power and low-voltage
2.4-GHz wireless applications.
The CC2592 device is a range extender for all CC25XX 2.4-GHz low-power RF transceivers, transmitters,
and system-on-chip products from Texas Instruments.
To increase the link budget, the CC2592 device provides a power amplifier for increased output power
and an LNA with a low-noise figure for improved receiver sensitivity.
The CC2592 device provides a very small size, high-output power RF design with its 4-mm × 4-mm QFN-
16 package.
The CC2592 device contains PA, LNA, switches, RF-matching, and balun for simple design of high-
performance wireless applications.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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1.4 Functional
Block Diagram
Figure 1-1
shows a simplified block diagram of the CC2592 device.
VDD_LNA VDD_PA
VDD_BIAS
ANT
RF_P
RF_N
PA
PREAMP
BALUN
EN
LNA
EN
PA_EN
LNA_EN
HGM
LOGIC
BIAS
BIAS
Figure 1-1. CC2592 Simplified Block Diagram
2
Introduction
Copyright © 2014, Texas Instruments Incorporated
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Revision History
Date
Literature Number
Changes
Initial release
February 2014
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Introduction
3
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2 Device
Characteristics
2.1 Absolute
Maximum Ratings
Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values
may cause permanent damage to the device.
Parameter
Conditions
Value
–0.3 to 3.8
Unit
V
Supply voltage
All supply terminals must have the same voltage
Voltage on any digital terminal
Input RF level
–0.3 to VDD+0.3, max 3.8
+10
V
dBm
2.2 Handling
Ratings
Under no circumstances must the handling ratings be violated. Stress exceeding one or more of the limiting values may
cause permanent damage to the device.
Parameter
Conditions
Value
–50 to 150
2000
Unit
°C
V
Storage temperature range
Human Body Model
Charge Device Model
ESD
1000
V
2.3 Recommended
Operating Conditions
The operating conditions for the CC2592 device are listed below.
Parameter
Conditions
Min
–40
2.0
Max
125
Unit
Ambient temperature range
Operating supply voltage
Operating frequency range
°C
V
3.7
2400
2483.5
MHz
4
Device Characteristics
Copyright © 2014, Texas Instruments Incorporated
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2.4 Electrical
Characteristics
T
c
= 25°C, VDD = 3.0 V, f
RF
= 2440 MHz (unless otherwise noted). Measured on CC2592EM reference design including
external matching components.
Parameter
Test Conditions
HGM = 1
Min
Typ
4
Max
Unit
mA
mA
Receive current, high-gain mode
Receive current, low-gain mode
HGM = 0
1.9
123
155
50
P
OUT
= 20 dBm
P
OUT
= 22 dBm
No input signal
EN = 0
Transmit current
mA
Transmit current
mA
µA
V
Power down current
0.1
0.3
Vdd
0.3
High-input level (control terminals)
Low-input level (control terminals)
PA_EN, LNA_EN, HGM
PA_EN, LNA_EN, HGM
1.3
V
Power down – Receive mode switching
time
1
1
µs
Power down – Transmit mode switching
time
µs
RF Receive
Gain, high-gain mode
HGM = 1
11
6
dB
dB
dB
dB
dB
dB
dB
Gain, low-gain mode
HGM = 0
Gain variation over frequency
Gain variation over power supply
Gain variation over temperature
Gain variation over temperature
2400 to 2483.5 MHz, HGM = 1
2.0 V to 3.7 V, HGM = 1
–40°C to 85°C, HGM = 1
85°C to 125°C, HGM = 1
2
1.5
1.7
1
HGM = 1, including internal T/R
switch and external antenna match
4.7
Noise figure, high-gain mode
Input 1-dB compression, high-gain mode
HGM = 1
–18
–9
dBm
dBm
dB
Input IP3, high-gain mode
Input reflection coefficient, S11
RF Transmit
HGM = 1
HGM = 1, measured at antenna port
–15
Gain
24
20.3
21.9
34
dB
P
IN
= 0.0 dBm
P
IN
= 4.0 dBm
P
OUT
= 22 dBm
Output power, P
OUT
dBm
Power added efficiency, PAE
Output 1-dB compression
%
dBm
dB
15
Output power variation over frequency
2400 to 2483.5 MHz, P
IN
= 4 dBm
0.5
3.8
1.7
Output power variation over power supply
2.0 V to 3.7 V, P
IN
= 4 dBm
Output power variation over temperature
–40°C to 125°C, P
IN
= 4 dBm
dB
dB
Second harmonic power
Third harmonic power
FCC requirement
FCC requirement
No damage
–41.2
–41.2
dBm
dBm
20:1
VSWR
Stability
7.5:1
Copyright © 2014, Texas Instruments Incorporated
Device Characteristics
5
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3 Device
Information
3.1 Terminal
and I/O Configuration
16
15
14
13
12
11
10
9
1
GND
RF_N
RF_P
GND
GND
2
3
4
QFN-16 4x4mm
ANT
GND
GND
7
6
8
5
Figure 3-1. Terminal Top View
6
Device Information
Copyright © 2014, Texas Instruments Incorporated
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Table 3-1. Terminal Functions
Terminal
Type
Description
No.
Name
–
GND
Ground
The exposed die attach pad must be connected to a solid ground
plane. See CC2592EM reference design for the recommended layout.
1, 4, 9, 11, 12, 16
GND
Ground
Ground connections. Only terminals 9, 11, and 12 should be shorted
to the die attach pad on the top PCB layer.
2
3
5
6
7
RF_N
RF_P
RF
RF interface toward CC25xx device
RF
RF interface toward CC25xx device
PA_EN
LNA_EN
HGM
Digital input
Digital input
Digital input
Digital control terminal
HGM = 1
→
Device in High Gain Mode
HGM = 0
→
Device in Low Gain Mode
8
BIAS
Analog
Biasing input. Resistor between this node and ground sets bias
current for PA and LNA.
10
13
14
15
ANT
RF
Antenna interface
2.0- to 3.7-V power
2.0- to 3.7-V power
2.0- to 3.7-V power
VDD_LNA
VDD_BIAS
VDD_PA
Power
Power
Power
Copyright © 2014, Texas Instruments Incorporated
Device Information
7
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4 Sensitivity
Improvement Example
CC2592
CC2520
NF = 4.7 dB
NF = 8 dB
Gain = 11 dB
Figure 4-1.
The noise factor of a system consisting of the CC2592 device and a CC2520 device, as seen in
Figure 4-
1
is given by:
8
4.7
10
10
10
10
ꢀ
1
F
2
ꢀ
1
G
1
F
F
ꢁ
ꢁ
3.37
1
11
10
10
(1)
(2)
The noise figure is:
NF
10log(F)
10log(3.37)
5.28 dB
The noise figure is reduced from 8 dB for the CC2520 standalone to 5.28 dB for the CC2592 and CC2520
device combination, leading to a 2.72-dB theoretical improvement in sensitivity.
In practice, tests on the CC2592 and CC25XX devices show around 3-dB improvement in sensitivity. For
the CC2538 and CC2592 devices, the improvement is almost 4 dB (approximately –97 dBm to –101 dBm)
8
Sensitivity Improvement Example
Copyright © 2014, Texas Instruments Incorporated
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5 CC2592EM
Evaluation Module
Figure 5-1
shows an evaluation module circuit of the CC2592 device.
VDD
VDD
C131
C151
VDD
LDB182G4520C-110
SMA
C107
C108
C106
C21
L101
RF_P
Balun
C152
SMA
RF_N
C109
L103
L102
CC2592
ANT
PA_EN
PA_EN
C105
C103
C101
LNA_EN
LNA_EN
HGM
HGM
R81
Figure 5-1. CC2592 Evaluation Module
Table 5-1
lists the materials in the CC2592 evaluation module circuit.
Table 5-1. List of Materials
Device
L101
L102
L103
C101
C103
C105
C106
C107
C108
C109
C21
Function
Value
PA bias inductor
Part of antenna match
Part of antenna match
Part of antenna match
Part of antenna match
Part of antenna match
Decoupling
4.7 nH, Multilayer chip inductor
1 nH, Multilayer chip inductor
1.8 nH, Multilayer chip inductor
2.2-pF 0402 Chip capacitor
2.2-pF 0402 Chip capacitor
0.1-pF 0402 Chip capacitor
12-pF 0402 Chip capacitor
1-nF 0402 Chip capacitor
1-µF 0402 Chip capacitor
18-pF 0402 Chip capacitor
0.2-pF 0402 Chip capacitor
0.3-pF 0402 Chip capacitor
1-nF 0402 Chip capacitor
12-pF 0402 Chip capacitor
3.9 k
Ω
, 0402 resistor
Decoupling
Decoupling
DC block
Balun matching capacitor
Balun matching capacitor
Decoupling
C152
C131
C151
R81
Decoupling
Bias resistor
Copyright © 2014, Texas Instruments Incorporated
CC2592EM Evaluation Module
9
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6 Typical
Characteristics
spacer
13
5.2
5.1
5.0
4.9
4.8
4.7
4.6
4.5
4.4
4.3
12
11
10
9
HGM
LGM
NF HGM
12
11
10
9
8
8
7
7
6
6
5
5
HGM
LGM
4
4
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2400 2410 2420 2430 2440 2450 2460 2470 2480 2490
Power Supply (V)
Frequency (MHz)
C002
C003
Figure 2. LNA Gain Versus Power Supply
Figure 1. LNA Gain and Noise Figure Versus Frequency
12
36
34
32
30
28
26
24
22
20
18
180
170
160
150
140
130
120
110
100
90
Pout
PAE
Ivdd
HGM
LGM
11
10
9
8
7
6
5
4
0
20
40
60
80
100
120
±
40
±
20
2400 2410 2420 2430 2440 2450 2460 2470 2480 2490
Temperature (
C)
Frequency (MHz)
C001
C007
Figure 3. LNA Gain Versus Temperature
Figure 4. Output Power, PAE, and Current Consumption Versus
Frequency
Input Power Level = +4 dBm
36
32
28
24
20
16
12
8
200
180
160
140
120
100
80
36
34
32
30
28
26
24
22
20
18
180
170
160
150
140
130
120
110
100
90
60
Pout
PAE
Ivdd
Pout
PAE
Ivdd
4
40
0
20
0
4
8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
±
20
±
16
±
12
±
8
±
4
Input Power (dBm)
Power Supply (V)
C004
C005
Figure 5. Output Power, PAE, and Current Consumption Versus
Figure 6. Output Power, PAE, and Current Consumption Versus
Input Power
Power Supply
Input Power Level = +4 dBm
10
Typical Characteristics
Copyright © 2014, Texas Instruments Incorporated
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36
34
32
30
28
26
24
22
20
18
160
158
156
154
152
150
148
146
144
142
Pout
PAE
Ivdd
0
20
40
60
80
100 120 140
±
40
±
20
Temperature (
C)
C006
Figure 7. Output Power, PAE, and Current Consumption Versus Temperature
Input Power Level = +4 dBm
Copyright © 2014, Texas Instruments Incorporated
Typical Characteristics
11
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7 Controlling
the Output Power from CC2592
The output power of the CC2592 device is controlled by controlling the input power. The CC2592 PA is
designed to work in compression (class AB).
Driving the CC2592 device too far into saturation might result in spurious emissions and harmonics above
regulatory limits. This caution should especially be considered for systems targeting a wide operating
temperature range, where a combination of low temperature, low supply voltage, and a transceiver that
increases output power (drive level) at low temperature, can result in high spurious emissions.
Figure 7-1
shows the maximum recommended drive level versus temperature and supply voltage.
Figure 7-1. Maximum Recommended Drive Level
8 Input
Levels on Control Terminals
The three digital control terminals (PA_EN, LNA_EN, and HGM) have built-in level-shifting functionality,
meaning that if the CC2592 device operates off a 3.7-V supply voltage, the control terminals still sense
1.6- to 1.8-V signals as a logical 1. However, the input voltages should not have a logical 1 level that is
higher than the supply.
12
Input Levels on Control Terminals
Copyright © 2014, Texas Instruments Incorporated
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9 Connecting
the CC2592 Device to a CC25xx Device
Table 9-1
shows the control logic for connecting CC2592 to a CC25xx device.
Table 9-1. Control Logic for Connecting CC2592 to a CC25xx Device
PA_EN
LNA_EN
HGM
Mode of Operation
Power Down
0
X
X
1
0
1
1
0
X
0
1
X
RX Low-Gain Mode
RX High-Gain Mode
TX
Figure 9-1
shows the application circuit for the CC2592 and CC253X devices.
VDD
VDD
C131
C151
VDD
C107
C108
C106
L101
RF_P
RF_N
RF_P
SMA
RF_N
C109
L103
L102
CC2530
CC2592
ANT
PA_EN
LNA_EN
HGM
P1.1
P1.0
P0.7
C105
C103
C101
R81
Alternatively to
VDD/GND/MCU
Figure 9-1. Application Circuit Example for CC2530 + CC2592
Copyright © 2014, Texas Instruments Incorporated
Connecting the CC2592 Device to a CC25xx Device
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10 Device
and Documentation Support
10.1 Related
Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 10-1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
CC2592
10.2 Trademarks
ZigBee is a registered trademark of ZigBee Alliance.
10.3 Electrostatic
Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
10.4 Glossary
This glossary lists and explains terms, acronyms and definitions.
14
Device and Documentation Support
Copyright © 2014, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
15-May-2015
PACKAGING INFORMATION
Orderable Device
CC2592RGVR
CC2592RGVT
Status Package
Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
VQFN
VQFN
RGV
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CC2592
CC2592
ACTIVE
RGV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan – The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) – please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based
die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines “Green” to mean Pb-Free (RoHS compatible), and free of Bromine (Br)
and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. – The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a “~” will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish – Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:
The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
15-May-2015
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
13-Mar-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width
(mm) (mm) (mm) (mm) (mm)
Quadrant
(mm) W1
(mm)
CC2592RGVR
CC2592RGVT
VQFN
VQFN
RGV
RGV
16
16
2500
250
330.0
180.0
12.4
12.4
4.3
4.3
4.3
4.3
1.5
1.5
8.0
8.0
12.0
12.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
13-Mar-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC2592RGVR
CC2592RGVT
VQFN
VQFN
RGV
RGV
16
16
2500
250
338.1
210.0
338.1
185.0
20.6
35.0
Pack Materials-Page 2
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