Texas-Instruments-TRF6903PTR
| Part # | Texas-Instruments-TRF6903PTR |
| Download | Texas-Instruments-TRF6903PTR |
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
D
Single-Chip RF Transceiver for 315-MHz,
433-MHz, 868-MHz, and 915-MHz Industrial,
Scientific, and Medical (ISM) Bands
D
D
Clock Recovery With Integrated Data Bit
Synchronizer and Baud Rate Selection
Linear Receive Strength Signal Indicator
(RSSI)
D
D
D
D
D
D
D
2.2-V to 3.6-V Operation
Low Power Consumption
FSK/OOK Operation
D
Flexible 3-Wire Serial Interface
D
Minimal Number of External Components
Required
Integer-N Synthesizer With Fully Integrated
Voltage Controlled Oscillator (VCO)
D
D
D
D
48-Pin Low-Profile Plastic Quad Flat
Package (PQFP)
On-Chip Reference Oscillator and
Phase-Locked Loop (PLL)
Programmable XTAL Trimming
Lock Detect Indicator
Power Amplifier With 8-dBm Typical Output
Power
Programmable Training Sequence
Recognition
Programmable Brownout Detector
D
Pin Compatible to the TRF6901
10.7 MHz Ceramic
or Discrete IF Filter
Ceramic
Discriminator
33
RX_DATA
27
DCLK
41
RSSI_OUT
1
23
LNA_IN1
LNA_IN2
RX_FLAG
2
18
TRF6903
CLOCK
45
20
DATA
DET_OUT
19
STROBE
26
STDBY
4
PA_OUT
21
MODE
22
LOCK_DETECT
32
TX_DATA
13 15
30
31
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
T
e
xas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright
2005,
T
e
xas Instruments Incorporated
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1
POST OFFICE BOX 655303
•
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
PQFP PACKAGE
(TOP VIEW)
48 47 46 45 44 43 42 41 40 39 38 37
LNA_IN1
LNA_IN2
LPF_OUT
CER_DIS
SLC_CAP
RX_DATA
TX_DATA
XTAL_SW
XTAL
36
35
34
33
32
31
30
29
28
27
26
25
1
2
LNA_VCC
PA_OUT
3
4
PA_GND1
PA_VCC
5
6
PA_GND2
VCO_GND1
VCO_VCC
VCO_VCC2
VCO_BYPASS
VCO_GND2
7
8
XTAL_VCC
DGND
9
10
11
12
DCLK
STDBY
NC
13 14 15 16 17 18 19 20 21 22 23 24
description
The TRF6903 single-chip solution is an integrated circuit intended for use as a low-cost multiband FSK or OOK
transceiver to establish a frequency-programmable, half-duplex, bidirectional RF link. The multichannel
transceiver is intended for digital (FSK, OOK) modulated applications in the North American and European
315-MHz, 433-MHz, 868-MHz, and 915-MHz ISM bands. The single-chip transceiver operates down to 2.2 V
and is designed for low power consumption. The synthesizer has a typical channel spacing of better than
200 kHz and features a fully-integrated VCO. Only the PLL loop filter is external to the device.
Two fully-programmable operation modes, Mode0 and Mode1, allow extremely fast switching between two
preprogrammed settings (for example,
receive (RX)/transmit (TX); TX_frequency_0/TX_frequency_1;
RX_frequency_0/RX_frequency_1;
…
) without reprogramming the device.
ISM band standards
Europe has assigned an unlicensed frequency band of 868 MHz to 870 MHz. This band is specifically defined
for short range devices with duty cycles from 0.1% to 100% in several subbands. The new European frequency
band, due to the duty cycle assignment, allows a reliable RF link and makes many new applications possible.
The North American unlicensed ISM band covers 902 MHz to 928 MHz (center frequency of 915 MHz), and is
suitable for short range RF links.
2
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
transmitter
The transmitter consists of an integrated VCO and tank circuit, a complete integer-N synthesizer, and a power
amplifier. The dividers, prescaler, and reference oscillator require only the addition of an external crystal and
a loop filter to provide a complete PLL with a typical frequency resolution of better than 200 kHz.
Since the typical RF output power is approximately 8 dBm, no additional external RF power amplifier is
necessary in most applications.
Four attenuation settings for the power amplifier are offered. This feature allows the user to fine tune the
amplifier for optimal output power.
receiver
The integrated receiver is intended to be used as a single-conversion FSK/OOK receiver. It consists of a low
noise amplifier, mixer, limiter, FM/FSK demodulator with an external LC tank circuit or ceramic resonator, LPF
amplifier, and a data slicer with clock recovery and an integrated data bit synchronizer. The received strength
signal indicator (RSSI) can also be used for fast carrier sense on/off keying, or amplitude shift keying,
(OOK/ASK) demodulator.
baseband interface
The TRF6903 can easily be interfaced to a baseband processor such as the
T
e
xas Instruments MSP430
ultralow-power microcontroller (see Figure 1). The TRF6903 serial control registers are programmed by the
MSP430 and the MSP430 performs baseband operations in the software.
A synchronized data clock, programmable for most common data rates, is provided by the TRF6903. This
feature reduces the need for extensive oversampling and data decision in the microcontroller during receive.
During transmit, the data clock can be used to clock the transmit data from the microcontroller to the TRF6903
at predefined data rates.
Microcontroller
Antenna
Section
RF Section
RSSI_OUT
RSSI Out (Analog Signal)
Transmit Data
TX_DATA
RX_DATA
Receive Data
RF In
LNA_IN1, 2
PA_OUT
Data Clock
DCLK
Learn/Hold Select
RF Out
LEARN/HOLD
Mode Select
Standby
MODE
STDBY
TRF6903
Transceiver
+
MSP430
Family
µ
C
Brownout Detector Out
DET_OUT
Discretes
Serial Control Data
Serial Control Clock
Serial Control Strobe
DATA
CLOCK
STROBE
Lock Detect Out
LOCK_DETECT
RX_FLAG
Receive Data Flag
Figure 1. System Block Diagram for Interfacing to the MSP430 Microcontroller
3
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
functional block diagram
Ceramic
Discriminator
10.7-MHz Ceramic
or Discrete IF FIlter
47
44, 43
Limiter
35
37
36 39
34
LPF Amplifier
Mixer
LNA_IN1, LNA_IN2
RF
IN
LNA
1, 2
Data Slicer
Quadrature
33
27
Demodulator
Bit Synchronizer
and
Data Clock
RX_DATA
DCLK
OOK
Switch
41
23
RSSI
RSSI_OUT
RX_FLAG
Band-gap
8
18
20
19
26
21
/A-
Counter
CLOCK
/Div. CTRL
Serial
6
DATA
STROBE
Interface
45
STDBY
MODE
Brownout
Detector
/N Prescaler
32/33
DET_OUT
/B-
Counter
22
Lock
Detect
LOCK_DETECT
Output
Divider
1, 2, 3
4
PFD
CPs
PA_OUT
PA
/Ref
2…255
32
TX_DATA
XTAL
Switch
VCO
30
31
VCO_TUNE 13
15 CP_OUT
Loop Filter
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
35
18
14
15
16
20
CER_DIS
CLOCK
CP_GND
CP_OUT
CP_VCC
DATA
Connect to external ceramic discriminator
Serial interface clock signal input
Charge pump ground
I
O
I
Charge pump output
Charge pump supply voltage
Serial interface data signal input
4
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ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
Terminal Functions (Continued)
TERMINAL
I/O
O
DESCRIPTION
NAME
DCLK
NO.
27
38
40
45
28
17
42
44
43
39
1
Data clock output
DEM_GND
DEM_VCC
DET_OUT
DGND
Demodulator ground
Demodulator supply voltage
Brownout detector output; active high
Digital ground
O
DVDD
Digital power supply
GND
Substrate ground
IF_IN1
I
I
I
I
I
Limiter amplifier noninverting input
Limiter amplifier inverting input
IF_IN2
LEARN/HOLD
LNA_IN1
LNA_IN2
LNA_VCC
LOCK_DETECT
LPF_IN
Data slicer switch. Controls data slicer reference level
LNA noninverting input
LNA inverting input
2
3
LNA power supply
22
37
36
46
47
48
21
24, 25
5
O
I
PLL lock detect signal, active high
Low-pass filter amplifier input
Low-pass filter amplifier output
Mixer ground
LPF_OUT
MIX_GND
MIX_OUT
MIX_VCC
MODE
O
O
I
Mixer output
Mixer supply voltage
Mode select input
NC
No connect
PA_GND1
PA_GND2
PA_OUT
PA_VCC
RSSI_OUT
RX_DATA
RX_FLAG
SLC_CAP
STDBY
Power amplifier ground
Power amplifier ground
Power amplifier output
7
4
O
6
Power amplifier supply voltage
RSSI output signal
41
33
23
34
26
19
32
O
O
O
I/O
I
Demodulated digital (FSK or OOK) RX data
Receive data flag
External capacitor for data slicer
Standby input signal; active low
Serial interface strobe signal
Buffered TX data input
STROBE
TX_DATA
I
I
VCO_BYPASS
VCO_GND1
VCO_GND2
VCO_TUNE
VCO_VCC
VCO_VCC2
XTAL
11
8
I
VCO bypass; connect to ground through a 100-pF capacitor
VCO ground
12
13
9
VCO ground
I
Tuning voltage for the integrated VCO
VCO supply voltage
10
30
31
29
VCO core supply voltage
I/O
I
Connection to an external crystal reference
Connecting to external capacitor, which sets the frequency deviation of the transmitted signal
Oscillator supply voltage
XTAL_SW
XTAL_VCC
5
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
−0.6 to 4.5 Vdc
Input voltage, logic signals
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
−0.6 to 4.5 Vdc
Storage temperature range, T
ESD protection, human body model (HBM)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 kV
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
− 65
°
C to 150
°
C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
PARAMETER
Analog supply voltage
TEST CONDITIONS
MIN
2.2
TYP
MAX
3.6
3.6
85
UNIT
V
Digital supply voltage
2.2
V
Operating free-air temperature
−
4
0
°
C
dc electrical characteristics, V
= 2.7
V
, T
=
2
5
°
C
A
CC
supply current
PARAMETER
TEST CONDITIONS
STDBY low
MIN
TYP
0.6
12
11
MAX
4
UNIT
Standby current
µ
A
315-MHz band
433-MHz band
868-MHz band
915-MHz band
315-MHz band
433-MHz band
868-MHz band
915-MHz band
315-MHz band
433-MHz band
868-MHz band
15
14
12
12
26
25
23
23
26
25
23
RX current, receive chain inactive. Bit synchronizer and data clock
inactive. PLL, VCO, dividers, and reference active
mA
mA
mA
10
10
20
19
18
18
20
19
18
RX current, receive chain active. PLL, VCO, dividers, and reference
active. Bit synchronizer and data clock inactive
RX current, receive chain active. PLL, VCO, dividers, and reference
active. Bit synchronizer and data clock active
915-MHz band
18
23
6
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
dc electrical characteristics, V
= 2.7
V
, T
=
2
5
°
C (continued)
A
CC
supply current (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
12
MAX
15
UNIT
315-MHz band
433-MHz band
868-MHz band
915-MHz band
11
14
TX current, PA disabled. PLL, VCO, dividers, and reference active
mA
10
12
10
12
0-dB attenuation
10-dB attenuation
20-dB attenuation
0-dB attenuation
10-dB attenuation
315-MHz band
315-MHz band
315-MHz band
433-MHz band
433-MHz band
433-MHz band
868-MHz band
868-MHz band
868-MHz band
915-MHz band
915-MHz band
915-MHz band
37
30
29
36
29
28
35
28
27
35
28
27
43
42
40
40
20-dB attenuation
0-dB attenuation
10-dB attenuation
20-dB attenuation
0-dB attenuation
10-dB attenuation
20-dB attenuation
‡
TX current
, PA enabled. PLL, VCO, dividers,
mA
reference, and data clock active
‡
The TX current consumption is dependent upon the external PA matching circuit. The matching network is normally designed to achieve the
highest output power at the 0-dB attenuation setting. Changing the external matching components to optimize the output power for other
attenuation settings alters the typical current consumption from the typical values noted.
digital interface
PARAMETER
High-level input voltage
TEST CONDITIONS
MIN
−0.4
TYP MAX
UNIT
V
V
V
V
V
V
V
V
DD
0.4
IH
DD
Low-level input voltage
High-level output voltage
Low-level output voltage
Digital input leakage current
0
V
IL
I
I
= 0.5 mA
= 0.5 mA
−0.4
DD
V
OH
OL
OH
0.4
V
OL
<0.01
µ
A
ac electrical characteristics, V
= 2.7
V
, T
=
2
5
°
C
A
CC
receiver (LNA, mixer, limiter, demod, LPF amplifier, data slicer, VCO, and PLL)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RX wake-up time
BER, FSK
1
ms
315 MHz, 433 MHz,
868 MHz, 915 MHz,
IF = 10.7 MHz, BW = 280 kHz
FSK deviation:
32 kHz
Bit rate: 19.2 kbit/s Manchester
−3
10
10
†
−
1
03 < P
RFIN
(dBm) <
−
3
0
315 MHz, 433 MHz,
868 MHz, 915 MHz,
IF = 10.7 MHz, BW = 280 kHz
ON-OFF ratio: 50 dB
−3
BER, OOK
‡
Bit rate: 9.6 kbit/s Manchester
−
1
03 < P
(dBm) <
−
3
0
RFIN
†
‡
19.2 kbit/s Manchester is equivalent to 38.4 kbit/s NRZ.
9.6 kbit/s Manchester is equivalent to 19.2 kbit/s NRZ.
7
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ꢈ
ꢐ
ꢑ
ꢒ
ꢋꢀ
ꢈ
ꢓ
ꢔ
ꢉ
ꢕ
ꢁ
ꢂ
ꢀ
ꢁ
ꢔ
ꢉ
ꢇꢎ
ꢌ
ꢈ
ꢖ
ꢌ
ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
ac electrical characteristics, V
= 2.7
V
, T
=
2
5
°
C
A
CC
LNA/mixer, 304−316 MHz
PARAMETER
TEST CONDITIONS
MIN
TYP
315
21
MAX
UNIT
dB
Frequency range
304
316
Conversion gain
dB
SSB noise figure
Includes external matching network
6.5
dB
Input 1-dB compression point
Input IP3
−31
−21
dBm
dBm
LNA/mixer, 430−450 MHz
PARAMETER
TEST CONDITIONS
MIN
TYP
433
21
MAX
UNIT
MHz
dB
Frequency range
430
450
Conversion gain
SSB noise figure
Includes external matching network
6.5
dB
Input 1-dB compression point
Input IP3
−31
−21
dBm
dBm
LNA/mixer, 868−870 MHz
PARAMETER
TEST CONDITIONS
MIN
TYP
869
19
MAX
UNIT
MHz
dB
Frequency range
868
870
Conversion gain
SSB noise figure
Includes external matching network
6.5
dB
Input 1-dB compression point
Input IP3
−31
−20
dBm
dBm
LNA/mixer, 902−928 MHz
PARAMETER
TEST CONDITIONS
MIN
TYP
915
18
MAX
UNIT
MHz
dB
Frequency range
902
928
Conversion gain
SSB noise figure
Includes external matching network
6.5
dB
Input 1-dB compression point
Input IP3
−31
−19
dBm
dBm
IF/limiter amplifier
PARAMETER
Frequency
TEST CONDITIONS
MIN
TYP
10.7
86
MAX
UNIT
MHz
dB
Voltage gain
Noise figure
IF frequency = 10.7 MHz
4
dB
VCO/output divider
PARAMETER
TEST CONDITIONS
Low-side injection, A<1:0> = 11
High-side injection, A<1:0> = 10
High-side injection, A<1:0> = 01
Low-side injection, A<1:0> = 01
Frequency offset = 50 kHz
MIN
304
430
868
902
TYP
MAX
316
450
870
928
UNIT
MHz
MHz
MHz
MHz
Frequency range: 315-MHz band
Frequency range: 433-MHz band
Frequency range: 868-MHz band
Frequency range: 915-MHz band
315
433
869
915
−
7
7
−
9
0
Closed loop phase noise
Tuning voltage
dBc/Hz
V
Frequency offset = 200 kHz
VCC at
terminal 10
0.1
8
POST OFFICE BOX 655303
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ꢐ ꢑ
ꢒꢋꢀ ꢈꢓꢔ
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ꢀ ꢁꢔꢉ
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
ac electrical characteristics, V
RSSI
= 2.7
V
, T
=
2
5
°
C (continued)
A
CC
PARAMETER
TEST CONDITIONS
MIN
TYP
70
2
MAX
UNIT
dB
Dynamic range
Rise time
Slope
R
R
= 100 k
Ω,
C =
10 pF
4
µ
s
L
L
L
20
mV/dB
RSSI output current
= 100 k
Ω,
C =
10 pF
30
µ
A
L
impedances and loads
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LNA_IN
See Figure 4
1400
{
MIX_OUT
Ω
Ω
{
IF_IN
Differential
2600
See
Figure 10
PA_OUT
†
Does not include external matching network.
transmitter (XTAL, PLL, VCO, and PA), 315-MHz band
PARAMETER
TEST CONDITIONS
A<1:0> = 11
0-dB attenuation
MIN
TYP
315
8
MAX
UNIT
TX frequency range
304
316
MHz
10-dB attenuation
20-dB attenuation
Disabled, B<3> =
0
−2
†
−12
−
8
0
−80
−25
−30
ꢀ
32
75
Output power
dBm
‡
Off
Second harmonic
Third harmonic
dBc
dBc
kHz
dB
§
Frequency deviation
FSK
Power ON-OFF ratio
OOK, 0-dB mode
FSK
64
Maximum data rate (NRZ)
kbit/s
OOK
32
†
‡
§
Matched to 50
Ω
using external matching network.
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.
Dependent upon external circuitry.
9
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄ
ꢅ ꢆ
ꢌ
ꢇ
ꢈ
ꢉ
ꢊ
ꢋ
ꢍ
ꢎꢏ
ꢈ
ꢐ
ꢑ
ꢒ
ꢋꢀ
ꢈ
ꢓ
ꢔ
ꢉ
ꢕ
ꢁ
ꢂ
ꢀ
ꢁ
ꢔ
ꢉ
ꢇꢎ
ꢌ
ꢈ
ꢖ
ꢌ
ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
ac electrical characteristics, V
= 2.7
V
, T
=
2
5
°
C (continued)
A
CC
transmitter (XTAL, PLL, VCO, and PA), 433-MHz band
PARAMETER
TEST CONDITIONS
A<1:0> = 10
0-dB attenuation
MIN
TYP
433
8
MAX
UNIT
TX frequency range
430
450
MHz
10-dB attenuation
20-dB attenuation
Disabled, B<3> =
0
−2
†
−12
−
8
0
−80
−25
−30
ꢀ
32
75
Output power
dBm
‡
Off
Second harmonic
Third harmonic
dBc
dBc
kHz
dB
§
Frequency deviation
FSK
Power ON-OFF ratio
OOK, 0-dB mode
FSK
64
Maximum data rate (NRZ)
kbit/s
OOK
32
†
‡
§
Matched to 50
Ω
using external matching network.
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.
Dependent upon external circuitry.
transmitter (XTAL, PLL, VCO, and PA), 868-MHz band
PARAMETER
TEST CONDITIONS
A<1:0> = 11
0-dB attenuation
MIN
TYP
869
8
MAX
UNIT
TX frequency range
868
870
MHz
10-dB attenuation
20-dB attenuation
Disabled, B<3> =
0
−2
†
−12
−
8
0
−80
−25
−30
ꢀ
32
75
Output power
dBm
‡
Off
Second harmonic
Third harmonic
dBc
dBc
kHz
dB
§
Frequency deviation
FSK
Power ON-OFF ratio
OOK, 0-dB mode
FSK
64
Maximum data rate (NRZ)
kbit/s
OOK
32
†
‡
§
Matched to 50
Ω
using external matching network.
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.
Dependent upon external circuitry.
10
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
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ꢐ ꢑ
ꢒꢋꢀ ꢈꢓꢔ
ꢉꢕ ꢁꢂ
ꢀ ꢁꢔꢉ
ꢇꢎ ꢌ
ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
ac electrical characteristics, V
= 2.7
V
, T
=
2
5
°
C (continued)
A
CC
transmitter (XTAL, PLL, VCO, and PA), 915-MHz band
PARAMETER
TEST CONDITIONS
A<1:0> = 11
0-dB attenuation
MIN
TYP
915
8
MAX
UNIT
TX frequency range
902
928
MHz
10-dB attenuation
20-dB attenuation
Disabled, B<3> =
0
−2
†
−12
−
8
0
−80
−25
−30
32
Output power
dBm
‡
Off
Second harmonic
Third harmonic
dBc
dBc
kHz
dB
§
Frequency deviation
FSK
Power ON-OFF ratio
OOK, 0-dB mode
FSK
75
64
Maximum data rate (NRZ)
kbit/s
OOK
32
†
‡
§
Matched to 50
Ω
using external matching network.
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.
Dependent upon external circuitry.
XTAL
PARAMETER
TEST CONDITIONS
MIN
TYP
TYP
MAX
UNIT
Frequency range
9.5
20
MHz
brownout detector
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
Voltage threshold, V
Voltage steps (
∆
V)
Number of steps
Output level
Set by B<2:1>
2.2
2.8
det
200
4
mV
Connected to typical input port of microcontroller
CMOS
11
POST OFFICE BOX 655303
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DALLAS, TEXAS 75265
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
timing data for serial interface
PARAMETER
Clock frequency
MIN
TYP
MAX
UNIT
MHz
ns
f
t
t
t
t
t
t
t
20
(CLOCK)
w(CLKHI)
w(CLKLO)
su(D)
Clock high-time pulse width, clock high
Clock low-time pulse width, clock low
20
20
0
ns
Setup time, data valid before CLOCK
↑
Hold time, data valid after CLOCK
↑
ns
10
20
20
20
ns
h(D)
Delay time of CLOCK low before STROBE high
STROBE high-time pulse width, STROBE high
STROBE low-time pulse width, STROBE low
ns
d(CLKLO)
w(STROBEHI)
w(STROBELO)
ns
ns
Data
Change
Data
Valid
−V
H
MSB
MSB
LSB
DATA
−V
L
Start of
t
t
t
w(CLKHI)
Next Word
su(D)
h(D)
t
d(CLKLO)
t
−V
CLOCK
H
−V
L
w(STROBEHI)
t
w(CLKLO)
t
w(STROBELOW)
t
r
t
STROBE
f
−V
H
Clock Disabled
−V
L
Shift in Data
Clock Enabled
Note: Most significant bit (MSB) clocked in first to the synthesizer.
Store Data
Strobe Enabled
Figure 2. Timing Data for Serial Interface
12
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ꢒꢋꢀ ꢈꢓꢔ
ꢉꢕ ꢁꢂ
ꢀ ꢁꢔꢉ
ꢇꢎ ꢌ
ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
timing data for DCLK, TX_DATA, RX_FLAG, and RX_DATA
PARAMETER
MIN
TYP
MAX
UNIT
t
t
t
t
t
t
Delay time, rising edge of DCLK to transition of RX_DATA
3
ns
d(DG)
{
Setup time, RX_DATA valid before DCLK
↑
Hold time, RX_DATA valid after DCLK
↑
Delay time, rising edge of RX_FLAG before DCLK
↑
Setup time, TX_DATA valid before DCLK
↑
Hold time, TX_DATA valid after DCLK
↑
0.4/f
su(r)
c
{
0.4/f
h(r)
c
2
ns
ns
ns
d(FK)
su(TX)
100
100
h(TX)
†
After clock recovered
Receive Deglitch Mode
RX_DATA
Output
t
d(DG)
DCLK
Output
1
T
DGK
=
f
DG
t
Receive Clock Recovery Mode or Self Train Mode
su(r)
RX_DATA
Output
t
h(r)
DCLK
Output
T
CRK
t
d(FK)
RX_FLAG
Output
(Valid Only in
Self Train Mode)
t
= T
CRK
RXF
0.87
1.13
≤
T
CRK
≤
f
f
c
c
NOTE: RX_DATA
is latched at the falling edge of DCLK.
Transmit
t
t
h(TX)
su(TX)
TX_DATA
Input
DCLK
Output
1
T
SK
=
f
c
NOTE: TX_DATA
is latched at the rising edge of DCLK.
Figure 3. Timing Data for DCLK, TX_DATA, RX_FLAG, and RX_DATA
It can be seen from the timing diagram that in the clock recovery or self train mode, the data transitions
(high-to-low or low-to-high) on the RXDATA pin are timed to coincide with the falling edge of DCLK. Any
microcontroller using the TRF6903 can then latch RXDATA on the rising edge of DCLK. For more details, see
the
data clock
section.
13
POST OFFICE BOX 655303
•
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ꢈ ꢐ
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ꢓ ꢔꢉ ꢕ
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
timing data for DCLK, TX_DATA, RX_FLAG, and RX_DATA (continued)
In high data rate systems (> 38K bps), designers need to be aware of the latency between the rising edge of
DCLK and the time the RXDATA logic value is sampled by the microcontroller. This latency needs to be less
than half the RXDATA pulse width to prevent bit errors.
If transmit capture mode is selected (by setting bit 13 in word E), the data transitions (high-to-low or low-to-high)
on the TXDATA pin are timed to coincide with the falling edge of DCLK. Any microcontroller using the TRF6903
can then latch TXDATA on the rising edge of DCLK. For more details, see the
data clock
section.
low-noise amplifier (LNA)/RF mixer
The LNA has differential inputs. The off-chip input matching network has the dual task of matching a 50-
Ω
connector (or antenna, switch, filter, etc.) to the differential inputs and providing a 180-degree phase shift
between the inputs at terminals 1 and 2. The differential input impedance of the LNA is approximately 500
Ω
in parallel with 0.7 p
F
.
T
he predicted noise figure of the LNA and input matching circuit is 2.5 dB. The cascaded
noise figure for the LNA/mixer is listed in the specifications.
The mixer offers good linearity (high IP3). An external matching network is required to transform the output
impedance of the mixer (1.4 k
Ω
) to the input impedance of the IF filter (typically 330
Ω
).
↑
1
U
CH1 S11
1
0.5
2
5
CAL
OFS
0
0.2
0.5
1
2
5
10
CPL
−5
FIL
1k
−0.5
−2
−1
START 300
MHz
STOP 1000
MHz
Figure 4. Typical LNA Input Impedance (S11) at Device Terminals LNA_IN1,2
IF amplifier/limiter
The IF amplifier has differential inputs to its first stage. The limiting amplifier provides 68 dB of gain. An external
impedance matching network is required between the IF filter output at terminal 47 and the IF amplifier inputs
at terminals 43 and 44.
RSSI
The received signal strength indicator (RSSI) voltage at terminal 41 is proportional to the log of the
down-converted RF signal at the IF limiting amplifier input. The RSSI circuit is temperature compensated. It is
useful for detecting interfering signals, transceiver handshaking, and RF channel selection. In some
applications, the RSSI circuitry alone can be used as a demodulator for amplitude-shift keying (ASK) or on-off
keying (OOK) modulation with an output at the RSSI_OUT terminal. In OOK mode, the received signal is also
fed from the RSSI circuitry to the input of the post-detection LPF amplifier. In this mode, received data is output
at the RX_DATA terminal according to the RXM field.
14
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
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ꢉꢕ ꢁꢂ
ꢀ ꢁꢔꢉ
ꢇꢎ ꢌ
ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
demodulator
The quadrature demodulator decodes digital frequency shift keying (FSK) modulation. An external ceramic
discriminator or an equivalent discrete circuit is required at terminal 35. The demodulator is optimized for use
with a ceramic discriminator. Thus, the use of a packaged ceramic discriminator is recommended for best
performance. Internal resistors can be programmed with D<14:12> to tune the demodulator center frequency.
The recommended default setting for the demodulator tuning bits is D<14:12> = 110. The resonant frequency
of the discrete-component discriminator can be calculated from the inductor and capacitor values used in the
circuit. A parallel resistor may be added to reduce the quality factor (Q) of the tank circuit, depending on the
application.
When OOK modulation is selected, the received signal from the RSSI circuitry is connected directly to the
post-detection LPF amplifier, therefore bypassing the quadrature demodulator.
1
ƒ
res
+
Ǹ
2
p
LC
External Tank
35
L
R
C
Figure 5. Optional External Discrete Demodulator Tank
post-detection amplifier/low-pass filter
The post-detection amplifier operates as a low-pass transimpedance amplifier. The external low-pass filter
circuit must be optimized for the data rate. The 3-dB corner frequency of the low-pass filter should be greater
than twice the data rate. Various low-pass filter designs use two to five components and may be first- or
second-order designs. Simple 2-element filter component values and 3-dB bandwidths are contained in
T
a
ble 1.
1
f
+
3dB
2
p
R2(C2
)
C1)
R2
C2
External Low-Pass Filter
37
36
C1
2 pF
Internal Low-Pass Amplifier
Figure 6. Post-Detection Amplifier/Low-Pass Filter
15
POST OFFICE BOX 655303
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
post-detection amplifier/low-pass filter (continued)
Table 1. Various Post-Detection Amplifier/Low-Pass Filter
3-dB Bandwidth and Corresponding Component Values for FSK Operation
f
(kHz)
10
220
68
20
220
33
30
220
22
60
220
10
3dB
R2 (k
Ω
)
C2 (pF)
NOTE: For
OOK operation, it is recommended that R2 be set to 27 k
Ω
and C2 is not placed.
data slicer and bit synchronizer
The data slicer is a comparator circuit for received digital (FSK and OOK) data. The data slicer output voltage
depends on the difference between the received signal and a reference voltage (at the sample-and-hold (S&H)
capacitor) used as a decision threshold. During the learn mode, the S&H capacitor connected to terminal 34
is charged up to the average dc voltage of a training sequence of alternating ones and zeroes; this establishes
the reference voltage to be used as a decision level before a sequence of actual data is received in the hold
mode. During long data transmissions, more training sequences may be necessary to recharge the S&H
capacitor.
If the modulation scheme is dc-free (Manchester coding) or constant-dc, the TRF6903 may be operated
continuously in the learn mode and no training sequence is necessary before the transmission of a data string.
However, the S&H capacitor voltage may be incorrect during power up or after long periods of inactivity (no data
transmission); a learning sequence before each data transmission is recommended.
The comparator is a CMOS circuit that does not load the S&H capacitor. Leaving the transmission gate
(LEARN/HOLD switch) open (in hold mode) during periods of inactivity, such as during standby, may be useful
in maintaining the capacitor reference voltage. However, the reference voltage gradually discharges over time
due to leakage current.
The time constant for charging the S&H capacitor is determined by its capacitance and an internal 51-k
Ω
resistor. A slow data rate requires a larger S&H capacitor (longer time constant). The value of the S&H capacitor,
Csh, can be calculated with the following equation:
Number of training Bits
5
51k
Data Rate (Hz)
S & H Cap
+
; Farad
Where the data rate in Hz is the fundamental frequency (in Hz) of the base band waveform.
Low-Pass Amplifier
LPF Out
33
Bit Synchronizer
and
Data Clock
27
23
Comparator
51 k
Ω
39
34
{
Csh
LEARN/HOLD
{
External Sample-and-Hold Capacitor
Figure 7. Data Slicer and Bit Synchronizer
The received data and data clock output modes are determined by field RXM according to
T
a
ble 3. When RXM,
E<15:14> is set to 00, the raw data from the data slicer is output at terminal 33, RX_DATA. No synchronization
or data recovery is performed and the receiver can be used in an asynchronous mode. When RXM, E<15:14>,
is set to 01, received data is first passed through a deglitching filter. These modes are useful for the reception
of data whose baud rate is nonstandard.
16
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
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ꢒꢋꢀ ꢈꢓꢔ
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ꢀ ꢁꢔꢉ
ꢇꢎ ꢌ
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
data slicer and bit synchronizer (continued)
When RXM is set to enable recovered data, RXM E<15:14> = 10 or 11, the integrated bit synchronizer
determines the preprogrammed data rate as determined by the crystal frequency and the values of D1, D2, and
D3, and performs data recovery. Glitch-free, recovered data is then output at terminal 33, RX_DATA, and the
corresponding data clock is output at
terminal 27, DCLK.
The preprogrammed bit rate can be calculated based on the following equation:
F
crystal frequency (kHz)
x
Bit rate (kbps)
+
+
+
f (kHz)
c
D1
D2
D3
D1
D2
D3
where
D1 = 1, 5, 6, or 8
D2 = 1, 2, 4, 8, 16, 32, 64, or 128
D3 = 15 or 16
data clock
When enabled, RXM = 10 or 11, the data clock circuitry provides as an output at terminal 27, DCLK, a data clock
based on a programmable bit rate. The bit rate is programmable via variables D1, D2, and D3 and is always
relative to the master clock (XTAL) frequency, F
.
T
a
ble 2 shows common bit rates (kbps) vs selected crystal
x
frequencies (MHz) and the respective settings of D1, D2, and D3.
Table 2. Common Bit Rates, Corresponding Crystal Frequencies, and Values of D1, D2, and D3
D1, D2, AND D3 MULTIPLIERS FOR COMMON CRYSTAL VALUES (CRYSTAL FREQUENCIES IN MHZ)
BIT RATE
(kbps)
9.8304
12.288
14.7456
15.72864
8x128x15
8x64x15
8x32x15
8x16x15
8x8x15
16.384
19.6608
0.6
0.9
8x128x16
8x128x16
1
6x128x16
5x128x16
6x64x16
5x64x16
6x32x16
5x32x16
6x16x16
5x16x16
6x8x16
8x128x16
1.024
1.2
5x128x15
8x64x16
6x128x16
8x64x16
8x128x16
1.8
2
8x64x16
8x32x16
8x16x16
8x8x16
8x4x16
8x2x16
2.048
2.4
5x64x15
8x32x16
5x128x15
8x64x16
6x64x16
8x32x16
3.6
4
4.096
4.8
5x32x15
8x16x16
5x64x15
8x32x16
6x32x16
8x16x16
7.2
8
8.192
9.6
5x16x15
8x8x16
5x32x15
8x16x16
6x16x16
8x8x16
14.4
16
16.384
19.2
28.8
32
5x8x15
8x4x16
5x16x15
8x8x16
5x8x16
6x8x16
8x4x16
6x4x16
32.768
38.4
57.6
64
5x4x15
8x2x16
8x4x15
5x8x15
8x4x16
5x4x16
6×4 x16
8x2x16
6x2x16
65.536
5x2x15
8x2x15
5x4x15
17
POST OFFICE BOX 655303
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
data clock (continued)
Table 2. Common Bit Rates, Corresponding Crystal Frequencies, and Values of
D1, D2, and D3 (continued)
D1, D2, AND D3 MULTIPLIERS FOR COMMON CRYSTAL VALUES (CRYSTAL FREQUENCIES IN MHZ)
BIT RATE
(kbps)
9.8304
12.288
14.7456
6x2x16
8x1x16
15.72864
16.384
19.6608
76.8
115.2
128
8x1x16
5x2x16
8x2x16
6x1x16
8x1x16
There are several receive modes, from raw slicer output to clock recovery and training sequence recognition.
The receive logic is controlled by the RXM, TWO, and TCOUNT fields. The RXM, E<15:14>, field determines
the receive mode as indicated in
T
a
ble 3. These modes are described in more detail below.
Table 3. Clock Recovery and Receive Data Modes Selected by RXM
RXM
RECEIVE MODE
RX_DATA
DCLK
RX_FLAG
00
Raw data
Data direct from data
Inactive; held low
slicer
Inactive; held low
01
10
Deglitch
Deglitched data
Active; clock
synchronous to
deglitched data
Inactive; held low
Inactive; held low
Clock recovery
Deglitched data;
synchronous to
bit-rate clock at
DCLK
Active; synchronous
bit-rate clock
11
Self train
Deglitched data;
synchronous to
bit-rate clock at
DCLK
Active; synchronous
bit-rate clock
Active; set high at
first received bit that
is not part of a
predetermined
training sequence
In
Raw Data
mode, the data slicer output is fed directly to the RX_DATA terminal, and the DCLK and RX_FLAG
terminals are held low.
In
Deglitch
mode, the data slicer output is passed through the internal deglitch filter. This filter samples the slicer
output at a rate f
, where
DG
F
x
D1
D2
f
+
DG
The filter output is high if five or more of the last seven samples were high, and low if two or less of the last seven
samples were high. Otherwise, the filter holds its previous value. The deglitched data is applied to the RX_DATA
terminal, and the over-sampled deglitch filter clock is passed on to the DCLK terminal. Data will appear on the
RX_DATA terminal a few gate delays after the rising edge of DCLK. The RX_FLAG terminal is held low.
In
Clock Recovery
mode, the edges of the deglitched data are used to synchronize a bit-rate clock to the data.
As long as the consecutive number of ones or zeros in the data stream, N
, meets the condition:
CB
250000
D
were
∆
is the error between the transmit bit rate and the receiver bit-rate clock in ppm.
N
t
B
CB
B
The output data is synchronous with the bit-rate clock. The deglitched data is routed to the RX_DATA terminal
and the synchronized bit-rate clock appears at DCLK. The RX_FLAG terminal is held low. The data transition
is timed to coincide with the falling edge of DCLK, so that the external microcontroller using the TRF6903 can
latch RX_DATA on the rising edge of DCLK with plenty of setup and hold margin. If no data edges have been
observed since the last reset, then DCLK is held low until an edge is seen.
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data clock (continued)
I
n
Self Train
mode, the TRF6903 receiver not only performs clock recovery, but also looks for the end of a training
sequence. The TWO, E<12>, field determines the pattern of the training sequence. If TWO is low, the training
sequence is assumed to be alternating ones and zeros; if TWO is high, the training sequence is assumed to
be alternating pairs of ones and zeros. RX_DATA and DCLK output are the same as in
Clock Recovery
mode.
However, if a minimum number of training bits have been observed, then the RX_FLAG terminal is asserted
high for one clock period (after which it returns low) at the first bit that is not part of the training sequence. The
timing of RX_FLAG is a few gate delays after the rising edge of DCLK. The minimum number of training bits
is four times the unsigned binary value of TCOUN
T
,
E
<11:7>, plus two if TWO = 0 or plus three if TWO = 1,
according to the equation:
TB
= (4 x TCOUNT) + TWO + 2
min
The clock recovery and training sequence recognition circuits are all designed to reset/clear internally with no
user action required.
When active, DCLK is synchronized to the received data. The rising edge of the data clock is intended to be
located at the middle of the received recovered data bit, thus enhancing the synchronization ability of the
microcontroller and reducing the need for extensive signal processing in the microcontroller.
main divider
The main divider is composed of a 5-bit A-counter and a 9-bit B-counter and a prescaler. The A-counter controls
the divider ratio of the prescaler, which divides the VCO signal by either 33 or 32. The prescaler divides by 33
until the A-counter reaches its terminal count and then divides by 32 until the B-counter reaches terminal count,
whereupon both counters reset and the cycle repeats. The total divide-by-N operation is related to the 32/33
prescaler by:
N
= 33
x
A + 32
x
(B – A)
TOTAL
where 0
≤
A
≤
31 and 31
≤
B
≤
511 or,
N
= A + 32B
TOTAL
Thus, the N-divider has a range of 992
≤
N
≤
16383
TOTAL
PLL
The phase-locked loop is the radio frequency synthesizer for the TRF6903. It is used to generate the transmit
signal and as the local oscillator for the receive mixer. The signal (F
) from a reference crystal oscillator (XO)
X
is divided by an integer factor R down to F
. The minimum frequency resolution, and thus, the minimum channel
R
spacing, is F
.
R
F
= F
÷
R where 1
≤
R
≤
256
X
R
The phase-locked loop is an integer-N design. The voltage-controlled oscillator (VCO) signal is divided by an
integer factor N to get a frequency at the phase detector input.
F
= F
÷
N
VCO
PD
The phase detector compares the divided VCO signal to the divided crystal frequency and implements an error
signal from two charge pumps. The error signal corrects the VCO output to the desired frequency.
As is in any integer-N PLLs, the VCO output has spurs at integer multiples of the reference frequency (nF
).
R
In applications requiring contiguous frequency channels, the reference frequency is often chosen to be equal
to the channel spacing, thus, channel spacing = F
= F
÷
R. When the PLL is locked, the LOCK_DETECT
R
X
terminal is high.
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PLL (continued)
With the addition of an output divider for multiband operation, the actual output frequency, F
, is given by:
out
F
F
VCO
P
A
)
32B
X
N
P
N
P
F
+
+
+
F
+
F
out
where F
= F
R
R
R
P
under locked conditions. The actual minimum channel spacing is:
R
PD
F
F
B
R
R
X
+
P
P
where P = 1, 2, 3 and is set by A<1:0>.
oscillator circuit and reference divider
The reference divider reduces the frequency of the external crystal (F
) by an 8-bit programmable integer
X
divisor, R, to an internal reference frequency (F
) used for the phase-locked loop. See Figure 8. The choice of
R
internal reference frequency also has implications for lock time, maximum data rate, noise floor, and loop-filter
design. The crystal frequency can be tuned using the F word to control internal trimming capacitors, which are
placed in parallel with the crystal. These offset a small frequency error in the crystal. In an FSK application, an
additional capacitor is placed in parallel (through terminal 31) with the external capacitor that is connected in
series with the crystal, thus, changing the load capacitance as the transmit data switch (TX_DATA, terminal 32)
is toggled. The change in load capacitance pulls the crystal off-frequency by the total frequency deviation.
Hence, the 2-FSK frequency, set by the level of TX_DATA and the external capacitor, can be represented as
follows:
ƒ
+
TX_DATA Low (XTAL switch closed) and
ƒ
+
TX_DATA High (XTAL switch open)
out2
out1
Note that the frequencies
ƒ
and
ƒ
are centered about the frequency
ƒ
= (
ƒ
+
ƒ
)/2. When
out1
out2
center
out1
out2
transmitting FSK,
ƒ
is considered to be the effective carrier frequency and any receiver local oscillator (LO)
center
should be set to the same
ƒ
frequency the
receiver’s IF frequency (
ƒ
) for proper reception and
center
IF
demodulation.
For the case of high-side injection, the receiver LO would be set to
ƒ
=
ƒ
+
ƒ
. Using high-side injection,
IF
LO
center
the received data at terminal 33, RX_DATA, would be inverted from the transmitted data applied at terminal 32,
TX_DATA. Conversely, for low-side injection, the receiver LO would be set to
ƒ
=
ƒ
−
ƒ
. Using low-side
LO
center
IF
injection, the received data would be the same as the transmitted data. The data polarity invert bit PI, A<4>,
can be used to invert the data at terminal 33, RX_DATA, when high-side injection is being used.
In addition, when the TRF6903 is placed in receive mode, it is recommended that the D<19> bit be kept high
to keep the XTAL switch closed. In this manner, the actual LO frequency injected into the mixer is
ƒ
If D<19> is set low, the the receiver LO would be offset, resulting in poor receiver sensitivity.
=
ƒ
.
out1
LO
31
V
CC
÷
R
Crystal
Oscillator
Circuit
F
F
30
R
Reference
Divider
2…255
Phase-
Frequency
Detector
External
Loop
Filter
15
13
F
x
PD
External Crystal
VCO
Charge Pumps
÷
N
External
Cap for
FSK
Main Divider
A, B Counters
32/33
Output
Divider
Fvco
P = 1, 2, 3
992
≤
N
≤
16383
F
out
Figure 8. TRF6903 PLL and Output Divider
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phase detector and charge pumps
The phase detector is a phase-frequency design. The phase-frequency detector gain is given by:
K =
I /2
π
P
(CP)
where, I
is the peak charge pump current. The peak charge pump current is programmable with A<3:2> in
(CP)
three steps: 250
µ
A, 500
µ
A, and 1000
µ
A.
loop filter
The loop filter must be carefully chosen for proper operation of the TRF6903. The loop filter as shown in Figure 9
is typically a second- or third-order passive design and in FSK operation should have a bandwidth wide enough
to allow the PLL to relock quickly as the external crystal frequency is pulled off-center during modulation. The
loop filter should also be wider than the data modulation rate. These requirements should be balanced with
making the loop narrow enough in consideration of the reference frequency. In OOK the VCO frequency is not
changed during data modulation, so the filter bandwidth may be narrower than the modulation bandwidth. Filters
can be calculated using standard formulas in reference literature. Some third-order filter examples are shown
in
T
a
ble 4.
1
1
)
sC2R2
s C1
)
C2
)
sC1C2R2
C3R3
1
F(s)
+
(
)
s
)
C3R3
R3
lcp
15
Vtune
13
VCO_TUNE
VCO_VCC
CP_OUT
C1
C2
R2
C3
External-Loop Filter
Figure 9. Third-Order Loop Filter and Transfer Function
Table 4. Loop Filter Component Values For Various Data Rates at a Reference Frequency of 409.6 kHz,
0.5-mA Charge Pump Current
Manchester coding
NRZ coding
1.024
2.048
1.024
47
2.048
4.096
2.048
12
4.096
8.192
4.096
2.7
8.192
16.384
8.192
0.68
27
16.384
32.768
16.384
0.18
6.8
19.2
38.4
19.2
0.12
5.1
32.768
65.536
32.768
0.043
1.8
65.536
131.072
65.536
0.01
Bit rate − kbps
Data rate − kHz
Fundamental freq of BB
C1, nF
C2, nF
1800
27
430
100
1.5
0.47
Loop filter component
(selected to nearest
standard value)
C3, nF
R2, k
Ω
R3, k
Ω
6.8
0.39
3
0.1
0.075
6.8
0.027
12
0.0068
24
0.39
0.75
1.28
0.75
1.5
1.5
5.7
3
5.7
12
15
22
47
−3−dB bandwidth, kHz (approximate)
2.56
5.12
10.24
20.48
24
40.96
81.92
VCO
The voltage-controlled oscillator (VCO) produces an RF output signal with a frequency that is dependent upon
the dc-tuning voltage at terminal 13. The tank circuit is passive and has integrated varactor diodes and
inductors. The open-loop VCO gain is approximately 100 MHz/V.
A <1:0> is used to set the output divider ratio for operation within the 315-MHz, 433-MHz, 868-MHz, or 915-MHz
bands.
When the STDBY terminal is high, the reference, PLL, VCO, and dividers are powered up. When STDBY is low,
these blocks are powered down.
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power amplifier
The power amplifier has three programmable attenuation states as determined by A<7:6> and B<7:6>: full
power (0-dB attenuation), 10-dB attenuation, and 20-dB attenuation. This adjustment feature allows the user
to fine-tune the device for optimal output power. The power amplifier can be enabled/disabled during transmit
by bit B<3>, PARXED. During receive, the transmit power amplifier is powered down but the VCO and PLL are
still operating. During ASK or OOK operation, the TX_DATA signal turns the power amplifier on and off according
to the transmit data incident at terminal 32.
↑
1
U
CH1 S22
1
0.5
2
5
CAL
OFS
0
0.2
0.5
1
2
5
10
CPL
−5
FIL
1k
−0.5
−2
−1
START 300
MHz
STOP 1000
MHz
Figure 10. Typical PA Output Impedance (S22) at Device Terminal PA_OUT
brownout detector
The brownout detector provides an output voltage to indicate a low supply voltage. This may be used to signal
the need to change transmit power to conserve battery life, or for system power down. The brownout detector
threshold is set with the B word. Four different thresholds are available.
serial control interface
The TRF6903 is controlled through a serial interface; there are five 24-bit control words (A, B, C, D, E) which
set the device state. The A and B words are almost identical, and provide configuration settings for two modes,
designated 0 and 1, which are commonly used to configure the transmit and receive states. The transmit and
receive states can then be rapidly selected using MODE (terminal 21). The C word sets the reference dividers,
the power amplifier bias, and contains various reset bits. The E word contains the bit-rate select, data clock
control bits, and the power amplifier bias control registers. The D word is used to trim the external crystal
frequency and tune the demodulator.
The register address is the composite of bits 23, 22, 1, and 0 of the 24 bits written to the serial interface. For
some words, certain bits of the address are don’t cares and are noted as XX. This flexible addressing scheme
allows backward compatibility with the TRF6901, and because of this flexibility, the data length of each register
varies from 15 bits to 22 bits.
Normal (write) operation of the serial interface is to clock in 24 bits through the CLOCK and DATA terminals.
DATA values are clocked into the 24-bit serial interface shift register on the rising edge of CLOCK. The 24-bit
value is decoded and written into the appropriate data register on the rising edge of STROBE.
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
register description
ꢀ ꢁ
ꢀ ꢀ
ꢀ ꢂ
ꢀ ꢃ
ꢂ ꢄ
ꢂ ꢅ
ꢂ ꢆ
ꢂ ꢇ
ꢂ ꢈ
ꢂꢉ
ꢂꢁ
ꢂꢀ
ꢂꢂ
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢈ
ꢉ
ꢁ
ꢀ
ꢂ
ꢃ
ꢊ
ꢋ
ꢌ
ꢍ
ꢎ
ꢍ
ꢍ
ꢌ
ꢏ
ꢐ
ꢐ
ꢎ
ꢍ
ꢍ
ꢌ
ꢏ
ꢐ
ꢐ
ꢑ ꢒ
ꢓꢔ ꢎꢕꢖ
ꢓꢗꢓ ꢍ
ꢏ ꢌ
ꢘꢋ ꢏ ꢙꢙꢓ
ꢚꢓ ꢏ
ꢔ ꢛ
ꢜꢑ ꢋ
ꢍꢏ ꢃ
ꢝ
ꢠꢡ ꢢ
ꢣ ꢡꢃ
ꢎ
ꢞ
ꢃ
ꢃ
ꢃ
ꢂ
ꢑ ꢒꢓ
ꢔ ꢞ
ꢕꢖꢓ ꢗꢓ ꢍꢏ
ꢌ ꢘ
ꢋꢏꢙꢙ ꢓ
ꢚꢓꢏ ꢔꢛ
ꢜꢑ ꢋꢍ
ꢏ ꢃꢝ
ꢑ ꢒꢓ
ꢔ ꢞ
ꢕꢖꢓ ꢗꢓ ꢍꢏ
ꢌ ꢘ
ꢋꢏꢙꢙ ꢓ
ꢚꢓꢏ ꢔꢛ
ꢜꢑ ꢋꢍ
ꢏ ꢂꢝ
ꢟ ꢎ ꢃ
ꢟ ꢎ ꢂ
ꢟ
ꢤ
ꢘ
ꢟ
ꢎ
ꢚ
ꢚ
ꢥ
ꢞꢦ ꢖ
ꢑ ꢒ
ꢓꢔ ꢎꢕꢖ
ꢓꢗꢓ ꢍ
ꢏ ꢌ
ꢘꢋ ꢏ ꢙꢙꢓ
ꢚꢓ ꢏ
ꢔ ꢛ
ꢜꢑ ꢋ
ꢍꢏ ꢂ
ꢝ
ꢠꢡ ꢢ
ꢧ ꢨꢩ
ꢢ
ꢣ ꢡꢂ
ꢪ ꢪ ꢩ
ꢖꢏ ꢛ
ꢏ ꢚꢛ
ꢋꢌ ꢖꢏ
ꢛ ꢥ
ꢠ ꢬꢌ
ꢏ ꢐꢬꢋ ꢭ
ꢍ ꢫꢔ
ꢒ ꢮ ꢭꢏ
ꢟ
ꢎ
ꢣ
ꢡ
ꢫ
ꢖ
ꢘ
ꢫ
ꢂ
ꢂ
ꢃ
ꢃ
ꢣꢏ ꢙ
ꢏꢌ ꢏꢔ
ꢚ ꢏ
ꢖꢓ ꢗꢓ ꢍ
ꢏ ꢌ
ꢘꢋ ꢏ ꢙꢙꢓ
ꢚꢓ ꢏ
ꢔ ꢛ
ꢞꢣ ꢞ
ꢞꢣꢘ
ꢣ
ꢏ
ꢐ
ꢏ
ꢌ
ꢗ
ꢏ
ꢍ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢃ
ꢃ
ꢃ
ꢂ
ꢞ
ꢣ
ꢎ
ꢣ
ꢡ
ꢑ
ꢠꢡ ꢑ
ꢠꢊ ꢪ
ꢖ ꢏꢳ
ꢱꢠꢲꢔ ꢏ
ꢠꢘ ꢪ
ꢯꢦ ꢠ
ꢌ
ꢃ
ꢃ
ꢟꢧ ꢖ
ꢌꢏ ꢐꢏ ꢛ
ꢂ
ꢂ
ꢌ
ꢌ
ꢣ
ꢡ
ꢨ
ꢡꢠꢎꢰ ꢱ ꢠꢲ ꢔ ꢏ
ꢪ
ꢪ
ꢩ
ꢡ
ꢨ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢃ
ꢖ
NOTE: r
= reserved. All reserved bits should be set low (0) during normal operation.
NOTE: All
bits indicated as 1 should be set high (1) during normal operation.
NOTE: All
bits indicated as 0 should be set low (0) during normal operation.
ADDRESS
LOCATION
NO. OF
BITS
DESCRIPTION
DEFAULT VALUE
00xx
00xx
00xx
00xx
00xx
00xx
00xx
01xx
01xx
01xx
01xx
01xx
01xx
2
1
:
1
7
1
6
:8
7:6
5
5
9
2
1
1
2
2
5
9
2
1
1
1
Main A divider coefficient (Mode 0)
00000
Main B divider coefficient (Mode 0)
Controls the PA attenuation (Mode 0)
Enables transmit/receive path (Mode 0)
Receive data polarity invert bit
001110000
10
0
4
0
3:2
1:0
2
1
:
1
7
1
6
:8
7:6
5
Controls charge pump peak current
Output divider coefficient; band select
Main A divider coefficient (Mode 1)
Main B divider coefficient (Mode 1)
Controls the PA attenuation (Mode 1)
Enables transmit/receive path (Mode 1)
00
10
00000
001110000
10
0
4
Controls modulation scheme (FSK or OOK)
0
3
Enables or disables the power amplifier while in transmit mode
or the receive chain while in receive mode
0
01xx
01xx
1000
1001
1001
1001
1001
1001
1001
1001
11×0
11×0
11×0
11×0
2:1
0
2
1
8
2
3
1
2
1
1
5
1
3
1
3
Sets threshold for the brownout detector
Enables brownout detector
00
0
2
1
:
1
4
2
1
:
2
0
1
9
:
1
7
16
Reference divider coefficient
01000000
Bit-rate divider D1
11
010
0
Bit-rate divider D2
Bit-rate divider D3
1
5
:
1
4
13
Receive mode select
00
Transmit capture mode select
RX training sequence pattern select
Determines the minimum number of training bits
Controls the position of the XTAL switch during FSK reception
Tunes the XTAL frequency by using an internal capacitor bank
PFD reset
0
12
0
11 : 7
19
00100
0
1
8
:
1
6
15
000
1
1
4
:
1
2
Tunes the resonant frequency of the external demodulation
tank circuit
000
11×0
11
1
Controls the position of the XTAL switch during OOK operation
0
NOTE: x
= don’t care
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
At power on/startup, all of the TRF6903 register contents are as per the default values.
Address 00XX (A-Word):
Word A is a 22-bit data register comprising seven fields. The main A-divider coefficient (mode 0), A<21:17>,
is the 5-bit divider ratio of the A counter when the MODE terminal is low. The main B-divider coefficient
(mode 0), A<16:8>, is the 9-bit value of the B counter when the MODE terminal is low. A <21:17> and A
<16:8> are
unsigned binary values. PA0, A<7:6>, is the 2-bit PA attenuation setting when the MODE
terminal is low. TX/RX0, A<5>, is the TX/RX switch when the MODE terminal is low. PI, A<4>, is the data
polarity invert bit. When high, this bit causes the data slicer output to be inverted. CP Acc., A<3:2>, sets the
charge pump current. BND, A<1:0>, sets the output divider, which in turn determines the band of operation.
T
e
rminal 21 (MODE) selects bits A
<
2
1
:5>
i
f low, or B
<
2
1
:5>
i
f high.
Main divider A
<
2
1
:
1
7
>
: 5-bit value for divider ratio of the A counter
Main divider A
<
1
6
:8
>
: 9-bit value for divider ratio of the B counter
PA attenuation A
<
7:6
>
: 2 bits for setting the PA attenuation
A
<
7:6>
PA ATTENUATION
0 dB
00
01
10
11
10 dB
20 dB
Not defined
A
<
5
>
: 1-bit TX/RX mode select
A
<
5>
TX/RX MODE
RX mode
0
1
TX mode
A
<
4
>
: 1-bit data polarity invert bit
A<
4
>
RX DATA POLARITY
Noninverted
0
1
Inverted
A
<
3
:
2
>
: 2 bits for setting the charge pump current
A<
3
:2>
00
CP CURRENT
0.5 mA
01
1 mA
10
0.25 mA
11
Not defined
24
POST OFFICE BOX 655303
•
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ꢒꢋꢀ ꢈꢓꢔ
ꢉꢕ ꢁꢂ
ꢀ ꢁꢔꢉ
ꢇꢎ ꢌ
ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
A
<
1
:0>: 2-bit value to set the output divider and thus select the band of operation.
A<1:
0
>
OUTPUT DIVIDER
RATIO, P
BAND OF
OPERATION
00
01
3
2
315 MHz
433 MHz
10
11
1
1
868 MHz or 915 MHz
868 MHz or 915 MHz
Address 01XX (B-Word):
Word B is a 22-bit data register comprising eight fields. The main A-divider coefficient (mode 1), B<21:17>,
is the 5-bit divider ratio of the A counter when the MODE terminal is high. The main B-divider coefficient
(mode 1), B<16:8>, is the 9-bit value of the B counter when the MODE terminal is high. B<21:17> and
B<16:8> are unsigned binary values. PA1, B<7:6>, is the 2-bit PA attenuation setting when the MODE
terminal is high. TX/RX1, B<5>, is the TX/RX switch when the MODE terminal is high. FSK/OOK, B<4>, sets
the modulation scheme for both TX and RX. Bit B<3> enables/disables the power amplifier while in transmit
mode and enables/disables the receive chain while in receive mode. The detector threshold, B<2:1>, is the
2-bit setting for the threshold voltage of the brownout detector. Det. Enable, B<0>, is the brownout detector
enable flag.
T
e
rminal 21 (MODE) selects bits A
<
2
1
:5>
i
f low, or B
<
2
1
:5>
i
f high.
Main divider B
<
2
1
:
1
7
>
: 5-bit value for divider ratio of the A-counter
Main divider B
<
1
6
:8
>
: 9-bit value for divider ratio of the B-counter
PA attenuation B
<
7:6
>
: 2 bits for setting the PA attenuation
B
<
7:6>
PA ATTENUATION
0 dB
00
01
10
11
10 dB
20 dB
Not defined
B
<
5
>
: 1-bit TX/RX mode select
B
<
5>
TX/RX MODE
RX mode
0
1
TX mode
B
<
4>
1
-bit modulation select
B
<
4>
TX/RX MODULATION
0
1
OOK
FSK
NOTE: During
OOK reception, the OOK switch is closed. During FSK reception, the OOK switch is open.
25
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
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ꢈꢖꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
B
<
3
>
: 1-bit PA or receive chain enable/disable
B
<
3>
PA OR RECEIVE CHAIN
ENABLE/DISABLE
0
1
Disabled
Enabled
B
<
2:1
>
: 2-bit value to set the threshold voltage for the brownout detector
B
<
2:1>
THRESHOLD VOLTAGE
00
01
10
11
2.2 V
2.4 V
2.6 V
2.8 V
B
<
0
>
: 1 bit to enable brownout detector
B
<
0>
BROWNOUT DETECTOR
0
1
Off
On
Address 1000 (C-Word):
Word C is a 20-bit data register comprising four fields. The reference divider
coefficient, C<21:14>, is the
8-bit divider ratio of the reference divider. The allowable reference divider range is 2 (C <21:14> =
00000010) through 255 (C <21:14> = 11111111).
Bits C<13> through C<2> are reserved and should be set to 0.
Address 1001 (E-Word):
Word E is a 20-bit data register comprising eight fields. The bit rate or bit frequency, used by the clock
recovery receive modes and the transmit synchronous mode is controlled by the BRA, E<21:20>, BRB,
E<19:17>, and BRC, E<16>, fields. These three fields control a sequence of dividers, D1 through D3, that
divide the reference (crystal) frequency, F
.
X
26
POST OFFICE BOX 655303
•
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ꢒꢋꢀ ꢈꢓꢔ
ꢉꢕ ꢁꢂ
ꢀ ꢁꢔꢉ
ꢇꢎ ꢌ
ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
E<21:20>: 2 bits to set D1 divider setting
E<21:20>
D1
1
00
01
10
11
5
6
8
E<19:17>: 3 bits to set D2 divider setting
E<19:17>
000
D2
1
001
2
010
4
011
8
100
101
110
111
16
32
64
128
E<16>: 1 bit to set D3 divider setting
E<16>
D3
0
1
16
15
RXM, E<15:14> controls the signals that appear at the RX_DATA and DCLK terminals. The definition of
RXM is contained in
T
a
ble 3.
TXM, E<13>, sets the transmit capture mode. If TXM is low, the TX_DATA terminal controls the transmit
function asynchronously. If TXM is high, the bit-rate clock is output at DCLK and the transmit data at the
TX_DATA terminal is latched on the rising edge of DCLK, where DCLK is the bit-rate clock.
TWO, E<12>, sets the receive training sequence pattern. If TWO is high, the expected training sequence is
assumed to be alternating pairs of ones and zeroes. If TWO is low, the expected training sequence is
assumed to be alternating ones and zeroes.
TCOUN
T
, E>11:7>, determines the minimum number of training bits. The minimum number of training bits is
four times the unsigned binary value of TCOUN
T
,
p
lus two if TWO = 0 or plus three if TWO = 1.
Bits E<6> through E<2> are reserved and should be set to 0.
Address 11X0 (D-Word):
Word D is a 21-bit data register comprising three fields. XTAL_Tune, D<18:16>, is used to fine tune the
crystal frequency by using an internal capacitor bank. PFD reset, D<15>, selects the source of the PFD
reset signal. Dem_Tune, D<14:12>, is a 3-bit value used to tune the demodulator time constant. Bit D<11>
controls the position of the XTAL switch during OOK operation.
D
<
1
9
>
: 1-bit value to control the position of the XTAL switch during FSK reception, when B<4>=1 and
either A<5> or B<5> = 0. It is recommended to set this bit to 1 (XTAL switch closed). If D<19> is set to 0
(XTAL switch open), the LO frequency injected into the mixer is f
= f
+ designed peak-peak
outs
LO
deviation. This results in the down-converted IF signal shifting higher (high-side injection) or lower
(low-side injection) from the IF center frequency (10.7 MHz) by an amount equal to the designed
peak-peak frequency deviation.
27
POST OFFICE BOX 655303
•
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ꢈꢖꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
D<1
9
>
XTAL SWITCH DURING FSK
RECEPTION
TERMINAL 31
0
1
Unconnected (open)
High-Z
Connected (closed)
Shorted to ground internally
D
<
1
8
:
1
6
>
: 3-bit value to fine-tune the XTAL frequency by using an internal capacitor bank.
D
<
1
8:1
6
>
000
TYPICAL LOAD CAPACITANCE
13.23 pF
22.57 pF
17.9 pF
001
010
011
27.24 pF
15.56 pF
24.9 pF
100
101
110
20.23 pF
29.57 pF
111
D
<
1
5
>
: 1-bit value to select the reset signal for the PFD
D<1
5
>
RESET SIGNAL
Derived from XTAL
Derived from prescaler
0
1
NOTE: The
default setting for D<15> is 1.
D
<
1
4
:
1
2
>
: 3-bit value to tune the resonant frequency of the external demodulator tank circuit. It can be
used to optimize the receiver performance. The recommended default setting is 110.
D
<
1
1>: 1-bit value to control position of the XTAL switch during OOK operation, when B<4> = 0.
D<1
1
>
XTAL SWITCH DURING OOK
OPERATION
TERMINAL 31
0
1
Unconnected (open)
Connected (closed)
High-Z
Shorted to ground internally
It is recommended that D<19> and D<11> be set to 0 during FSK reception and OOK operation.
Bits D<21>, D<20>, and D<10> through D<1> are reserved and should be set to 0.
operating modes
Controlled with terminal 26, STDBY
STDBY
OPERATING MODE
0
1
Power down of all blocks—programming mode
Operational mode and programming mode
Controlled with terminal 21, MODE
MODE
OPERATING MODE
Enable A-word
Enable B-word
0
1
28
POST OFFICE BOX 655303
•
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ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
PRINCIPLES OF OPERATION
Controlled with terminal 39, LEARN/HOLD
LEARN/HOLD
OPERATING MODE
0
1
Selects data slicer decision level to HOLD
Selects data slicer decision level to LEARN
The transmit/receive mode is controlled by the TX/RX0, A<5>, TX/RX1, B<5>, and PARXED, B<3>, fields
and the MODE and STDBY terminals.
A<5>
B<5>
B<3>
MODE
STDBY
OPERATING MODE
Off, programming mode; SPI enabled
X
0
X
X
X
0
X
0
0
1
Receive mode 0, RX chain disabled. Reference, PLL, VCO and
dividers enabled
0
1
X
X
X
0
0
1
1
1
0
1
0
1
0
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
Receive mode 0, RX chain enabled. Reference, PLL, VCO and
dividers enabled
Transmit mode 0, PA disabled. Reference, PLL, VCO and dividers
enabled
1
Transmit mode 0, PA enabled. Reference, PLL, VCO and dividers
enabled
X
X
X
X
Receive mode 1, RX chain disabled. Reference, PLL, VCO and
dividers enabled
Receive mode 1, RX chain enabled. Reference, PLL, VCO and
dividers enabled
Transmit mode 1, PA disabled. Reference, PLL, VCO and dividers
enabled
Transmit mode 1, PA enabled. Reference, PLL, VCO and dividers
enabled
29
POST OFFICE BOX 655303
•
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
APPLICATION INFORMATION
BPF1
MuRata
SFECF10M7 Series
C1
3
1
82 pF
C2
100 pF
C3
120 pF
L1
4.7
µ
H
2
C4
82 pF
R1
220
k
Ω
0.22
µ
F
L2
C8
C6
J1
J4
4.7
µ
H
C7
C5
RX_IN+
L3
DIS 1
10.7 MHz
MuRata
RSSI
C9
1
LPF_OUT 36
CER_DIS 35
CDSCB10M7GA119−R0
LNA
2
3
C10
34
SLC_CAP
LNA_VCC
J2
Data
C11
L4
4
PA_OUT
PA_VCC
Slicer RX_DATA
33
32
31
TX_OUT
RX_DATA
C12
5
6
TX_DATA
XTAL_SW
TX_DATA
R2 (See Note E)
L5
U1
PA_VCC2
C14
10
0
Ω
C15
7
TRF6903
XTAL 30
29
Reference
Generator
1, 2, 3
Divider
8
XTAL1
Crystek
017119
PA_VCC1
C16
9
28
27
C13
VCO_VCC
VCO_TANK2
10
VCO_VCC
VCO
Bit Synchronizer
and
Data Clock
C17
0.1
µ
F
11
VCO_BYPASS
12
26
25
XTAL_VCC
DCLK
PLL
C18
100 pF
STDBY
13
14 15 16 17 18 19 20
21 22 23
24
C19
R3
C21
R4
DVDD
VCC
C24
0.1
µ
F
C25
10
µ
F
VCO_VCC
DEM_VCC
MIX_VCC
LNA_VCC
XTAL_VCC
VCO_VCC
C22
0.1
µ
F
C20
CP_VCC
CP_VCC
C23
0.1
µ
F
PA_VCC2
PA_VCC1
NOTE: See
T
a
ble 5 for component selection for band of operation.
Figure 11. Typical TRF6903 FSK Application Schematic
30
POST OFFICE BOX 655303
•
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ꢉꢕ ꢁꢂ
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ꢇꢎ ꢌ
ꢈꢖ ꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
APPLICATION INFORMATION
Table 5. Component Selection for Band of Operation, FSK
315 MHz
Component
433 MHz
Component
868 MHz
Component
915 MHz
Component
Value
15 pF
330 pF
15 pF
27 nH
Value
8.2 pF
180 pF
8.2 pF
22 nH
Value
2.7 pF
39 pF
2.7 pF
15 nH
Value
1.5 pF
33 pF
1.8 pF
12 nH
C8
C6
C9
L3
C8
C6
C9
L3
C8
C6
C9
L3
C8
C6
C9
L3
Rx
LNA Matching
Network
C11
C14
L5
390 pF
390 pF
560 nH
75 nH
C11
C14
L5
270 pF
270 pF
470 nH
39 nH
C11
C14
L5
43 pF
39 pF
330 nH
15 nH
3.9 pF
39 pF
C11
C14
L5
43 pF
33 pF
270 nH
15 nH
2.7 pF
33 pF
Tx
PA Matching
Network
L4
L4
L4
L4
C12
C13
7.5 pF
390 pF
C12
C13
6.8 pF
270 pF
C12
C13
C12
C13
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
PLL
Loop Filter
R4
7.5 k
Ω
R4
7.5 k
Ω
R4
7.5 k
Ω
R4
7.5 k
Ω
Post Detection
Low-Pass Filter
C7
18 pF
C7
18 pF
C7
18 pF
C7
18 pF
Sample and Hold
Capacitor
C10
3300 pF
C10
3300 pF
C10
3300 pF
C10
3300 pF
C15
C16
27 pF
C15
C16
27 pF
C15
C16
27 pF
20 pF
C15
C16
27 pF
22 pF
XTAL Switch
Capacitor
5.6 pF
9.1 pF
NOTES: A. Loop
filter components selected for 19.2-kbps Manchester or 38.4-kbps NRZ for each band. I
Reference Frequency = 409.6 kHz
= 0.5 mA,
CP
B. Post
detection low-pass filter selected for 19.2-kbps Manchester or 38.4-kbps NRZ.
C. Sample
and hold capacitor selected for 7-bit training sequence and TWO = 0 (E<12>:0)
D. XTAL
switch capacitors selected for the frequency deviation of
50 kHz.
E. R2
= 100
Ω
is optional for operation in the 868-MHz and 915-MHz bands.
31
POST OFFICE BOX 655303
•
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
APPLICATION INFORMATION
BPF1
MuRata
SFECF10M7 Series
C1
3
1
82 pF
C2
100 pF
C3
120 pF
L1
4.7
µ
H
2
C4
82 pF
R1
27 k
Ω
0.22
µ
F
L2
C8
C6
J1
J4
4.7
µ
H
DNP
C5
C7
RX_IN+
L3
RSSI
C9
1
LPF_OUT 36
CER_DIS 35
LNA
2
3
C10
34
SLC_CAP
RX_DATA
LNA_VCC
J2
Data
Slicer
L4
4
PA_OUT
PA_VCC
33
32
31
TX_OUT
RX_DATA
TX_DATA
5
6
C12
C11
L5
TX_DATA
XTAL_SW
U1
PA_VCC2
7
TRF6903
XTAL 30
29
C14
Reference
Generator
1, 2, 3
8
Divider
XTAL1
Crystek
017119
C15
PA_VCC1
9
28
27
C13
VCO_VCC
27 pF
VCO_TANK2
10
VCO_VCC
VCO
Bit Synchronizer
and
Data Clock
C17
0.1
µ
F
11
VCO_BYPASS
12
26
25
XTAL_VCC
PLL
C18
100 pF
DCLK
STDBY
13
14 15 16 17 18 19 20
21 22 23
24
C19
DVDD
VCC
R3
C25
10
µ
F
C24
0.1
µ
F
DEM_VCC
C21
R4
MIX_VCC
LNA_VCC
XTAL_VCC
VCO_VCC
VCO_VCC
C22
0.1
µ
F
C20
CP_VCC
CP_VCC
C23
0.1
µ
F
PA_VCC2
PA_VCC1
NOTE: See
T
a
ble 6 for component selection for band of operation.
Figure 12. Typical TRF6903 OOK Application Schematic With Ceramic IF Filter
32
POST OFFICE BOX 655303
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ꢇꢎ ꢌ
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SWRS022D − MARCH 2004 − REVISED JUNE 2005
APPLICATION INFORMATION
Table 6. Component Selection for Band of Operation, OOK
315 MHz
Component
433 MHz
Component
868 MHz
Component
915 MHz
Component
Value
15 pF
330 pF
15 pF
27 nH
Value
8.2 pF
180 pF
8.2 pF
22 nH
Value
2.7 pF
39 pF
2.7 pF
15 nH
Value
1.5 pF
33 pF
1.8 pF
12 nH
C8
C6
C9
L3
C8
C6
C9
L3
C8
C6
C9
L3
C8
C6
C9
L3
Rx
LNA Matching
Network
C11
C14
L5
390 pF
390 pF
560 nH
75 nH
C11
C14
L5
270 pF
270 pF
470 nH
39 nH
C11
C14
L5
43 pF
39 pF
330 nH
15 nH
3.9 pF
39 pF
C11
C14
L5
43 pF
33 pF
270 nH
15 nH
2.7 pF
33 pF
Tx
PA Matching
Network
L4
L4
L4
L4
C12
C13
7.5 pF
390 pF
C12
C13
6.8 pF
270 pF
C12
C13
C12
C13
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
C19
C21
C20
R3
75 pF
120 pF
5600 pF
15 k
Ω
PLL
Loop Filter
R4
7.5 k
Ω
R4
7.5 k
Ω
R4
7.5 k
Ω
R4
7.5 k
Ω
Sample and Hold
Capacitor
C10
3300 pF
C10
3300 pF
C10
3300 pF
C10
3300 pF
NOTES: A. Loop
filter components selected for 19.2-kbps Manchester or 38.4-kbps NRZ for each band. I
Reference Frequency = 409.6 kHz
= 0.5 mA,
CP
B. Sample
and hold capacitor selected for 7-bit training sequence and TWO = 0 (E<12>:0)
33
POST OFFICE BOX 655303
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ꢀ ꢁꢂꢃ ꢄ
ꢅ ꢆ
ꢇ ꢈꢉ
ꢊꢋ ꢌꢍ ꢎꢏ
ꢈ ꢐ
ꢑ ꢒꢋꢀꢈ
ꢓ ꢔꢉ ꢕ
ꢁꢂ ꢀꢁ
ꢔꢉ ꢇꢎꢌ
ꢈꢖꢌ ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005
Revision History
DATE
6/2/05
—
REV
D
PAGE
1
SECTION
DESCRIPTION
—
—
—
—
—
Added application drawing to front page.
Information not available
C
—
—
B
—
Information not available
—
A
—
Information not available
—
*
—
Information not available
NOTE: Page
numbers for previous revisions may differ from page numbers in the current version.
34
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
TRF6903PT
Status
(1)
NRND
NRND
NRND
NRND
Package Package
Pins Package
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Qty
Type
Drawing
LQFP
PT
48
48
48
48
250 Green
(RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
TRF6903PTG4
TRF6903PTR
LQFP
LQFP
LQFP
PT
PT
PT
250 Green
(RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
1000 Green
(RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
TRF6903PTRG4
1000 Green
(RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan – The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) – please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines “Green” to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. — The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI’s knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1
(mm)
(mm) (mm)
Quadrant
TRF6903PTR
LQFP
PT
48
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
LQFP PT
48
SPQ
Length (mm)
Width (mm)
Height (mm)
346.0 346.0
33.0
TRF6903PTR
1000
Pack Materials-Page 2
M
E
CHANICAL DATA
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996
PT (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
M
0,08
0,50
36
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
Gage Plane
9,20
SQ
8,80
0,25
0,05 MIN
0
°
–
7
°
1,45
1,35
0,75
0,45
Seating Plane
0,10
1,60 MAX
404005
2
/C
1
1/96
NOTES: A. All
linear dimensions are in millimeters.
B. This
drawing is subject to change without notice.
C. Falls
within JEDEC MS-026
D. This
may also be a thermally enhanced plastic package with leads conected to the die pads.
1
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