Texas-Instruments-TRF6903PTR

Part #Texas-Instruments-TRF6903PTR
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Texas-Instruments-TRF6903PTR
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ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
D
Single-Chip RF Transceiver for 315-MHz,  
433-MHz, 868-MHz, and 915-MHz Industrial,  
Scientific, and Medical (ISM) Bands  
D
D
Clock Recovery With Integrated Data Bit  
Synchronizer and Baud Rate Selection  
Linear Receive Strength Signal Indicator  
(RSSI)  
D
D
D
D
D
D
D
2.2-V to 3.6-V Operation  
Low Power Consumption  
FSK/OOK Operation  
D
Flexible 3-Wire Serial Interface  
D
Minimal Number of External Components  
Required  
Integer-N Synthesizer With Fully Integrated  
Voltage Controlled Oscillator (VCO)  
D
D
D
D
48-Pin Low-Profile Plastic Quad Flat  
Package (PQFP)  
On-Chip Reference Oscillator and  
Phase-Locked Loop (PLL)  
Programmable XTAL Trimming  
Lock Detect Indicator  
Power Amplifier With 8-dBm Typical Output  
Power  
Programmable Training Sequence  
Recognition  
Programmable Brownout Detector  
D
Pin Compatible to the TRF6901  
10.7 MHz Ceramic  
or Discrete IF Filter  
Ceramic  
Discriminator  
33  
RX_DATA  
27  
DCLK  
41  
RSSI_OUT  
1
23  
LNA_IN1  
LNA_IN2  
RX_FLAG  
2
18  
TRF6903  
CLOCK  
45  
20  
DATA  
DET_OUT  
19  
STROBE  
26  
STDBY  
4
PA_OUT  
21  
MODE  
22  
LOCK_DETECT  
32  
TX_DATA  
13 15  
30  
31  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the gates.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
T
e
xas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
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Copyright
2005,
T
e
xas Instruments Incorporated  
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1
POST OFFICE BOX 655303
•
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PQFP PACKAGE  
(TOP VIEW)  
48 47 46 45 44 43 42 41 40 39 38 37  
LNA_IN1  
LNA_IN2  
LPF_OUT  
CER_DIS  
SLC_CAP  
RX_DATA  
TX_DATA  
XTAL_SW  
XTAL  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1
2
LNA_VCC  
PA_OUT  
3
4
PA_GND1  
PA_VCC  
5
6
PA_GND2  
VCO_GND1  
VCO_VCC  
VCO_VCC2  
VCO_BYPASS  
VCO_GND2  
7
8
XTAL_VCC  
DGND  
9
10  
11  
12  
DCLK  
STDBY  
NC  
13 14 15 16 17 18 19 20 21 22 23 24  
description  
The TRF6903 single-chip solution is an integrated circuit intended for use as a low-cost multiband FSK or OOK  
transceiver to establish a frequency-programmable, half-duplex, bidirectional RF link. The multichannel  
transceiver is intended for digital (FSK, OOK) modulated applications in the North American and European  
315-MHz, 433-MHz, 868-MHz, and 915-MHz ISM bands. The single-chip transceiver operates down to 2.2 V  
and is designed for low power consumption. The synthesizer has a typical channel spacing of better than  
200 kHz and features a fully-integrated VCO. Only the PLL loop filter is external to the device.  
Two fully-programmable operation modes, Mode0 and Mode1, allow extremely fast switching between two  
preprogrammed settings (for example,
 
receive (RX)/transmit (TX); TX_frequency_0/TX_frequency_1;  
RX_frequency_0/RX_frequency_1;
…
) without reprogramming the device.  
ISM band standards  
Europe has assigned an unlicensed frequency band of 868 MHz to 870 MHz. This band is specifically defined  
for short range devices with duty cycles from 0.1% to 100% in several subbands. The new European frequency  
band, due to the duty cycle assignment, allows a reliable RF link and makes many new applications possible.  
The North American unlicensed ISM band covers 902 MHz to 928 MHz (center frequency of 915 MHz), and is  
suitable for short range RF links.  
2
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
transmitter  
The transmitter consists of an integrated VCO and tank circuit, a complete integer-N synthesizer, and a power  
amplifier. The dividers, prescaler, and reference oscillator require only the addition of an external crystal and  
a loop filter to provide a complete PLL with a typical frequency resolution of better than 200 kHz.  
Since the typical RF output power is approximately 8 dBm, no additional external RF power amplifier is  
necessary in most applications.  
Four attenuation settings for the power amplifier are offered. This feature allows the user to fine tune the  
amplifier for optimal output power.  
receiver  
The integrated receiver is intended to be used as a single-conversion FSK/OOK receiver. It consists of a low  
noise amplifier, mixer, limiter, FM/FSK demodulator with an external LC tank circuit or ceramic resonator, LPF  
amplifier, and a data slicer with clock recovery and an integrated data bit synchronizer. The received strength  
signal indicator (RSSI) can also be used for fast carrier sense on/off keying, or amplitude shift keying,  
(OOK/ASK) demodulator.  
baseband interface  
The TRF6903 can easily be interfaced to a baseband processor such as the
T
e
xas Instruments MSP430  
ultralow-power microcontroller (see Figure 1). The TRF6903 serial control registers are programmed by the  
MSP430 and the MSP430 performs baseband operations in the software.  
A synchronized data clock, programmable for most common data rates, is provided by the TRF6903. This  
feature reduces the need for extensive oversampling and data decision in the microcontroller during receive.  
During transmit, the data clock can be used to clock the transmit data from the microcontroller to the TRF6903  
at predefined data rates.  
Microcontroller  
Antenna  
Section  
RF Section  
RSSI_OUT  
RSSI Out (Analog Signal)  
Transmit Data  
TX_DATA  
RX_DATA  
Receive Data  
RF In  
LNA_IN1, 2  
PA_OUT  
Data Clock  
DCLK  
Learn/Hold Select  
RF Out  
LEARN/HOLD  
Mode Select  
Standby  
MODE  
STDBY  
TRF6903  
Transceiver  
+
MSP430  
Family
µ
C  
Brownout Detector Out  
DET_OUT  
Discretes  
Serial Control Data  
Serial Control Clock  
Serial Control Strobe  
DATA  
CLOCK  
STROBE  
Lock Detect Out  
LOCK_DETECT  
RX_FLAG  
Receive Data Flag  
Figure 1. System Block Diagram for Interfacing to the MSP430 Microcontroller  
3
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ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
functional block diagram  
Ceramic  
Discriminator  
10.7-MHz Ceramic  
or Discrete IF FIlter  
47  
44, 43  
Limiter  
35  
37  
36 39  
34  
LPF Amplifier  
Mixer  
LNA_IN1, LNA_IN2  
RF  
IN  
LNA  
1, 2  
Data Slicer  
Quadrature  
33  
27  
Demodulator  
Bit Synchronizer  
and  
Data Clock  
RX_DATA  
DCLK  
OOK  
Switch  
41  
23  
RSSI  
RSSI_OUT  
RX_FLAG  
Band-gap  
8
18  
20  
19  
26  
21  
/A-  
Counter  
CLOCK  
/Div. CTRL  
Serial  
6
DATA  
STROBE  
Interface  
45  
STDBY  
MODE  
Brownout  
Detector  
/N Prescaler  
32/33  
DET_OUT  
/B-  
Counter  
22  
Lock  
Detect  
LOCK_DETECT  
Output  
Divider  
1, 2, 3  
4
PFD  
CPs  
PA_OUT  
PA  
/Ref  
2…255  
32  
TX_DATA  
XTAL  
Switch  
VCO  
30  
31  
VCO_TUNE 13  
15 CP_OUT  
Loop Filter  
Terminal Functions  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
35  
18  
14  
15  
16  
20  
CER_DIS  
CLOCK  
CP_GND  
CP_OUT  
CP_VCC  
DATA  
Connect to external ceramic discriminator  
Serial interface clock signal input  
Charge pump ground  
I
O
I
Charge pump output  
Charge pump supply voltage  
Serial interface data signal input  
4
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
Terminal Functions (Continued)  
TERMINAL  
I/O  
O
DESCRIPTION  
NAME  
DCLK  
NO.  
27  
38  
40  
45  
28  
17  
42  
44  
43  
39  
1
Data clock output  
DEM_GND  
DEM_VCC  
DET_OUT  
DGND  
Demodulator ground  
Demodulator supply voltage  
Brownout detector output; active high  
Digital ground  
O
DVDD  
Digital power supply  
GND  
Substrate ground  
IF_IN1  
I
I
I
I
I
Limiter amplifier noninverting input  
Limiter amplifier inverting input  
IF_IN2  
LEARN/HOLD  
LNA_IN1  
LNA_IN2  
LNA_VCC  
LOCK_DETECT  
LPF_IN  
Data slicer switch. Controls data slicer reference level  
LNA noninverting input  
LNA inverting input  
2
3
LNA power supply  
22  
37  
36  
46  
47  
48  
21  
24, 25  
5
O
I
PLL lock detect signal, active high  
Low-pass filter amplifier input  
Low-pass filter amplifier output  
Mixer ground  
LPF_OUT  
MIX_GND  
MIX_OUT  
MIX_VCC  
MODE  
O
O
I
Mixer output  
Mixer supply voltage  
Mode select input  
NC  
No connect  
PA_GND1  
PA_GND2  
PA_OUT  
PA_VCC  
RSSI_OUT  
RX_DATA  
RX_FLAG  
SLC_CAP  
STDBY  
Power amplifier ground  
Power amplifier ground  
Power amplifier output  
7
4
O
6
Power amplifier supply voltage  
RSSI output signal  
41  
33  
23  
34  
26  
19  
32  
O
O
O
I/O  
I
Demodulated digital (FSK or OOK) RX data  
Receive data flag  
External capacitor for data slicer  
Standby input signal; active low  
Serial interface strobe signal  
Buffered TX data input  
STROBE  
TX_DATA  
I
I
VCO_BYPASS  
VCO_GND1  
VCO_GND2  
VCO_TUNE  
VCO_VCC  
VCO_VCC2  
XTAL  
11  
8
I
VCO bypass; connect to ground through a 100-pF capacitor  
VCO ground  
12  
13  
9
VCO ground  
I
Tuning voltage for the integrated VCO  
VCO supply voltage  
10  
30  
31  
29  
VCO core supply voltage  
I/O  
I
Connection to an external crystal reference  
Connecting to external capacitor, which sets the frequency deviation of the transmitted signal  
Oscillator supply voltage  
XTAL_SW  
XTAL_VCC  
5
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Supply voltage range
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
−0.6 to 4.5 Vdc  
Input voltage, logic signals
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
−0.6 to 4.5 Vdc  
Storage temperature range, T  
ESD protection, human body model (HBM)
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
2 kV  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
− 65
°
C to 150
°
C  
stg  
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
recommended operating conditions  
PARAMETER  
Analog supply voltage  
TEST CONDITIONS  
MIN  
2.2  
TYP  
MAX  
3.6  
3.6  
85  
UNIT  
V
Digital supply voltage  
2.2  
V
Operating free-air temperature  
−
4
0  
°
C  
dc electrical characteristics, V  
= 2.7
V
, T
 
=
2
5
°
C  
A
CC  
supply current  
PARAMETER  
TEST CONDITIONS  
STDBY low  
MIN  
TYP  
0.6  
12  
11  
MAX  
4
UNIT  
Standby current  
µ
A  
315-MHz band  
433-MHz band  
868-MHz band  
915-MHz band  
315-MHz band  
433-MHz band  
868-MHz band  
915-MHz band  
315-MHz band  
433-MHz band  
868-MHz band  
15  
14  
12  
12  
26  
25  
23  
23  
26  
25  
23  
RX current, receive chain inactive. Bit synchronizer and data clock  
inactive. PLL, VCO, dividers, and reference active  
mA  
mA  
mA  
10  
10  
20  
19  
18  
18  
20  
19  
18  
RX current, receive chain active. PLL, VCO, dividers, and reference  
active. Bit synchronizer and data clock inactive  
RX current, receive chain active. PLL, VCO, dividers, and reference  
active. Bit synchronizer and data clock active  
915-MHz band  
18  
23  
6
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
dc electrical characteristics, V  
= 2.7
V
, T
 
=
2
5
°
C (continued)  
A
CC  
supply current (continued)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
12  
MAX  
15  
UNIT  
315-MHz band  
433-MHz band  
868-MHz band  
915-MHz band  
11  
14  
TX current, PA disabled. PLL, VCO, dividers, and reference active  
mA  
10  
12  
10  
12  
0-dB attenuation  
10-dB attenuation  
20-dB attenuation  
0-dB attenuation  
10-dB attenuation  
315-MHz band  
315-MHz band  
315-MHz band  
433-MHz band  
433-MHz band  
433-MHz band  
868-MHz band  
868-MHz band  
868-MHz band  
915-MHz band  
915-MHz band  
915-MHz band  
37  
30  
29  
36  
29  
28  
35  
28  
27  
35  
28  
27  
43  
42  
40  
40  
20-dB attenuation  
0-dB attenuation  
10-dB attenuation  
20-dB attenuation  
0-dB attenuation  
10-dB attenuation  
20-dB attenuation  
‡
TX current
 
, PA enabled. PLL, VCO, dividers,  
mA  
reference, and data clock active  
‡
The TX current consumption is dependent upon the external PA matching circuit. The matching network is normally designed to achieve the  
highest output power at the 0-dB attenuation setting. Changing the external matching components to optimize the output power for other  
attenuation settings alters the typical current consumption from the typical values noted.  
digital interface  
PARAMETER  
High-level input voltage  
TEST CONDITIONS  
MIN  
−0.4  
TYP MAX  
UNIT  
V
V
V
V
V
V
V
V
DD  
0.4  
IH  
DD  
Low-level input voltage  
High-level output voltage  
Low-level output voltage  
Digital input leakage current  
0
V
IL  
I
I
= 0.5 mA  
= 0.5 mA  
−0.4  
DD  
V
OH  
OL  
OH  
0.4  
V
OL  
<0.01  
µ
A  
ac electrical characteristics, V  
= 2.7
V
, T
 
=
2
5
°
C  
A
CC  
receiver (LNA, mixer, limiter, demod, LPF amplifier, data slicer, VCO, and PLL)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
RX wake-up time  
BER, FSK  
1
ms  
315 MHz, 433 MHz,  
868 MHz, 915 MHz,  
IF = 10.7 MHz, BW = 280 kHz  
FSK deviation:
 
32 kHz  
Bit rate: 19.2 kbit/s Manchester  
−3  
10  
10  
†
−
1
03 < P  
RFIN  
(dBm) <
−
3
0  
315 MHz, 433 MHz,  
868 MHz, 915 MHz,  
IF = 10.7 MHz, BW = 280 kHz  
ON-OFF ratio: 50 dB  
−3  
BER, OOK  
‡
Bit rate: 9.6 kbit/s Manchester  
−
1
03 < P
 
(dBm) <
−
3
0  
RFIN  
†
‡
19.2 kbit/s Manchester is equivalent to 38.4 kbit/s NRZ.  
9.6 kbit/s Manchester is equivalent to 19.2 kbit/s NRZ.  
7
POST OFFICE BOX 655303
•
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ꢎꢏ  
ꢈ
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ꢋꢀ  
ꢈ
ꢓ
ꢔ
ꢉ
ꢕ
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ꢂ
ꢀ
ꢁ
ꢔ
ꢉ
ꢇꢎ  
ꢌ
ꢈ
ꢖ
ꢌ
ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
ac electrical characteristics, V  
= 2.7
V
, T
 
=
2
5
°
C  
A
CC  
LNA/mixer, 304−316 MHz  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
315  
21  
MAX  
UNIT  
dB  
Frequency range  
304  
316  
Conversion gain  
dB  
SSB noise figure  
Includes external matching network  
6.5  
dB  
Input 1-dB compression point  
Input IP3  
−31  
−21  
dBm  
dBm  
LNA/mixer, 430−450 MHz  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
433  
21  
MAX  
UNIT  
MHz  
dB  
Frequency range  
430  
450  
Conversion gain  
SSB noise figure  
Includes external matching network  
6.5  
dB  
Input 1-dB compression point  
Input IP3  
−31  
−21  
dBm  
dBm  
LNA/mixer, 868−870 MHz  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
869  
19  
MAX  
UNIT  
MHz  
dB  
Frequency range  
868  
870  
Conversion gain  
SSB noise figure  
Includes external matching network  
6.5  
dB  
Input 1-dB compression point  
Input IP3  
−31  
−20  
dBm  
dBm  
LNA/mixer, 902−928 MHz  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
915  
18  
MAX  
UNIT  
MHz  
dB  
Frequency range  
902  
928  
Conversion gain  
SSB noise figure  
Includes external matching network  
6.5  
dB  
Input 1-dB compression point  
Input IP3  
−31  
−19  
dBm  
dBm  
IF/limiter amplifier  
PARAMETER  
Frequency  
TEST CONDITIONS  
MIN  
TYP  
10.7  
86  
MAX  
UNIT  
MHz  
dB  
Voltage gain  
Noise figure  
IF frequency = 10.7 MHz  
4
dB  
VCO/output divider  
PARAMETER  
TEST CONDITIONS  
Low-side injection, A<1:0> = 11  
High-side injection, A<1:0> = 10  
High-side injection, A<1:0> = 01  
Low-side injection, A<1:0> = 01  
Frequency offset = 50 kHz  
MIN  
304  
430  
868  
902  
TYP  
MAX  
316  
450  
870  
928  
UNIT  
MHz  
MHz  
MHz  
MHz  
Frequency range: 315-MHz band  
Frequency range: 433-MHz band  
Frequency range: 868-MHz band  
Frequency range: 915-MHz band  
315  
433  
869  
915  
−
7
7  
−
9
0  
Closed loop phase noise  
Tuning voltage  
dBc/Hz  
V
Frequency offset = 200 kHz  
VCC at  
terminal 10  
0.1  
8
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

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ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
ac electrical characteristics, V  
RSSI  
= 2.7
V
, T
 
=
2
5
°
C (continued)  
A
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
70  
2
MAX  
UNIT  
dB  
Dynamic range  
Rise time  
Slope  
R
R
= 100 k
Ω,
C =
 
10 pF  
4
µ
s  
L
L
L
20  
mV/dB  
RSSI output current  
= 100 k
Ω,
C =
 
10 pF  
30  
µ
A  
L
impedances and loads  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
LNA_IN  
See Figure 4  
1400  
{
MIX_OUT  
Ω
Ω
{
IF_IN  
Differential  
2600  
See  
Figure 10  
PA_OUT  
†
Does not include external matching network.  
transmitter (XTAL, PLL, VCO, and PA), 315-MHz band  
PARAMETER  
TEST CONDITIONS  
A<1:0> = 11  
0-dB attenuation  
MIN  
TYP  
315  
8
MAX  
UNIT  
TX frequency range  
304  
316  
MHz  
10-dB attenuation  
20-dB attenuation  
Disabled, B<3> =
 
0  
−2  
†
−12  
−
8
0  
−80  
−25  
−30  
ꢀ
32  
75  
Output power  
dBm  
‡
Off  
Second harmonic  
Third harmonic  
dBc  
dBc  
kHz  
dB  
§
Frequency deviation  
FSK  
Power ON-OFF ratio  
OOK, 0-dB mode  
FSK  
64  
Maximum data rate (NRZ)  
kbit/s  
OOK  
32  
†
‡
§
Matched to 50
Ω
using external matching network.  
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.  
Dependent upon external circuitry.  
9
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢌ
ꢇ
ꢈ
ꢉ
ꢊ
ꢋ
ꢍ
ꢎꢏ  
ꢈ
ꢐ
ꢑ
ꢒ
ꢋꢀ  
ꢈ
ꢓ
ꢔ
ꢉ
ꢕ
ꢁ
ꢂ
ꢀ
ꢁ
ꢔ
ꢉ
ꢇꢎ  
ꢌ
ꢈ
ꢖ
ꢌ
ꢁ
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
ac electrical characteristics, V  
= 2.7
V
, T
 
=
2
5
°
C (continued)  
A
CC  
transmitter (XTAL, PLL, VCO, and PA), 433-MHz band  
PARAMETER  
TEST CONDITIONS  
A<1:0> = 10  
0-dB attenuation  
MIN  
TYP  
433  
8
MAX  
UNIT  
TX frequency range  
430  
450  
MHz  
10-dB attenuation  
20-dB attenuation  
Disabled, B<3> =
 
0  
−2  
†
−12  
−
8
0  
−80  
−25  
−30  
ꢀ
32  
75  
Output power  
dBm  
‡
Off  
Second harmonic  
Third harmonic  
dBc  
dBc  
kHz  
dB  
§
Frequency deviation  
FSK  
Power ON-OFF ratio  
OOK, 0-dB mode  
FSK  
64  
Maximum data rate (NRZ)  
kbit/s  
OOK  
32  
†
‡
§
Matched to 50
Ω
using external matching network.  
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.  
Dependent upon external circuitry.  
transmitter (XTAL, PLL, VCO, and PA), 868-MHz band  
PARAMETER  
TEST CONDITIONS  
A<1:0> = 11  
0-dB attenuation  
MIN  
TYP  
869  
8
MAX  
UNIT  
TX frequency range  
868  
870  
MHz  
10-dB attenuation  
20-dB attenuation  
Disabled, B<3> =
 
0  
−2  
†
−12  
−
8
0  
−80  
−25  
−30  
ꢀ
32  
75  
Output power  
dBm  
‡
Off  
Second harmonic  
Third harmonic  
dBc  
dBc  
kHz  
dB  
§
Frequency deviation  
FSK  
Power ON-OFF ratio  
OOK, 0-dB mode  
FSK  
64  
Maximum data rate (NRZ)  
kbit/s  
OOK  
32  
†
‡
§
Matched to 50
Ω
using external matching network.  
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.  
Dependent upon external circuitry.  
10  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀꢁ ꢂꢃ
 
ꢄꢅ ꢆ  
ꢇꢈ ꢉꢊ
 
ꢋ ꢌꢍꢎꢏꢈ
 
ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
ac electrical characteristics, V  
= 2.7
V
, T
 
=
2
5
°
C (continued)  
A
CC  
transmitter (XTAL, PLL, VCO, and PA), 915-MHz band  
PARAMETER  
TEST CONDITIONS  
A<1:0> = 11  
0-dB attenuation  
MIN  
TYP  
915  
8
MAX  
UNIT  
TX frequency range  
902  
928  
MHz  
10-dB attenuation  
20-dB attenuation  
Disabled, B<3> =
 
0  
−2  
†
−12  
−
8
0  
−80  
−25  
−30  
32  
Output power  
dBm  
‡
Off  
Second harmonic  
Third harmonic  
dBc  
dBc  
kHz  
dB  
§
Frequency deviation  
FSK  
Power ON-OFF ratio  
OOK, 0-dB mode  
FSK  
75  
64  
Maximum data rate (NRZ)  
kbit/s  
OOK  
32  
†
‡
§
Matched to 50
Ω
using external matching network.  
Not selectable with PA attenuation bits A
<
7:6
>
, B
<
7:6
>
, or with B<3>. Measured while the TRF6903 device is in RX mode.  
Dependent upon external circuitry.  
XTAL  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
TYP  
MAX  
UNIT  
Frequency range  
9.5  
20  
MHz  
brownout detector  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
V
Voltage threshold, V  
Voltage steps (
∆
V)  
Number of steps  
Output level  
Set by B<2:1>  
2.2  
2.8  
det  
200  
4
mV  
Connected to typical input port of microcontroller  
CMOS  
11  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
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ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
timing data for serial interface  
PARAMETER  
Clock frequency  
MIN  
TYP  
MAX  
UNIT  
MHz  
ns  
f
t
t
t
t
t
t
t
20  
(CLOCK)  
w(CLKHI)  
w(CLKLO)  
su(D)  
Clock high-time pulse width, clock high  
Clock low-time pulse width, clock low  
20  
20  
0
ns  
Setup time, data valid before CLOCK
↑  
Hold time, data valid after CLOCK
↑  
ns  
10  
20  
20  
20  
ns  
h(D)  
Delay time of CLOCK low before STROBE high  
STROBE high-time pulse width, STROBE high  
STROBE low-time pulse width, STROBE low  
ns  
d(CLKLO)  
w(STROBEHI)  
w(STROBELO)  
ns  
ns  
Data  
Change  
Data  
Valid  
−V  
H
MSB  
MSB  
LSB  
DATA  
−V  
L
Start of  
t
t
t
w(CLKHI)  
Next Word  
su(D)  
h(D)  
t
d(CLKLO)  
t
−V  
CLOCK  
H
−V  
L
w(STROBEHI)  
t
w(CLKLO)  
t
w(STROBELOW)  
t
r
t
STROBE  
f
−V  
H
Clock Disabled  
−V  
L
Shift in Data  
Clock Enabled  
Note: Most significant bit (MSB) clocked in first to the synthesizer.  
Store Data  
Strobe Enabled  
Figure 2. Timing Data for Serial Interface  
12  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

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ꢄꢅ ꢆ  
ꢇꢈ ꢉꢊ
 
ꢋ ꢌꢍꢎꢏꢈ
 
ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
timing data for DCLK, TX_DATA, RX_FLAG, and RX_DATA  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
t
t
t
t
t
t
Delay time, rising edge of DCLK to transition of RX_DATA  
3
ns  
d(DG)  
{
Setup time, RX_DATA valid before DCLK
↑  
Hold time, RX_DATA valid after DCLK
↑  
Delay time, rising edge of RX_FLAG before DCLK
↑  
Setup time, TX_DATA valid before DCLK
↑  
Hold time, TX_DATA valid after DCLK
↑  
0.4/f  
su(r)  
c
{
0.4/f  
h(r)  
c
2
ns  
ns  
ns  
d(FK)  
su(TX)  
100  
100  
h(TX)  
†
After clock recovered  
Receive Deglitch Mode  
RX_DATA  
Output  
t
d(DG)  
DCLK  
Output  
1
T
DGK  
=
f
DG  
t
Receive Clock Recovery Mode or Self Train Mode  
su(r)  
RX_DATA  
Output  
t
h(r)  
DCLK  
Output  
T
CRK  
t
d(FK)  
RX_FLAG  
Output  
(Valid Only in  
Self Train Mode)  
t
= T  
CRK  
RXF  
0.87  
1.13  
≤
T  
CRK  
≤
f
f
c
c
NOTE: RX_DATA
 
is latched at the falling edge of DCLK.  
Transmit  
t
t
h(TX)  
su(TX)  
TX_DATA  
Input  
DCLK  
Output  
1
T
SK  
=
f
c
NOTE: TX_DATA
 
is latched at the rising edge of DCLK.  
Figure 3. Timing Data for DCLK, TX_DATA, RX_FLAG, and RX_DATA  
It can be seen from the timing diagram that in the clock recovery or self train mode, the data transitions  
(high-to-low or low-to-high) on the RXDATA pin are timed to coincide with the falling edge of DCLK. Any  
microcontroller using the TRF6903 can then latch RXDATA on the rising edge of DCLK. For more details, see  
the
data clock
section.  
13  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢇ ꢈꢉ
 
ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
timing data for DCLK, TX_DATA, RX_FLAG, and RX_DATA (continued)  
In high data rate systems (> 38K bps), designers need to be aware of the latency between the rising edge of  
DCLK and the time the RXDATA logic value is sampled by the microcontroller. This latency needs to be less  
than half the RXDATA pulse width to prevent bit errors.  
If transmit capture mode is selected (by setting bit 13 in word E), the data transitions (high-to-low or low-to-high)  
on the TXDATA pin are timed to coincide with the falling edge of DCLK. Any microcontroller using the TRF6903  
can then latch TXDATA on the rising edge of DCLK. For more details, see the
data clock
section.  
low-noise amplifier (LNA)/RF mixer  
The LNA has differential inputs. The off-chip input matching network has the dual task of matching a 50-
Ω  
connector (or antenna, switch, filter, etc.) to the differential inputs and providing a 180-degree phase shift  
between the inputs at terminals 1 and 2. The differential input impedance of the LNA is approximately 500
Ω  
in parallel with 0.7 p
F
.
T
he predicted noise figure of the LNA and input matching circuit is 2.5 dB. The cascaded  
noise figure for the LNA/mixer is listed in the specifications.  
The mixer offers good linearity (high IP3). An external matching network is required to transform the output  
impedance of the mixer (1.4 k
Ω
) to the input impedance of the IF filter (typically 330
Ω
).  
↑
1  
U
CH1 S11  
1
0.5  
2
5
CAL  
OFS  
0
0.2  
0.5  
1
2
5
10  
CPL  
−5  
FIL  
1k  
−0.5  
−2  
−1  
START 300
 
MHz  
STOP 1000
 
MHz  
Figure 4. Typical LNA Input Impedance (S11) at Device Terminals LNA_IN1,2  
IF amplifier/limiter  
The IF amplifier has differential inputs to its first stage. The limiting amplifier provides 68 dB of gain. An external  
impedance matching network is required between the IF filter output at terminal 47 and the IF amplifier inputs  
at terminals 43 and 44.  
RSSI  
The received signal strength indicator (RSSI) voltage at terminal 41 is proportional to the log of the  
down-converted RF signal at the IF limiting amplifier input. The RSSI circuit is temperature compensated. It is  
useful for detecting interfering signals, transceiver handshaking, and RF channel selection. In some  
applications, the RSSI circuitry alone can be used as a demodulator for amplitude-shift keying (ASK) or on-off  
keying (OOK) modulation with an output at the RSSI_OUT terminal. In OOK mode, the received signal is also  
fed from the RSSI circuitry to the input of the post-detection LPF amplifier. In this mode, received data is output  
at the RX_DATA terminal according to the RXM field.  
14  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀꢁ ꢂꢃ
 
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ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
demodulator  
The quadrature demodulator decodes digital frequency shift keying (FSK) modulation. An external ceramic  
discriminator or an equivalent discrete circuit is required at terminal 35. The demodulator is optimized for use  
with a ceramic discriminator. Thus, the use of a packaged ceramic discriminator is recommended for best  
performance. Internal resistors can be programmed with D<14:12> to tune the demodulator center frequency.  
The recommended default setting for the demodulator tuning bits is D<14:12> = 110. The resonant frequency  
of the discrete-component discriminator can be calculated from the inductor and capacitor values used in the  
circuit. A parallel resistor may be added to reduce the quality factor (Q) of the tank circuit, depending on the  
application.  
When OOK modulation is selected, the received signal from the RSSI circuitry is connected directly to the  
post-detection LPF amplifier, therefore bypassing the quadrature demodulator.  
1
ƒ

res  

+
Ǹ
2
p
LC  
External Tank  
35  
L
R
C
Figure 5. Optional External Discrete Demodulator Tank  
post-detection amplifier/low-pass filter  
The post-detection amplifier operates as a low-pass transimpedance amplifier. The external low-pass filter  
circuit must be optimized for the data rate. The 3-dB corner frequency of the low-pass filter should be greater  
than twice the data rate. Various low-pass filter designs use two to five components and may be first- or  
second-order designs. Simple 2-element filter component values and 3-dB bandwidths are contained in
T
a
ble 1.  
1
f
+
3dB  
2
p
R2(C2
)
 
C1)  
R2  
C2  
External Low-Pass Filter  
37  
36  
C1  
2 pF  
Internal Low-Pass Amplifier  
Figure 6. Post-Detection Amplifier/Low-Pass Filter  
15  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢇ ꢈꢉ
 
ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
post-detection amplifier/low-pass filter (continued)  
Table 1. Various Post-Detection Amplifier/Low-Pass Filter  
3-dB Bandwidth and Corresponding Component Values for FSK Operation  
f
(kHz)  
10  
220  
68  
20  
220  
33  
30  
220  
22  
60  
220  
10  
3dB  
R2 (k
Ω
)  
C2 (pF)  
NOTE: For
 
OOK operation, it is recommended that R2 be set to 27 k
Ω
and C2 is not placed.  
data slicer and bit synchronizer  
The data slicer is a comparator circuit for received digital (FSK and OOK) data. The data slicer output voltage  
depends on the difference between the received signal and a reference voltage (at the sample-and-hold (S&H)  
capacitor) used as a decision threshold. During the learn mode, the S&H capacitor connected to terminal 34  
is charged up to the average dc voltage of a training sequence of alternating ones and zeroes; this establishes  
the reference voltage to be used as a decision level before a sequence of actual data is received in the hold  
mode. During long data transmissions, more training sequences may be necessary to recharge the S&H  
capacitor.  
If the modulation scheme is dc-free (Manchester coding) or constant-dc, the TRF6903 may be operated  
continuously in the learn mode and no training sequence is necessary before the transmission of a data string.  
However, the S&H capacitor voltage may be incorrect during power up or after long periods of inactivity (no data  
transmission); a learning sequence before each data transmission is recommended.  
The comparator is a CMOS circuit that does not load the S&H capacitor. Leaving the transmission gate  
(LEARN/HOLD switch) open (in hold mode) during periods of inactivity, such as during standby, may be useful  
in maintaining the capacitor reference voltage. However, the reference voltage gradually discharges over time  
due to leakage current.  
The time constant for charging the S&H capacitor is determined by its capacitance and an internal 51-k
Ω  
resistor. A slow data rate requires a larger S&H capacitor (longer time constant). The value of the S&H capacitor,  
Csh, can be calculated with the following equation:  
Number of training Bits  
5
 
 
51k
 
 
Data Rate (Hz)  
S & H Cap
+
 
; Farad  
Where the data rate in Hz is the fundamental frequency (in Hz) of the base band waveform.  
Low-Pass Amplifier  
LPF Out  
33  
Bit Synchronizer  
and  
Data Clock  
27  
23  
Comparator  
51 k
Ω  
39  
34  
{
Csh  
LEARN/HOLD  
{
External Sample-and-Hold Capacitor  
Figure 7. Data Slicer and Bit Synchronizer  
The received data and data clock output modes are determined by field RXM according to
T
a
ble 3. When RXM,  
E<15:14> is set to 00, the raw data from the data slicer is output at terminal 33, RX_DATA. No synchronization  
or data recovery is performed and the receiver can be used in an asynchronous mode. When RXM, E<15:14>,  
is set to 01, received data is first passed through a deglitching filter. These modes are useful for the reception  
of data whose baud rate is nonstandard.  
16  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
data slicer and bit synchronizer (continued)  
When RXM is set to enable recovered data, RXM E<15:14> = 10 or 11, the integrated bit synchronizer  
determines the preprogrammed data rate as determined by the crystal frequency and the values of D1, D2, and  
D3, and performs data recovery. Glitch-free, recovered data is then output at terminal 33, RX_DATA, and the  
corresponding data clock is output at
 
terminal 27, DCLK.  
The preprogrammed bit rate can be calculated based on the following equation:  
F
crystal frequency (kHz)  
x
Bit rate (kbps)
+
 
+
+
 
f (kHz)  
c
D1
 
 
D2
 
 
D3  
D1
 
 
D2
 
 
D3  
where  
D1 = 1, 5, 6, or 8  
D2 = 1, 2, 4, 8, 16, 32, 64, or 128  
D3 = 15 or 16  
data clock  
When enabled, RXM = 10 or 11, the data clock circuitry provides as an output at terminal 27, DCLK, a data clock  
based on a programmable bit rate. The bit rate is programmable via variables D1, D2, and D3 and is always  
relative to the master clock (XTAL) frequency, F
 
.
T
a
ble 2 shows common bit rates (kbps) vs selected crystal  
x
frequencies (MHz) and the respective settings of D1, D2, and D3.  
Table 2. Common Bit Rates, Corresponding Crystal Frequencies, and Values of D1, D2, and D3  
D1, D2, AND D3 MULTIPLIERS FOR COMMON CRYSTAL VALUES (CRYSTAL FREQUENCIES IN MHZ)  
BIT RATE  
(kbps)  
9.8304  
12.288  
14.7456  
15.72864  
8x128x15  
8x64x15  
8x32x15  
8x16x15  
8x8x15  
16.384  
19.6608  
0.6  
0.9  
8x128x16  
8x128x16  
1
6x128x16  
5x128x16  
6x64x16  
5x64x16  
6x32x16  
5x32x16  
6x16x16  
5x16x16  
6x8x16  
8x128x16  
1.024  
1.2  
5x128x15  
8x64x16  
6x128x16  
8x64x16  
8x128x16  
1.8  
2
8x64x16  
8x32x16  
8x16x16  
8x8x16  
8x4x16  
8x2x16  
2.048  
2.4  
5x64x15  
8x32x16  
5x128x15  
8x64x16  
6x64x16  
8x32x16  
3.6  
4
4.096  
4.8  
5x32x15  
8x16x16  
5x64x15  
8x32x16  
6x32x16  
8x16x16  
7.2  
8
8.192  
9.6  
5x16x15  
8x8x16  
5x32x15  
8x16x16  
6x16x16  
8x8x16  
14.4  
16  
16.384  
19.2  
28.8  
32  
5x8x15  
8x4x16  
5x16x15  
8x8x16  
5x8x16  
6x8x16  
8x4x16  
6x4x16  
32.768  
38.4  
57.6  
64  
5x4x15  
8x2x16  
8x4x15  
5x8x15  
8x4x16  
5x4x16  
6×4 x16  
8x2x16  
6x2x16  
65.536  
5x2x15  
8x2x15  
5x4x15  
17  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
data clock (continued)  
Table 2. Common Bit Rates, Corresponding Crystal Frequencies, and Values of  
D1, D2, and D3 (continued)  
D1, D2, AND D3 MULTIPLIERS FOR COMMON CRYSTAL VALUES (CRYSTAL FREQUENCIES IN MHZ)  
BIT RATE  
(kbps)  
9.8304  
12.288  
14.7456  
6x2x16  
8x1x16  
15.72864  
16.384  
19.6608  
76.8  
115.2  
128  
8x1x16  
5x2x16  
8x2x16  
6x1x16  
8x1x16  
There are several receive modes, from raw slicer output to clock recovery and training sequence recognition.  
The receive logic is controlled by the RXM, TWO, and TCOUNT fields. The RXM, E<15:14>, field determines  
the receive mode as indicated in
T
a
ble 3. These modes are described in more detail below.  
Table 3. Clock Recovery and Receive Data Modes Selected by RXM  
RXM  
RECEIVE MODE  
RX_DATA  
DCLK  
RX_FLAG  
00  
Raw data  
Data direct from data
 
Inactive; held low  
slicer  
Inactive; held low  
01  
10  
Deglitch  
Deglitched data  
Active; clock  
synchronous to  
deglitched data  
Inactive; held low  
Inactive; held low  
Clock recovery  
Deglitched data;  
synchronous to  
bit-rate clock at  
DCLK  
Active; synchronous  
bit-rate clock  
11  
Self train  
Deglitched data;  
synchronous to  
bit-rate clock at  
DCLK  
Active; synchronous  
bit-rate clock  
Active; set high at  
first received bit that  
is not part of a  
predetermined  
training sequence  
In
Raw Data
mode, the data slicer output is fed directly to the RX_DATA terminal, and the DCLK and RX_FLAG  
terminals are held low.  
In
Deglitch
mode, the data slicer output is passed through the internal deglitch filter. This filter samples the slicer  
output at a rate f
 
, where  
DG  
F
x
D1
 
 
D2  
f
+
DG  
The filter output is high if five or more of the last seven samples were high, and low if two or less of the last seven  
samples were high. Otherwise, the filter holds its previous value. The deglitched data is applied to the RX_DATA  
terminal, and the over-sampled deglitch filter clock is passed on to the DCLK terminal. Data will appear on the  
RX_DATA terminal a few gate delays after the rising edge of DCLK. The RX_FLAG terminal is held low.  
In
Clock Recovery
mode, the edges of the deglitched data are used to synchronize a bit-rate clock to the data.  
As long as the consecutive number of ones or zeros in the data stream, N
 
, meets the condition:  
CB  
250000  
D
were
∆
is the error between the transmit bit rate and the receiver bit-rate clock in ppm.  
N
t
B
CB  
B
The output data is synchronous with the bit-rate clock. The deglitched data is routed to the RX_DATA terminal  
and the synchronized bit-rate clock appears at DCLK. The RX_FLAG terminal is held low. The data transition  
is timed to coincide with the falling edge of DCLK, so that the external microcontroller using the TRF6903 can  
latch RX_DATA on the rising edge of DCLK with plenty of setup and hold margin. If no data edges have been  
observed since the last reset, then DCLK is held low until an edge is seen.  
18  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
data clock (continued)  
I
n
Self Train
mode, the TRF6903 receiver not only performs clock recovery, but also looks for the end of a training  
sequence. The TWO, E<12>, field determines the pattern of the training sequence. If TWO is low, the training  
sequence is assumed to be alternating ones and zeros; if TWO is high, the training sequence is assumed to  
be alternating pairs of ones and zeros. RX_DATA and DCLK output are the same as in
Clock Recovery
mode.  
However, if a minimum number of training bits have been observed, then the RX_FLAG terminal is asserted  
high for one clock period (after which it returns low) at the first bit that is not part of the training sequence. The  
timing of RX_FLAG is a few gate delays after the rising edge of DCLK. The minimum number of training bits  
is four times the unsigned binary value of TCOUN
T
,
E
<11:7>, plus two if TWO = 0 or plus three if TWO = 1,  
according to the equation:  
TB  
= (4 x TCOUNT) + TWO + 2  
min  
The clock recovery and training sequence recognition circuits are all designed to reset/clear internally with no  
user action required.  
When active, DCLK is synchronized to the received data. The rising edge of the data clock is intended to be  
located at the middle of the received recovered data bit, thus enhancing the synchronization ability of the  
microcontroller and reducing the need for extensive signal processing in the microcontroller.  
main divider  
The main divider is composed of a 5-bit A-counter and a 9-bit B-counter and a prescaler. The A-counter controls  
the divider ratio of the prescaler, which divides the VCO signal by either 33 or 32. The prescaler divides by 33  
until the A-counter reaches its terminal count and then divides by 32 until the B-counter reaches terminal count,  
whereupon both counters reset and the cycle repeats. The total divide-by-N operation is related to the 32/33  
prescaler by:  
N
= 33
x
A + 32
x
(B – A)  
TOTAL  
where 0
≤
A
≤
31 and 31
≤
B
≤
511 or,
 
N  
= A + 32B  
TOTAL  
Thus, the N-divider has a range of 992
≤
N  
≤
16383  
TOTAL  
PLL  
The phase-locked loop is the radio frequency synthesizer for the TRF6903. It is used to generate the transmit  
signal and as the local oscillator for the receive mixer. The signal (F
 
) from a reference crystal oscillator (XO)  
X
is divided by an integer factor R down to F
 
. The minimum frequency resolution, and thus, the minimum channel  
R
spacing, is F
 
.  
R
F
= F
 
÷
R where 1
≤
R
≤
256  
X
R
The phase-locked loop is an integer-N design. The voltage-controlled oscillator (VCO) signal is divided by an  
integer factor N to get a frequency at the phase detector input.  
F
= F  
÷
N  
VCO  
PD  
The phase detector compares the divided VCO signal to the divided crystal frequency and implements an error  
signal from two charge pumps. The error signal corrects the VCO output to the desired frequency.  
As is in any integer-N PLLs, the VCO output has spurs at integer multiples of the reference frequency (nF
 
).  
R
In applications requiring contiguous frequency channels, the reference frequency is often chosen to be equal  
to the channel spacing, thus, channel spacing = F
 
= F
 
÷
R. When the PLL is locked, the LOCK_DETECT  
R
X
terminal is high.  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PLL (continued)  
With the addition of an output divider for multiband operation, the actual output frequency, F
 
, is given by:  
out  
F
F
VCO  
P
A
)
 
32B  
X
N
P
N
P
F
+
+
 
+
 
F  
 
+
 
 
F  
out  
where F
 
= F  
R
R
R
P
under locked conditions. The actual minimum channel spacing is:  
R
PD  
F
F
B
 
R  
R
X
+
P
P
where P = 1, 2, 3 and is set by A<1:0>.  
oscillator circuit and reference divider  
The reference divider reduces the frequency of the external crystal (F
 
) by an 8-bit programmable integer  
X
divisor, R, to an internal reference frequency (F
 
) used for the phase-locked loop. See Figure 8. The choice of  
R
internal reference frequency also has implications for lock time, maximum data rate, noise floor, and loop-filter  
design. The crystal frequency can be tuned using the F word to control internal trimming capacitors, which are  
placed in parallel with the crystal. These offset a small frequency error in the crystal. In an FSK application, an  
additional capacitor is placed in parallel (through terminal 31) with the external capacitor that is connected in  
series with the crystal, thus, changing the load capacitance as the transmit data switch (TX_DATA, terminal 32)  
is toggled. The change in load capacitance pulls the crystal off-frequency by the total frequency deviation.  
Hence, the 2-FSK frequency, set by the level of TX_DATA and the external capacitor, can be represented as  
follows:  
ƒ
+
 
TX_DATA Low (XTAL switch closed) and
ƒ  
+
 
TX_DATA High (XTAL switch open)  
out2  
out1  
Note that the frequencies
ƒ  
and
ƒ  
are centered about the frequency
ƒ  
= (
ƒ  
+
ƒ  
)/2. When  
out1  
out2  
center  
out1  
out2  
transmitting FSK,
ƒ  
is considered to be the effective carrier frequency and any receiver local oscillator (LO)  
center  
should be set to the same
ƒ  
frequency the
 
receiver’s IF frequency (
ƒ
) for proper reception and  
center  
IF  
demodulation.  
For the case of high-side injection, the receiver LO would be set to
ƒ
=
ƒ  
+
ƒ
. Using high-side injection,  
IF  
LO  
center  
the received data at terminal 33, RX_DATA, would be inverted from the transmitted data applied at terminal 32,  
TX_DATA. Conversely, for low-side injection, the receiver LO would be set to
ƒ
=
ƒ  
−
ƒ
. Using low-side  
LO  
center  
IF  
injection, the received data would be the same as the transmitted data. The data polarity invert bit PI, A<4>,  
can be used to invert the data at terminal 33, RX_DATA, when high-side injection is being used.  
In addition, when the TRF6903 is placed in receive mode, it is recommended that the D<19> bit be kept high  
to keep the XTAL switch closed. In this manner, the actual LO frequency injected into the mixer is
ƒ  
If D<19> is set low, the the receiver LO would be offset, resulting in poor receiver sensitivity.  
=
ƒ  
.
out1  
LO  
31  
V
CC  
÷
R  
Crystal  
Oscillator  
Circuit  
F
F
30  
R
Reference  
Divider  
2…255  
Phase-  
Frequency  
Detector  
External  
Loop  
Filter  
15  
13  
F
x
PD  
External Crystal  
VCO  
Charge Pumps  
÷
N  
External  
Cap for  
FSK  
Main Divider  
A, B Counters  
32/33  
Output  
Divider  
Fvco  
P = 1, 2, 3  
992
≤
N
≤
16383  
F
out  
Figure 8. TRF6903 PLL and Output Divider  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
phase detector and charge pumps  
The phase detector is a phase-frequency design. The phase-frequency detector gain is given by:  
K =
 
I /2
π  
P
(CP)  
where, I  
is the peak charge pump current. The peak charge pump current is programmable with A<3:2> in  
(CP)  
three steps: 250
µ
A, 500
µ
A, and 1000
µ
A.  
loop filter  
The loop filter must be carefully chosen for proper operation of the TRF6903. The loop filter as shown in Figure 9  
is typically a second- or third-order passive design and in FSK operation should have a bandwidth wide enough  
to allow the PLL to relock quickly as the external crystal frequency is pulled off-center during modulation. The  
loop filter should also be wider than the data modulation rate. These requirements should be balanced with  
making the loop narrow enough in consideration of the reference frequency. In OOK the VCO frequency is not  
changed during data modulation, so the filter bandwidth may be narrower than the modulation bandwidth. Filters  
can be calculated using standard formulas in reference literature. Some third-order filter examples are shown  
in
T
a
ble 4.  
1
1
)
 
sC2R2  
s C1
)
 
C2
)
 
sC1C2R2  
C3R3  
1
F(s)
+
 
 
(
)
s
)
 
C3R3  
R3  
lcp  
15  
Vtune  
13  
VCO_TUNE  
VCO_VCC  
CP_OUT  
C1  
C2  
R2  
C3  
External-Loop Filter  
Figure 9. Third-Order Loop Filter and Transfer Function  
Table 4. Loop Filter Component Values For Various Data Rates at a Reference Frequency of 409.6 kHz,  
0.5-mA Charge Pump Current  
Manchester coding  
NRZ coding  
1.024  
2.048  
1.024  
47  
2.048  
4.096  
2.048  
12  
4.096  
8.192  
4.096  
2.7  
8.192  
16.384  
8.192  
0.68  
27  
16.384  
32.768  
16.384  
0.18  
6.8  
19.2  
38.4  
19.2  
0.12  
5.1  
32.768  
65.536  
32.768  
0.043  
1.8  
65.536  
131.072  
65.536  
0.01  
Bit rate − kbps  
Data rate − kHz  
Fundamental freq of BB  
C1, nF  
C2, nF  
1800  
27  
430  
100  
1.5  
0.47  
Loop filter component  
(selected to nearest  
standard value)  
C3, nF  
R2, k
Ω  
R3, k
Ω  
6.8  
0.39  
3
0.1  
0.075  
6.8  
0.027  
12  
0.0068  
24  
0.39  
0.75  
1.28  
0.75  
1.5  
1.5  
5.7  
3
5.7  
12  
15  
22  
47  
−3−dB bandwidth, kHz (approximate)  
2.56  
5.12  
10.24  
20.48  
24  
40.96  
81.92  
VCO  
The voltage-controlled oscillator (VCO) produces an RF output signal with a frequency that is dependent upon  
the dc-tuning voltage at terminal 13. The tank circuit is passive and has integrated varactor diodes and  
inductors. The open-loop VCO gain is approximately 100 MHz/V.  
A <1:0> is used to set the output divider ratio for operation within the 315-MHz, 433-MHz, 868-MHz, or 915-MHz  
bands.  
When the STDBY terminal is high, the reference, PLL, VCO, and dividers are powered up. When STDBY is low,  
these blocks are powered down.  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
power amplifier  
The power amplifier has three programmable attenuation states as determined by A<7:6> and B<7:6>: full  
power (0-dB attenuation), 10-dB attenuation, and 20-dB attenuation. This adjustment feature allows the user  
to fine-tune the device for optimal output power. The power amplifier can be enabled/disabled during transmit  
by bit B<3>, PARXED. During receive, the transmit power amplifier is powered down but the VCO and PLL are  
still operating. During ASK or OOK operation, the TX_DATA signal turns the power amplifier on and off according  
to the transmit data incident at terminal 32.  
↑
1  
U
CH1 S22  
1
0.5  
2
5
CAL  
OFS  
0
0.2  
0.5  
1
2
5
10  
CPL  
−5  
FIL  
1k  
−0.5  
−2  
−1  
START 300
 
MHz  
STOP 1000
 
MHz  
Figure 10. Typical PA Output Impedance (S22) at Device Terminal PA_OUT  
brownout detector  
The brownout detector provides an output voltage to indicate a low supply voltage. This may be used to signal  
the need to change transmit power to conserve battery life, or for system power down. The brownout detector  
threshold is set with the B word. Four different thresholds are available.  
serial control interface  
The TRF6903 is controlled through a serial interface; there are five 24-bit control words (A, B, C, D, E) which  
set the device state. The A and B words are almost identical, and provide configuration settings for two modes,  
designated 0 and 1, which are commonly used to configure the transmit and receive states. The transmit and  
receive states can then be rapidly selected using MODE (terminal 21). The C word sets the reference dividers,  
the power amplifier bias, and contains various reset bits. The E word contains the bit-rate select, data clock  
control bits, and the power amplifier bias control registers. The D word is used to trim the external crystal  
frequency and tune the demodulator.  
The register address is the composite of bits 23, 22, 1, and 0 of the 24 bits written to the serial interface. For  
some words, certain bits of the address are don’t cares and are noted as XX. This flexible addressing scheme  
allows backward compatibility with the TRF6901, and because of this flexibility, the data length of each register  
varies from 15 bits to 22 bits.  
Normal (write) operation of the serial interface is to clock in 24 bits through the CLOCK and DATA terminals.  
DATA values are clocked into the 24-bit serial interface shift register on the rising edge of CLOCK. The 24-bit  
value is decoded and written into the appropriate data register on the rising edge of STROBE.  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
register description  
ꢀ ꢁ
 
ꢀ ꢀ
 
ꢀ ꢂ
 
ꢀ ꢃ  
ꢂ ꢄ  
ꢂ ꢅ  
ꢂ ꢆ  
ꢂ ꢇ  
ꢂ ꢈ  
ꢂꢉ  
ꢂꢁ  
ꢂꢀ  
ꢂꢂ  
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢈ
ꢉ
ꢁ
ꢀ
ꢂ
ꢃ
ꢊ
ꢋ
ꢌ
ꢍ
ꢎ
ꢍ
ꢍ
ꢌ
ꢏ
ꢐ
ꢐ
ꢎ
ꢍ
ꢍ
ꢌ
ꢏ
ꢐ
ꢐ
ꢑ ꢒ
 
ꢓꢔ ꢎꢕꢖ
 
ꢓꢗꢓ ꢍ
 
ꢏ ꢌ
 
ꢘꢋ ꢏ ꢙꢙꢓ
 
ꢚꢓ ꢏ
 
ꢔ ꢛ  
ꢜꢑ ꢋ
 
ꢍꢏ ꢃ
 
ꢝ  
ꢠꢡ ꢢ  
ꢣ ꢡꢃ  
ꢎ
ꢞ
ꢃ
ꢃ
ꢃ
ꢂ
ꢑ ꢒꢓ
 
ꢔ ꢞ
 
ꢕꢖꢓ ꢗꢓ ꢍꢏ
 
ꢌ ꢘ
 
ꢋꢏꢙꢙ ꢓ
 
ꢚꢓꢏ ꢔꢛ
 
ꢜꢑ ꢋꢍ
 
ꢏ ꢃꢝ  
ꢑ ꢒꢓ
 
ꢔ ꢞ
 
ꢕꢖꢓ ꢗꢓ ꢍꢏ
 
ꢌ ꢘ
 
ꢋꢏꢙꢙ ꢓ
 
ꢚꢓꢏ ꢔꢛ
 
ꢜꢑ ꢋꢍ
 
ꢏ ꢂꢝ  
ꢟ ꢎ ꢃ  
ꢟ ꢎ ꢂ  
ꢟ
ꢤ
ꢘ
ꢟ
ꢎ
ꢚ
ꢚ
ꢥ
ꢞꢦ ꢖ  
ꢑ ꢒ
 
ꢓꢔ ꢎꢕꢖ
 
ꢓꢗꢓ ꢍ
 
ꢏ ꢌ
 
ꢘꢋ ꢏ ꢙꢙꢓ
 
ꢚꢓ ꢏ
 
ꢔ ꢛ  
ꢜꢑ ꢋ
 
ꢍꢏ ꢂ
 
ꢝ  
ꢠꢡ ꢢ
 
ꢧ ꢨꢩ
 
ꢢ  
ꢣ ꢡꢂ
 
ꢪ ꢪ ꢩ  
ꢖꢏ ꢛ
 
ꢏ ꢚꢛ
 
ꢋꢌ ꢖꢏ
 
ꢛ ꢥ  
ꢠ ꢬꢌ
 
ꢏ ꢐꢬꢋ ꢭ
 
ꢍ ꢫꢔ
 
ꢒ ꢮ ꢭꢏ  
ꢟ
ꢎ
ꢣ
ꢡ
ꢫ
ꢖ
ꢘ
ꢫ
ꢂ
ꢂ
ꢃ
ꢃ
ꢣꢏ ꢙ
 
ꢏꢌ ꢏꢔ
 
ꢚ ꢏ
 
ꢖꢓ ꢗꢓ ꢍ
 
ꢏ ꢌ
 
ꢘꢋ ꢏ ꢙꢙꢓ
 
ꢚꢓ ꢏ
 
ꢔ ꢛ  
ꢞꢣ ꢞ
 
ꢞꢣꢘ  
ꢣ
ꢏ
ꢐ
ꢏ
ꢌ
ꢗ
ꢏ
ꢍ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢃ
ꢃ
ꢃ
ꢂ
ꢞ
ꢣ
ꢎ
ꢣ
ꢡ
ꢑ
ꢠꢡ ꢑ
 
ꢠꢊ ꢪ  
ꢖ ꢏꢳ
 
ꢱꢠꢲꢔ ꢏ  
ꢠꢘ ꢪ
 
ꢯꢦ ꢠ  
ꢌ
ꢃ
ꢃ
ꢟꢧ ꢖ  
ꢌꢏ ꢐꢏ ꢛ  
ꢂ
ꢂ
ꢌ
ꢌ
ꢣ
ꢡ
ꢨ
ꢡꢠꢎꢰ ꢱ ꢠꢲ ꢔ ꢏ  
ꢪ
ꢪ
ꢩ
ꢡ
ꢨ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢌ
ꢃ
ꢖ
NOTE: r
 
= reserved. All reserved bits should be set low (0) during normal operation.  
NOTE: All
 
bits indicated as 1 should be set high (1) during normal operation.  
NOTE: All
 
bits indicated as 0 should be set low (0) during normal operation.  
ADDRESS  
LOCATION  
NO. OF  
BITS  
DESCRIPTION  
DEFAULT VALUE  
00xx  
00xx  
00xx  
00xx  
00xx  
00xx  
00xx  
01xx  
01xx  
01xx  
01xx  
01xx  
01xx  
2
1
:
1
7  
1
6
:8  
7:6  
5
5
9
2
1
1
2
2
5
9
2
1
1
1
Main A divider coefficient (Mode 0)  
00000  
Main B divider coefficient (Mode 0)  
Controls the PA attenuation (Mode 0)  
Enables transmit/receive path (Mode 0)  
Receive data polarity invert bit  
001110000  
10  
0
4
0
3:2  
1:0  
2
1
:
1
7  
1
6
:8  
7:6  
5
Controls charge pump peak current  
Output divider coefficient; band select  
Main A divider coefficient (Mode 1)  
Main B divider coefficient (Mode 1)  
Controls the PA attenuation (Mode 1)  
Enables transmit/receive path (Mode 1)  
00  
10  
00000  
001110000  
10  
0
4
Controls modulation scheme (FSK or OOK)  
0
3
Enables or disables the power amplifier while in transmit mode  
or the receive chain while in receive mode  
0
01xx  
01xx  
1000  
1001  
1001  
1001  
1001  
1001  
1001  
1001  
11×0  
11×0  
11×0  
11×0  
2:1  
0
2
1
8
2
3
1
2
1
1
5
1
3
1
3
Sets threshold for the brownout detector  
Enables brownout detector  
00  
0
2
1
:
1
4  
2
1
:
2
0  
1
9
:
1
7  
16  
Reference divider coefficient  
01000000  
Bit-rate divider D1  
11  
010  
0
Bit-rate divider D2  
Bit-rate divider D3  
1
5
:
1
4  
13  
Receive mode select  
00  
Transmit capture mode select  
RX training sequence pattern select  
Determines the minimum number of training bits  
Controls the position of the XTAL switch during FSK reception  
Tunes the XTAL frequency by using an internal capacitor bank  
PFD reset  
0
12  
0
11 : 7  
19  
00100  
0
1
8
:
1
6  
15  
000  
1
1
4
:
1
2  
Tunes the resonant frequency of the external demodulation  
tank circuit  
000  
11×0  
11  
1
Controls the position of the XTAL switch during OOK operation  
0
NOTE: x
 
= don’t care  
23  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢇ ꢈꢉ
 
ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
At power on/startup, all of the TRF6903 register contents are as per the default values.  
Address 00XX (A-Word):  
Word A is a 22-bit data register comprising seven fields. The main A-divider coefficient (mode 0), A<21:17>,  
is the 5-bit divider ratio of the A counter when the MODE terminal is low. The main B-divider coefficient  
(mode 0), A<16:8>, is the 9-bit value of the B counter when the MODE terminal is low. A <21:17> and A  
<16:8> are
 
unsigned binary values. PA0, A<7:6>, is the 2-bit PA attenuation setting when the MODE  
terminal is low. TX/RX0, A<5>, is the TX/RX switch when the MODE terminal is low. PI, A<4>, is the data  
polarity invert bit. When high, this bit causes the data slicer output to be inverted. CP Acc., A<3:2>, sets the  
charge pump current. BND, A<1:0>, sets the output divider, which in turn determines the band of operation.  
T
e
rminal 21 (MODE) selects bits A
<
2
1
:5>
i
f low, or B
<
2
1
:5>
i
f high.  
Main divider A
<
2
1
:
1
7
>
: 5-bit value for divider ratio of the A counter  
Main divider A
<
1
6
:8
>
: 9-bit value for divider ratio of the B counter  
PA attenuation A
<
7:6
>
: 2 bits for setting the PA attenuation  
A
<
7:6>  
PA ATTENUATION  
0 dB  
00  
01  
10  
11  
10 dB  
20 dB  
Not defined  
A
<
5
>
: 1-bit TX/RX mode select  
A
<
5>  
TX/RX MODE  
RX mode  
0
1
TX mode  
A
<
4
>
: 1-bit data polarity invert bit  
A<
4
>  
RX DATA POLARITY  
Noninverted  
0
1
Inverted  
A
<
3
:
2
>
: 2 bits for setting the charge pump current  
A<
3
:2>  
00  
CP CURRENT  
0.5 mA  
01  
1 mA  
10  
0.25 mA  
11  
Not defined  
24  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀꢁ ꢂꢃ
 
ꢄꢅ ꢆ  
ꢇꢈ ꢉꢊ
 
ꢋ ꢌꢍꢎꢏꢈ
 
ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
A
<
1
:0>: 2-bit value to set the output divider and thus select the band of operation.  
A<1:
0
>  
OUTPUT DIVIDER  
RATIO, P  
BAND OF  
OPERATION  
00  
01  
3
2
315 MHz  
433 MHz  
10  
11  
1
1
868 MHz or 915 MHz  
868 MHz or 915 MHz  
Address 01XX (B-Word):  
Word B is a 22-bit data register comprising eight fields. The main A-divider coefficient (mode 1), B<21:17>,  
is the 5-bit divider ratio of the A counter when the MODE terminal is high. The main B-divider coefficient  
(mode 1), B<16:8>, is the 9-bit value of the B counter when the MODE terminal is high. B<21:17> and  
B<16:8> are unsigned binary values. PA1, B<7:6>, is the 2-bit PA attenuation setting when the MODE  
terminal is high. TX/RX1, B<5>, is the TX/RX switch when the MODE terminal is high. FSK/OOK, B<4>, sets  
the modulation scheme for both TX and RX. Bit B<3> enables/disables the power amplifier while in transmit  
mode and enables/disables the receive chain while in receive mode. The detector threshold, B<2:1>, is the  
2-bit setting for the threshold voltage of the brownout detector. Det. Enable, B<0>, is the brownout detector  
enable flag.  
T
e
rminal 21 (MODE) selects bits A
<
2
1
:5>
i
f low, or B
<
2
1
:5>
i
f high.  
Main divider B
<
2
1
:
1
7
>
: 5-bit value for divider ratio of the A-counter  
Main divider B
<
1
6
:8
>
: 9-bit value for divider ratio of the B-counter  
PA attenuation B
<
7:6
>
: 2 bits for setting the PA attenuation  
B
<
7:6>  
PA ATTENUATION  
0 dB  
00  
01  
10  
11  
10 dB  
20 dB  
Not defined  
B
<
5
>
: 1-bit TX/RX mode select  
B
<
5>  
TX/RX MODE  
RX mode  
0
1
TX mode  
B
<
4>
1
-bit modulation select  
B
<
4>  
TX/RX MODULATION  
0
1
OOK  
FSK  
NOTE: During
 
OOK reception, the OOK switch is closed. During FSK reception, the OOK switch is open.  
25  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢇ ꢈꢉ
 
ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
B
<
3
>
: 1-bit PA or receive chain enable/disable  
B
<
3>  
PA OR RECEIVE CHAIN  
ENABLE/DISABLE  
0
1
Disabled  
Enabled  
B
<
2:1
>
: 2-bit value to set the threshold voltage for the brownout detector  
B
<
2:1>  
THRESHOLD VOLTAGE  
00  
01  
10  
11  
2.2 V  
2.4 V  
2.6 V  
2.8 V  
B
<
0
>
: 1 bit to enable brownout detector  
B
<
0>  
BROWNOUT DETECTOR  
0
1
Off  
On  
Address 1000 (C-Word):  
Word C is a 20-bit data register comprising four fields. The reference divider
 
coefficient, C<21:14>, is the  
8-bit divider ratio of the reference divider. The allowable reference divider range is 2 (C <21:14> =  
00000010) through 255 (C <21:14> = 11111111).  
Bits C<13> through C<2> are reserved and should be set to 0.  
Address 1001 (E-Word):  
Word E is a 20-bit data register comprising eight fields. The bit rate or bit frequency, used by the clock  
recovery receive modes and the transmit synchronous mode is controlled by the BRA, E<21:20>, BRB,  
E<19:17>, and BRC, E<16>, fields. These three fields control a sequence of dividers, D1 through D3, that  
divide the reference (crystal) frequency, F
 
.  
X
26  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀꢁ ꢂꢃ
 
ꢄꢅ ꢆ  
ꢇꢈ ꢉꢊ
 
ꢋ ꢌꢍꢎꢏꢈ
 
ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
E<21:20>: 2 bits to set D1 divider setting  
E<21:20>  
D1  
1
00  
01  
10  
11  
5
6
8
E<19:17>: 3 bits to set D2 divider setting  
E<19:17>  
000  
D2  
1
001  
2
010  
4
011  
8
100  
101  
110  
111  
16  
32  
64  
128  
E<16>: 1 bit to set D3 divider setting  
E<16>  
D3  
0
1
16  
15  
RXM, E<15:14> controls the signals that appear at the RX_DATA and DCLK terminals. The definition of  
RXM is contained in
T
a
ble 3.  
TXM, E<13>, sets the transmit capture mode. If TXM is low, the TX_DATA terminal controls the transmit  
function asynchronously. If TXM is high, the bit-rate clock is output at DCLK and the transmit data at the  
TX_DATA terminal is latched on the rising edge of DCLK, where DCLK is the bit-rate clock.  
TWO, E<12>, sets the receive training sequence pattern. If TWO is high, the expected training sequence is  
assumed to be alternating pairs of ones and zeroes. If TWO is low, the expected training sequence is  
assumed to be alternating ones and zeroes.  
TCOUN
T
, E>11:7>, determines the minimum number of training bits. The minimum number of training bits is  
four times the unsigned binary value of TCOUN
T
,
p
lus two if TWO = 0 or plus three if TWO = 1.  
Bits E<6> through E<2> are reserved and should be set to 0.  
Address 11X0 (D-Word):  
Word D is a 21-bit data register comprising three fields. XTAL_Tune, D<18:16>, is used to fine tune the  
crystal frequency by using an internal capacitor bank. PFD reset, D<15>, selects the source of the PFD  
reset signal. Dem_Tune, D<14:12>, is a 3-bit value used to tune the demodulator time constant. Bit D<11>  
controls the position of the XTAL switch during OOK operation.  
D
<
1
9
>
: 1-bit value to control the position of the XTAL switch during FSK reception, when B<4>=1 and  
either A<5> or B<5> = 0. It is recommended to set this bit to 1 (XTAL switch closed). If D<19> is set to 0  
(XTAL switch open), the LO frequency injected into the mixer is f  
= f
 
+ designed peak-peak  
outs  
LO  
deviation. This results in the down-converted IF signal shifting higher (high-side injection) or lower  
(low-side injection) from the IF center frequency (10.7 MHz) by an amount equal to the designed  
peak-peak frequency deviation.  
27  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢇ ꢈꢉ
 
ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
D<1
9
>  
XTAL SWITCH DURING FSK  
RECEPTION  
TERMINAL 31  
0
1
Unconnected (open)  
High-Z  
Connected (closed)  
Shorted to ground internally  
D
<
1
8
:
1
6
>
: 3-bit value to fine-tune the XTAL frequency by using an internal capacitor bank.  
D
<
1
8:1
6
>  
000  
TYPICAL LOAD CAPACITANCE  
13.23 pF  
22.57 pF  
17.9 pF  
001  
010  
011  
27.24 pF  
15.56 pF  
24.9 pF  
100  
101  
110  
20.23 pF  
29.57 pF  
111  
D
<
1
5
>
: 1-bit value to select the reset signal for the PFD  
D<1
5
>  
RESET SIGNAL  
Derived from XTAL  
Derived from prescaler  
0
1
NOTE: The
 
default setting for D<15> is 1.  
D
<
1
4
:
1
2
>
: 3-bit value to tune the resonant frequency of the external demodulator tank circuit. It can be  
used to optimize the receiver performance. The recommended default setting is 110.  
D
<
1
1>: 1-bit value to control position of the XTAL switch during OOK operation, when B<4> = 0.  
D<1
1
>  
XTAL SWITCH DURING OOK  
OPERATION  
TERMINAL 31  
0
1
Unconnected (open)  
Connected (closed)  
High-Z  
Shorted to ground internally  
It is recommended that D<19> and D<11> be set to 0 during FSK reception and OOK operation.  
Bits D<21>, D<20>, and D<10> through D<1> are reserved and should be set to 0.  
operating modes  
Controlled with terminal 26, STDBY  
STDBY  
OPERATING MODE  
0
1
Power down of all blocks—programming mode  
Operational mode and programming mode  
Controlled with terminal 21, MODE  
MODE  
OPERATING MODE  
Enable A-word  
Enable B-word  
0
1
28  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀꢁ ꢂꢃ
 
ꢄꢅ ꢆ  
ꢇꢈ ꢉꢊ
 
ꢋ ꢌꢍꢎꢏꢈ
 
ꢐ ꢑ
 
ꢒꢋꢀ ꢈꢓꢔ
 
ꢉꢕ ꢁꢂ
 
ꢀ ꢁꢔꢉ
 
ꢇꢎ ꢌ
 
ꢈꢖ ꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
PRINCIPLES OF OPERATION  
Controlled with terminal 39, LEARN/HOLD  
LEARN/HOLD  
OPERATING MODE  
0
1
Selects data slicer decision level to HOLD  
Selects data slicer decision level to LEARN  
The transmit/receive mode is controlled by the TX/RX0, A<5>, TX/RX1, B<5>, and PARXED, B<3>, fields  
and the MODE and STDBY terminals.  
A<5>  
B<5>  
B<3>  
MODE  
STDBY  
OPERATING MODE  
Off, programming mode; SPI enabled  
X
0
X
X
X
0
X
0
0
1
Receive mode 0, RX chain disabled. Reference, PLL, VCO and  
dividers enabled  
0
1
X
X
X
0
0
1
1
1
0
1
0
1
0
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
Receive mode 0, RX chain enabled. Reference, PLL, VCO and  
dividers enabled  
Transmit mode 0, PA disabled. Reference, PLL, VCO and dividers  
enabled  
1
Transmit mode 0, PA enabled. Reference, PLL, VCO and dividers  
enabled  
X
X
X
X
Receive mode 1, RX chain disabled. Reference, PLL, VCO and  
dividers enabled  
Receive mode 1, RX chain enabled. Reference, PLL, VCO and  
dividers enabled  
Transmit mode 1, PA disabled. Reference, PLL, VCO and dividers  
enabled  
Transmit mode 1, PA enabled. Reference, PLL, VCO and dividers  
enabled  
29  
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265  

ꢀ ꢁꢂꢃ ꢄ
 
ꢅ ꢆ  
ꢇ ꢈꢉ
 
ꢊꢋ ꢌꢍ ꢎꢏ
 
ꢈ ꢐ
 
ꢑ ꢒꢋꢀꢈ
 
ꢓ ꢔꢉ ꢕ
 
ꢁꢂ ꢀꢁ
 
ꢔꢉ ꢇꢎꢌ
 
ꢈꢖꢌ ꢁ  
SWRS022D − MARCH 2004 − REVISED JUNE 2005  
APPLICATION INFORMATION  
BPF1  
MuRata  
SFECF10M7 Series  
C1  
3
1
82 pF  
C2  
100 pF  
C3  
120 pF  
L1  
4.7
µ
H  
2
C4  
82 pF  
R1  
220
k
Ω  
0.22
µ
F  
L2  
C8  
C6  
J1  
J4  
4.7
µ
H  
C7  
C5  
RX_IN+  
L3  
DIS 1  
10.7 MHz  
MuRata  
RSSI  
C9  
1
LPF_OUT 36  
CER_DIS 35  
CDSCB10M7GA119−R0  
LNA  
2
3
C10  
34  
SLC_CAP  
LNA_VCC  
J2  
Data  
C11  
L4  
4
PA_OUT  
PA_VCC  
Slicer RX_DATA  
33  
32  
31  
TX_OUT  
RX_DATA  
C12  
5
6
TX_DATA  
XTAL_SW  
TX_DATA  
R2 (See Note E)  
L5  
U1  
PA_VCC2  
C14  
10
0
Ω  
C15  
7
TRF6903  
XTAL 30  
29  
Reference  
Generator  
1, 2, 3  
Divider  
8
XTAL1  
Crystek  
017119  
PA_VCC1  
C16  
9
28  
27  
C13  
VCO_VCC  
VCO_TANK2  
10  
VCO_VCC  
VCO  
Bit Synchronizer  
and  
Data Clock  
C17  
0.1
µ
F  
11
VCO_BYPASS  
12  
26  
25  
XTAL_VCC  
DCLK  
PLL  
C18  
100 pF  
STDBY  
13  
14 15 16 17 18 19 20  
21 22 23  
24  
C19  
R3  
C21  
R4  
DVDD  
VCC  
C24  
0.1
µ
F  
C25  
10
µ
F  
VCO_VCC  
DEM_VCC  
MIX_VCC  
LNA_VCC  
XTAL_VCC  
VCO_VCC  
C22  
0.1
µ
F  
C20  
CP_VCC  
CP_VCC  
C23  
0.1
µ
F  
PA_VCC2  
PA_VCC1  
NOTE: See
 
T
a
ble 5 for component selection for band of operation.  
Figure 11. Typical TRF6903 FSK Application Schematic  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
APPLICATION INFORMATION  
Table 5. Component Selection for Band of Operation, FSK  
315 MHz  
Component  
433 MHz  
Component  
868 MHz  
Component  
915 MHz  
Component  
Value  
15 pF  
330 pF  
15 pF  
27 nH  
Value  
8.2 pF  
180 pF  
8.2 pF  
22 nH  
Value  
2.7 pF  
39 pF  
2.7 pF  
15 nH  
Value  
1.5 pF  
33 pF  
1.8 pF  
12 nH  
C8  
C6  
C9  
L3  
C8  
C6  
C9  
L3  
C8  
C6  
C9  
L3  
C8  
C6  
C9  
L3  
Rx  
LNA Matching  
Network  
C11  
C14  
L5  
390 pF  
390 pF  
560 nH  
75 nH  
C11  
C14  
L5  
270 pF  
270 pF  
470 nH  
39 nH  
C11  
C14  
L5  
43 pF  
39 pF  
330 nH  
15 nH  
3.9 pF  
39 pF  
C11  
C14  
L5  
43 pF  
33 pF  
270 nH  
15 nH  
2.7 pF  
33 pF  
Tx  
PA Matching  
Network  
L4  
L4  
L4  
L4  
C12  
C13  
7.5 pF  
390 pF  
C12  
C13  
6.8 pF  
270 pF  
C12  
C13  
C12  
C13  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
PLL  
Loop Filter  
R4  
7.5 k
Ω  
R4  
7.5 k
Ω  
R4  
7.5 k
Ω  
R4  
7.5 k
Ω  
Post Detection  
Low-Pass Filter  
C7  
18 pF  
C7  
18 pF  
C7  
18 pF  
C7  
18 pF  
Sample and Hold  
Capacitor  
C10  
3300 pF  
C10  
3300 pF  
C10  
3300 pF  
C10  
3300 pF  
C15  
C16  
27 pF  
C15  
C16  
27 pF  
C15  
C16  
27 pF  
20 pF  
C15  
C16  
27 pF  
22 pF  
XTAL Switch  
Capacitor  
5.6 pF  
9.1 pF  
NOTES: A. Loop
 
filter components selected for 19.2-kbps Manchester or 38.4-kbps NRZ for each band. I  
Reference Frequency = 409.6 kHz  
= 0.5 mA,  
CP  
B. Post
 
detection low-pass filter selected for 19.2-kbps Manchester or 38.4-kbps NRZ.  
C. Sample
 
and hold capacitor selected for 7-bit training sequence and TWO = 0 (E<12>:0)  
D. XTAL
 
switch capacitors selected for the frequency deviation of
 
50 kHz.  
E. R2
 
= 100
Ω
is optional for operation in the 868-MHz and 915-MHz bands.  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
APPLICATION INFORMATION  
BPF1  
MuRata  
SFECF10M7 Series  
C1  
3
1
82 pF  
C2  
100 pF  
C3  
120 pF  
L1  
4.7
µ
H  
2
C4  
82 pF  
R1  
27 k
Ω  
0.22
µ
F  
L2  
C8  
C6  
J1  
J4  
4.7
µ
H  
DNP  
C5  
C7  
RX_IN+  
L3  
RSSI  
C9  
1
LPF_OUT 36  
CER_DIS 35  
LNA  
2
3
C10  
34  
SLC_CAP  
RX_DATA  
LNA_VCC  
J2  
Data  
Slicer  
L4  
4
PA_OUT  
PA_VCC  
33  
32  
31  
TX_OUT  
RX_DATA  
TX_DATA  
5
6
C12  
C11  
L5  
TX_DATA  
XTAL_SW  
U1  
PA_VCC2  
7
TRF6903  
XTAL 30  
29  
C14  
Reference  
Generator  
1, 2, 3  
8
Divider  
XTAL1  
Crystek  
017119  
C15  
PA_VCC1  
9
28  
27  
C13  
VCO_VCC  
27 pF  
VCO_TANK2  
10  
VCO_VCC  
VCO  
Bit Synchronizer  
and  
Data Clock  
C17  
0.1
µ
F  
11
VCO_BYPASS  
12  
26  
25  
XTAL_VCC  
PLL  
C18  
100 pF  
DCLK  
STDBY  
13  
14 15 16 17 18 19 20  
21 22 23  
24  
C19  
DVDD  
VCC  
R3  
C25  
10
µ
F  
C24  
0.1
µ
F  
DEM_VCC  
C21  
R4  
MIX_VCC  
LNA_VCC  
XTAL_VCC  
VCO_VCC  
VCO_VCC  
C22  
0.1
µ
F  
C20  
CP_VCC  
CP_VCC  
C23  
0.1
µ
F  
PA_VCC2  
PA_VCC1  
NOTE: See
 
T
a
ble 6 for component selection for band of operation.  
Figure 12. Typical TRF6903 OOK Application Schematic With Ceramic IF Filter  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
APPLICATION INFORMATION  
Table 6. Component Selection for Band of Operation, OOK  
315 MHz  
Component  
433 MHz  
Component  
868 MHz  
Component  
915 MHz  
Component  
Value  
15 pF  
330 pF  
15 pF  
27 nH  
Value  
8.2 pF  
180 pF  
8.2 pF  
22 nH  
Value  
2.7 pF  
39 pF  
2.7 pF  
15 nH  
Value  
1.5 pF  
33 pF  
1.8 pF  
12 nH  
C8  
C6  
C9  
L3  
C8  
C6  
C9  
L3  
C8  
C6  
C9  
L3  
C8  
C6  
C9  
L3  
Rx  
LNA Matching  
Network  
C11  
C14  
L5  
390 pF  
390 pF  
560 nH  
75 nH  
C11  
C14  
L5  
270 pF  
270 pF  
470 nH  
39 nH  
C11  
C14  
L5  
43 pF  
39 pF  
330 nH  
15 nH  
3.9 pF  
39 pF  
C11  
C14  
L5  
43 pF  
33 pF  
270 nH  
15 nH  
2.7 pF  
33 pF  
Tx  
PA Matching  
Network  
L4  
L4  
L4  
L4  
C12  
C13  
7.5 pF  
390 pF  
C12  
C13  
6.8 pF  
270 pF  
C12  
C13  
C12  
C13  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
C19  
C21  
C20  
R3  
75 pF  
120 pF  
5600 pF  
15 k
Ω  
PLL  
Loop Filter  
R4  
7.5 k
Ω  
R4  
7.5 k
Ω  
R4  
7.5 k
Ω  
R4  
7.5 k
Ω  
Sample and Hold  
Capacitor  
C10  
3300 pF  
C10  
3300 pF  
C10  
3300 pF  
C10  
3300 pF  
NOTES: A. Loop
 
filter components selected for 19.2-kbps Manchester or 38.4-kbps NRZ for each band. I  
Reference Frequency = 409.6 kHz  
= 0.5 mA,  
CP  
B. Sample
 
and hold capacitor selected for 7-bit training sequence and TWO = 0 (E<12>:0)  
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SWRS022D − MARCH 2004 − REVISED JUNE 2005  
Revision History  
DATE  
6/2/05  
—
REV  
D
PAGE  
1
SECTION  
DESCRIPTION  
—
—
—
—
—
Added application drawing to front page.  
Information not available  
C
—
—
B
—
Information not available  
—
A
—
Information not available  
—
*
—
Information not available  
NOTE: Page
 
numbers for previous revisions may differ from page numbers in the current version.  
34  
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PACKAGE OPTION ADDENDUM  
5-Feb-2007  
PACKAGING INFORMATION  
Orderable Device  
TRF6903PT  
Status

(1)  

NRND  
NRND  
NRND  
NRND  
Package Package  
Pins Package
 
Eco Plan

(2)

Lead/Ball Finish
 
MSL Peak Temp

(3)  

Qty  
Type  
Drawing  
LQFP  
PT  
48  
48  
48  
48  
250 Green
 
(RoHS &
 
CU NIPDAU
 
Level-1-260C-UNLIM  
no Sb/Br)  
TRF6903PTG4  
TRF6903PTR  
LQFP  
LQFP  
LQFP  
PT  
PT  
PT  
250 Green
 
(RoHS &
 
CU NIPDAU
 
Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green
 
(RoHS &
 
CU NIPDAU
 
Level-1-260C-UNLIM  
no Sb/Br)  
TRF6903PTRG4  
1000 Green
 
(RoHS &
 
CU NIPDAU
 
Level-1-260C-UNLIM  
no Sb/Br)  

(1)

The marketing status values are defined as follows:  
ACTIVE:
Product device recommended for new designs.  
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE:
TI has discontinued the production of the device.  
(2)  
Eco Plan – The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) – please check  

http://www.ti.com/productcontent

for the latest availability information and additional product content details.  
TBD:
The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS):
TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br):
TI defines “Green” to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. — The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:
The information provided on this page represents TI’s knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  

PACKAGE MATERIALS INFORMATION  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1
 
(mm)  
(mm) (mm)
 
Quadrant  
TRF6903PTR  
LQFP  
PT  
48  
1000  
330.0  
16.4  
9.6  
9.6  
1.9  
12.0  
16.0  
Q2  
Pack Materials-Page 1  

PACKAGE MATERIALS INFORMATION  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type
 
Package Drawing
 
Pins  
LQFP PT
 
48  
SPQ  
Length (mm)
 
Width (mm)
 
Height (mm)  
346.0 346.0
 
33.0  
TRF6903PTR  
1000  
Pack Materials-Page 2  

M
E
CHANICAL DATA  
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996  
PT (S-PQFP-G48)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
M
0,08  
0,50  
36  
25  
37  
24  
48  
13  
0,13 NOM  
1
12  
5,50 TYP  
7,20  
SQ  
6,80  
Gage Plane  
9,20  
SQ  
8,80  
0,25  
0,05 MIN  
0
°
–
7
°  
1,45  
1,35  
0,75  
0,45  
Seating Plane  
0,10  
1,60 MAX  
404005
2
/C
1
1/96  
NOTES: A. All
 
linear dimensions are in millimeters.  
B. This
 
drawing is subject to change without notice.  
C. Falls
 
within JEDEC MS-026  
D. This
 
may also be a thermally enhanced plastic package with leads conected to the die pads.  
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