TOSHIBA-TPH1R204PL-LQ-M1

Part #TOSHIBA-TPH1R204PL-LQ-M1
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TOSHIBA-TPH1R204PL-LQ-M1
TPH1R204PL  
MOSFETs Silicon
 
N-channel MOS (U-MOS
-H)  
TPH1R204PL  
1. Applications  
•
High-Efficiency DC-DC Converters  
•
Switching Voltage Regulators  
2. Features  
(1) High-speed
 
switching  
(2) Small
 
gate charge: Q
SW
= 17 nC (typ.)  
(3) Small
 
output charge: Q
oss
= 56 nC (typ.)  
(4) Low
 
drain-source on-resistance: R
DS(ON)
= 1.0 m
Ω
(typ.) (V
GS
= 10 V)  
(5) Low
 
leakage current: I
DSS
= 10
µ
A (max) (V
DS
= 40 V)  
(6) Enhancement
 
mode: V
th
= 1.4 to 2.4 V (V
DS
= 10 V, I
D
= 0.5 mA)  
3. Packaging
 
and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
SOP Advance  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
SOP Advance(N)  
The package can be selected according to your preference. For details, please contact your TOSHIBA sales  
representative.  
Start of commercial production  
2015-09  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
1

TPH1R204PL  
4. Absolute
 
Maximum Ratings (Note) (T
a
= 25
unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
V
DSS  
V
GSS  
I
D  
40  
±
20  
(T
c
= 25
)  
(Silicon limit)  
(t = 100
µ
s)  
(T
c
= 25
)  
(Note 1), (Note 2)  
(Note 1), (Note 2)  
(Note 1)  
150  
A
A
I
D  
246  
I
DP  
P
D  
500  
A
132  
W
W
W
mJ  
A
(Note 3)  
(Note 4)  
(Note 5)  
(Note 5)  
P
D  
3
P
D  
0.96  
127  
Single-pulse avalanche energy  
Single-pulse avalanche current  
Channel temperature  
E
AS  
I
AS  
120  
T
ch  
T
stg  
175  
Storage temperature  
-55 to 175  
Note: Using
 
continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/”Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
5. Thermal
 
Characteristics  
Characteristics  
Channel-to-case thermal resistance  
Symbol  
Max  
Unit  
(T
c
= 25
)  
(T
a
= 25
)  
(T
a
= 25
)  
R
th(ch-c)  
R
th(ch-a)  
R
th(ch-a)  
1.13  
50  
/W  
Channel-to-ambient thermal resistance  
Channel-to-ambient thermal resistance  
(Note 3)  
(Note 4)  
156  
Note 1: Ensure that the channel temperature does not exceed 175
.  
Note 2: Limited by package limit. Silicon chip capability is 246 A. (T
c
= 25
)  
Note 3: Device mounted on a glass-epoxy board (a), Figure 5.1  
Note 4: Device mounted on a glass-epoxy board (b), Figure 5.2  
Note 5: V
DD
= 32 V, T
ch
= 25
(initial), L = 0.0068 mH, I
AS
= 120 A  
Fig. 5.1
 
Device Mounted on a Glass-Epoxy  
Board (a)  
Fig. 5.2
 
Device Mounted on a Glass-Epoxy  
Board (b)  
Note: This
 
transistor is sensitive to electrostatic discharge and should be handled with care.  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
2

TPH1R204PL  
6. Electrical
 
Characteristics  
6.1. Static
 
Characteristics (T
a
= 25
unless otherwise specified)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Gate leakage current  
I
GSS  
I
DSS  
V
GS
=
±
20 V, V
DS
= 0 V  
±
0.1  
10  
µ
A  
Drain cut-off current  
V
DS
= 40 V, V
GS
= 0 V  
Drain-source breakdown voltage  
V
(BR)DSS
I
D
= 10 mA, V
GS
= 0 V  
V
(BR)DSX
I
D
= 10 mA, V
GS
= -20 V  
40  
25  
1.4  
V
Gate threshold voltage  
V
th  
V
DS
= 10 V, I
D
= 0.5 mA  
V
GS
= 4.5 V, I
D
= 50 A  
V
GS
= 10 V, I
D
= 50 A  
2.4  
2.1  
1.24  
Drain-source on-resistance  
R
DS(ON)  
1.5  
1.0  
m
Ω  
6.2. Dynamic
 
Characteristics (T
a
= 25
unless otherwise specified)  
Characteristics  
Input capacitance  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
pF  
C
iss  
C
rss  
C
oss  
r
g  
V
DS
= 20 V, V
GS
= 0 V, f = 1 MHz  
5500  
93  
7200  
Reverse transfer capacitance  
Output capacitance  
1300  
0.6  
13  
Gate resistance  
1.1  
Ω
Switching time (rise time)  
Switching time (turn-on time)  
Switching time (fall time)  
Switching time (turn-off time)  
t
r  
See Fig. 6.2.1  
ns  
t
on  
t
f  
33  
10  
t
off  
58  
V
DD
≈
20 V  
V
GS
= 0 V/ 10 V  
I
D
= 50 A  
R
L
= 0.4
Ω  
R
GG
= 4.7
Ω  
R
GS
= 4.7
Ω  
Duty
≤
1 %, t
w
= 10
µ
s  
Fig. 6.2.1
 
Switching Time Test Circuit  
6.3. Gate
 
Charge Characteristics (T
a
= 25
unless otherwise specified)  
Characteristics  
Symbol  
Q
g  
Test Condition  
Min  
Typ.  
Max  
Unit  
nC  
Total gate charge (gate-source plus  
gate-drain)  
V
DD
≈
20 V, V
GS
= 10 V, I
D
= 50 A  
V
DD
≈
20 V, V
GS
= 4.5 V, I
D
= 50 A  
V
DD
≈
20 V, V
GS
= 10 V, I
D
= 50 A  
74  
34  
16  
17  
17  
56  
Gate-source charge 1  
Gate-drain charge  
Gate switch charge  
Output charge  
Q
gs1  
Q
gd  
Q
SW  
Q
oss  
V
DS
= 20 V, V
GS
= 0 V  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
3

TPH1R204PL  
6.4. Source-Drain
 
Characteristics (T
a
= 25
unless otherwise specified)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
500  
Unit  
A
Reverse drain current (pulsed)  
(Note 6)  
I
DRP  
(t = 100
µ
s)  
Diode forward voltage  
Reverse recovery time  
V
DSF  
t
rr  
I
DR
= 150 A, V
GS
= 0 V  
-1.2  
V
V
R
= 20 V, I
DR
= 37.5 A, V
GS
=  
46  
ns  
0 V, -dI
DR
/dt = 100 A/
µ
s  
Reverse recovery charge  
Q
rr  
V
R
= 20 V, I
DR
= 37.5 A, V
GS
=  
46  
nC  
0 V, -dI
DR
/dt = 100 A/
µ
s  
Note 6: Ensure that the channel temperature does not exceed 175
.  
7. Marking  
Fig. 7.1
 
Marking  
©2016-2019  
2019-10-18  
Rev.4.0  
4
Toshiba Electronic Devices & Storage Corporation  

TPH1R204PL  
8. Characteristics
 
Curves (Note)  
Fig. 8.1
 
I
D
– V
DS  
Fig. 8.2
 
I
D
– V
DS  
Fig. 8.3
 
I
D
– V
GS  
Fig. 8.4
 
V
DS
– V
GS  
Fig. 8.5
 
R
DS(ON)
– I
D  
Fig. 8.6
 
I
DR
– V
DS  
©2016-2019  
2019-10-18  
Rev.4.0  
5
Toshiba Electronic Devices & Storage Corporation  

TPH1R204PL  
Fig. 8.7
 
V
(BR)DSS
– T
a  
Fig. 8.8
 
V
th
– T
a  
Fig. 8.9
 
R
DS(ON)
– T
a  
Fig. 8.10
 
Dynamic Input/Output Characteristics  
Fig. 8.11
 
Capacitance – V
DS  
Fig. 8.12
 
Q
oss
– V
DS  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
6

TPH1R204PL  
Fig. 8.13
 
r
th
– t
w  
(Guaranteed Maximum)  
Fig. 8.14
 
P
D
– T
a  
Fig. 8.15
 
P
D
– T
c  
(Guaranteed Maximum)  
(Guaranteed Maximum)  
Fig. 8.16
 
Safe Operating Area  
(Guaranteed Maximum)  
Note: The
 
above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
7

TPH1R204PL  
Package Dimensions  
Unit: mm  
The package can be selected according to your preference. For details, please contact your TOSHIBA sales  
representative.  
Weight: 0.079 g (typ.)  
Package Name(s)  
TOSHIBA: 2-5Q1S  
Nickname: SOP Advance  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
8

TPH1R204PL  
Package Dimensions  
Unit: mm  
The package can be selected according to your preference. For details, please contact your TOSHIBA sales  
representative.  
Weight: 0.105 g (typ.)  
Package Name(s)  
TOSHIBA: 2-5W1A  
Nickname: SOP Advance(N)  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-18  
Rev.4.0  
9