TOSHIBA-ULN2003APG
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ULN2003,04APG/AFWG
TOSHIBA Bipolar Digital Integrated Circuit
Silicon Monolithic
ULN2003APG,ULN2003AFWG,ULN2004APG,ULN2004AFWG
(Manufactured by Toshiba Malaysia)
7ch Darlington Sink Driver
ULN2003APG
ULN2004APG
The ULN2003APG/AFWG Series are high
−
voltage, high
−
current
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
ULN2003AFWG
ULN2004AFWG
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Output current (single output): 500 mA max
High sustaining voltage output: 50 V min
Output clamp diodes
Inputs compatible with various types of logic
Package Type-APG: DIP-16pin
Package Type-AFWG: SOL-16pin
Weight
Input Base
Resistor
DIP16
−
P-300-2.54A : 1.11 g (typ.)
SOL16
−
P-150-1.27A: 0.15 g (typ.)
Type
Designation
ULN2003APG/AFWG
ULN2004APG/AFWG
2.7 k
Ω
TTL, 5 V CMOS
10.5 k
Ω
6~15 V PMOS, CMOS
Pin Connection
(top view)
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ULN2003,04APG/AFWG
Schematics
(each driver)
ULN2003APG/AFWG
ULN2004APG/AFWG
Note: The
input and output parasitic diodes cannot be used as clamp diodes.
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristic
Symbol
Rating
Unit
Output sustaining voltage
Output current
V
−
0.5~50
500
V
mA/ch
V
CE (SUS)
I
OUT
Input voltage
V
−
0.5~30
50
IN
Clamp diode reverse voltage
Clamp diode forward current
V
V
R
D
I
500
mA
F
APG
AFWG
1.47
Power dissipation
P
W
1.25 (Note)
−
40~85
−
55~150
Operating temperature
Storage temperature
T
opr
°C
°C
T
stg
Note: On
PCB (Test Board: JEDEC 2s2p)
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ULN2003,04APG/AFWG
Recommended Operating Conditions
(Ta
= −
40 to 85°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
V
Output sustaining voltage
V
0
0
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
50
350
100
300
90
CE (SUS)
Duty
=
10%
Duty
=
50%
Duty
=
10%
Duty
=
50%
APG
Output current
AFWG
T
=
25 ms
pw
0
7 Circuits
Ta
=
85
°
C
T
j
=
120
°
C
I
mA/ch
OUT
0
0
Input voltage
V
0
24
V
V
IN
ULN2003A
2.8
6.2
0
24
Input voltage
(output on)
I
=
400 mA
OUT
V
IN (ON)
h
FE
=
800
ULN2004A
ULN2003A
ULN2004A
24
0.7
1.0
50
Input voltage
(output off)
V
V
IN (OFF)
0
Clamp diode reverse voltage
Clamp diode forward current
V
⎯
⎯
⎯
⎯
V
R
D
I
350
0.76
0.65
mA
F
APG
Power dissipation
AFWG
Ta
=
85°C
Ta
=
85°C
P
W
(Note)
Note: On
PCB (Test Board: JEDEC 2s2p)
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ULN2003,04APG/AFWG
Electrical Characteristics
(
T
a
=
25°C unless otherwise noted)
Test
Circuit
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
=
50 V, Ta
=
25°C
=
50 V, Ta
=
85°C
⎯
⎯
⎯
⎯
50
100
1.6
1.3
1.1
⎯
CE
CE
Output leakage current
I
1
µ
A
CEX
I
=
350 mA, I
=
500
µ
A
⎯
1.3
1.1
0.9
⎯
OUT
IN
Collector
−
emitter saturation voltage
V
2
V
I
=
200 mA, I
=
350
µ
A
⎯
CE (sat)
OUT
IN
I
=
100 mA, I
=
250
µ
A
⎯
OUT
IN
DC Current transfer ratio
h
2
3
4
V
=
2 V, I
=
350 mA
OUT
1000
⎯
FE
CE
ULN2003A
V
V
=
2.4 V, I
=
9.5 V, I
=
350 mA
=
350 mA
0.4
0.8
65
⎯
0.7
1.2
⎯
IN
IN
OUT
OUT
Input current
(output on)
I
mA
IN (ON)
ULN2004A
⎯
Input current (output off)
ULN2003A
I
I
=
500
µ
A, Ta
=
85°C
50
⎯
µ
A
IN (OFF)
OUT
I
I
I
I
=
350 mA
=
200 mA
=
350 mA
=
200 mA
2.6
2.0
4.7
4.4
50
OUT
OUT
OUT
OUT
⎯
⎯
Input voltage
(output on)
V
=
2 V
=
800
CE
FE
V
5
6
V
IN (ON)
h
⎯
⎯
ULN2004A
⎯
⎯
V
V
=
50 V, Ta
=
25°C
=
50 V, Ta
=
85°C
⎯
⎯
R
R
Clamp diode reverse current
I
µ
A
R
⎯
⎯
100
2.0
⎯
Clamp diode forward voltage
Input capacitance
V
7
I
=
350 mA
F
⎯
⎯
V
F
C
⎯
⎯
15
pF
IN
V
C
=
50 V, R
=
125
Ω
L
OUT
L
Turn
−
on delay
Turn
−
off delay
t
8
8
⎯
⎯
0.1
0.2
⎯
⎯
ON
=
15 pF
µ
s
V
C
=
50 V, R
=
125
Ω
L
=
15 pF
OUT
L
t
OFF
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ULN2003,04APG/AFWG
Test Circuit
1. I
2. V
h
3. I
IN (ON)
CEX
CE (sat),
FE
4. I
5. V
6. I
R
IN (OFF)
IN (ON)
7. V
F
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ULN2003,04APG/AFWG
8. t
, t
ON OFF
Note 1:
Pulse width 50
µ
s, duty cycle 10%
Output impedance 50
Ω
, t
≤
5 ns, t
≤
10 ns
r
f
Note 2:
See below
Input Condition
Type Number
R1
V
IH
ULN2003A
ULN2004A
0
0
3 V
8 V
Note 3:
C includes
probe and jig capacitance.
L
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short
−
circuit between outputs, air contamination fault, or fault by improper grounding.
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P
D
–
T
a
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
(1) Type-APG free air
(2) Type-AFWG
on PCB
(
T
e
st Board: JEDEC 2s2p)
(1)
(2)
0
25
50
75
100
125
150
Ambient temperature
T
a
(
°C)
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Package Dimensions
Weight: 1.11 g (typ.)
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Package Dimensions
Weight: 0.15 g (typ.)
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Notes on Contents
1. Equivalent
Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test
Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The
absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use
an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacit
y
,
f
using time and insertion circuit location, are
required.
(3) If
your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OF
F
.
IC breakdown may cause injur
y
,
s
moke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injur
y
,
smoke or ignition.
(4) Do
not insert devices in the wrong orientation or incorrectl
y
.
Make sure that the positive and negative terminals of power supplies are connected properl
y
.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully
select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directl
y
.
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ULN2003,04APG/AFWG
Points to Remember on Handling of ICs
(1) Heat
Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptl
y
, a
c
urrent flow back to
the motor’s power supply due to the effect of back-EM
F
. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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About solderability, following conditions were confirmed
•
Solderability
(1) Use
of Sn-37Pb
solder Bath
· solder
bath temperature
=
230°C
· dipping
time
=
5 seconds
· the
number of times
=
once
· use
of R-type flux
(2) Use
of Sn-3.0Ag-0.5Cu
solder Bath
· solder
bath temperature
=
245°C
· dipping
time
=
5 seconds
· the
number of times
=
once
· use
of R-type flux
RESTRICTIONS ON PRODUCT USE
060116EBA
•
The information contained herein is subject to change without notice.
021023_D
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
021023_A
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
021023_B
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
060106_Q
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
021023_C
•
The products described in this document are subject to the foreign exchange and foreign trade laws.
021023_E
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