Tritech-MOS-TM014P02D

Part #Tritech-MOS-TM014P02D
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Tritech-MOS-TM014P02D
-Channel  
TM014P02D  
P
Enhancement Mosfet  
General Description  
General Features  
V

DS

=-20V I
 
=-50  
• Low R

DS(ON)  

A
D
• RoHS and Halogen-Free Compliant  
=-4.5V  
=
14m
W
(
typ
.)@
V

GS  

R

DS(ON)  

Applications  
• Load switch  
• PWM  
100% UIS Tested  
100% R

g

Tested  
D:TO-252-3L  
D
D
D
S
G
Marking: 50P02  
Absolute Maximum Ratings (TC=25
℃
unless otherwise noted)  
Symbol  
V

DS  

Parameter  
Rating  
-18  
Units  
V
Drain-Source Voltage  
V

GS  

Gate-Sou
r
ce Voltage  
±
12  
-50  
V
Continuous Drain Current, V

GS

@ -4.5V

1  

Continuous Drain Current, V

GS

@ -4.5V

1  

Pulsed Drain Current

2  

I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

A
–
1
5  
A
–
3
8  
A
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

3  

W
℃
℃
3.9  
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
T

J  

-55 to 150  
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
45  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

—  
—  
R

θJA  

R

θJC  

50  
1/5  

-Channel  
P
TM014P02D  
Enhancement Mosfet  
Electrical Characteristics
(T

J

=25
℃
unless otherwise specified)  
Symbol  
Parameter  
Test Condition  
Min.  
Typ. Max. Units  
Off Characteristic  
V

(BR)DSS  

I

DSS  

Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
V

GS

=0V, I

D

= -250μA  
V

DS

= -12V, V

GS

=0V,  
V

DS

=0V, V

GS

= ±12V  
-15  
-18  
–
V
–
–
–
–
-1  
μA  
I

GSS  

±100  
nA  
On Characteristics  
V

GS(th)

Gate Threshold Voltage  
V

DS

=V

GS

, I

D

= -250μA  
V

GS

= -4.5V, I

D

= -7A  
V

GS

= -2.5V, I

D

= -5A  
-0.5  
-0.7  
14  
-1.0  
18  
V
–
–
Static Drain-Source on-Resistance  
R

DS(on)  

mΩ  
note2  
19  
25  
Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
–
–
–
–
–
–
1300  
302  
279  
19  
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
V

DS

= -6V, V

GS

=0V,  
f=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
V

DS

= -6V, I

D

= -7A,  
V

GS

= -4.5V  
Q

gs  

Q

gd  

Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
4
5
Switching Characteristics  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
–
–
–
–
11  
36  
29  
8
–
–
–
–
ns  
ns  
ns  
ns  
V

DD

= -6V, I

D

= -4A,  
V

GS

= -4.5V,  
R

GEN

=2.5Ω  
Drain-Source Diode Characteristics and Maximum Ratings  
Maximum Continuous Drain to Source Diode Forward  
I

S  

–
–
–
–
-50  
-38  
-1.2  
A
A
Current  
I

SM  

Maximum Pulsed Drain to Source Diode Forward Current  
–
Drain to Source Diode Forward  
V

GS

=0V, I

S

= -7A  
V

SD  

-0.8  
V
Voltage  
Notes:1. Repetitive Rating: Pulse Width Limited by Maximum Junction
T
e
mperature  
2. Pulse
T
e
st: Pulse Width≤300μs, Duty Cycle≤2%  
2/5  

TM014P02D  
-Channel  
P
Enhancement Mosfet  
Typical Performance Characteristics  
Figure 2:
Typical Transfer Characteristics  
Figure1:
Output Characteristics  
-I
D
(A)  
15  
-I
D
(A)  
15  
4.5V  
T
A
=-55
℃
 
25
℃  
3V  
12  
12  
9
9
125
℃  
2V  
2.5V  
6
6
3
3
0
1.5V  
-V
GS
(V)  
1.0  
-V
DS
(V)  
0
0
1
2
3
4
5
0
0.5  
1.5  
2.0  
Figure 3:
On-resistance vs. Drain Current  
Figure 4
: Body Diode Characteristics  
-I
S
(A)  
R
DS(ON)
(mΩ)  
10  
33  
30  
V
GS
=-2.5V  
V
GS
=-4.5V  
27  
24  
21  
18  
T
J
=150
℃  
T
J
=-25
℃  
T
J
=-50
℃  
1
15  
12  
-I
D
(A)  
-V
SD
(V)  
0.6 0.8  
0.1  
0.0  
0.2  
0.4  
1.0  
1.2  
1.4  
0
2
4
6
8
10  
12  
Figure 5:
Gate Charge Characteristics  
Figure 6:
Capacitance Characteristics  
-V
GS
(V)  
C(pF)  
10

4  

5
4
3
V
DS
=-6V  
I
D
=-7A  
C
iss  
10

3  

10

2  

C
oss  
C
rss  
2
1
0
-V
DS
(V)  
9
Q
g
(nC)  
1
0

1  

0
4
8
12  
16  
20  
0
3
6
12  
15  
18  
3/5  

TM014P02D  
-Channel  
Enhancement Mosfet  
P
Figure 8:
Normalized on Resistance vs.  
Figure 7:
Normalized Breakdown Voltage vs.  
Junction Temperature  
Junction Temperature  
R
DS
(on)  
V
BR(DSS)  
2.5  
1.3  
1.2  
1.1  
1.0  
2.0  
1.5  
1.0  
0.5  
0.9  
Tj (
℃
)  
Tj (
℃
)  
0
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
Figure 9:
Maximum Safe Operating Area  
Figure 10:
Maximum Continuous Drain Current  
vs. Ambient Temperature  
-I
D
(A
)
 
-I
D
(A
)  
100  
8
6
4
10μs  
10  
100μs  
Limited by R
DS(on)  
1
2
1ms  
DC  
T
A
=25
℃  
Single pulse  
T
A
(
℃
)  
-V
DS
(V)  
0.1  
0.1  
0
1
10  
0
25  
50  
75  
100  
125  
150  
Figure.11:
Maximum Effective Transient  
Thermal Impedance, Junction-to-Ambient  
Zth
J-A
(
℃
/W)  
10

2  

10

1  

10

0  

D=0.5  
D=0.2  
t1  
D=0.1  
t2  
D=0.05  
D=0.02  
D=0.01  
10

-1  

10

-2  

Notes:  
Single pulse
 
1.Duty factor D=t1/t2  
2.Peak T
J
=P
DM
*Z
thJA
+T
A  
T
P
(s)  
10

-1  

10

-4  

10

-3  

10

-2  

10

0  

10

1  

10

2  

4/5  

Package Mechanical Data:  
TO-252-3L  
Dimensions In Millimeters  
Dimensions In Inches  
Min.  
Symbol  
Min.  
Max.  
2.400  
0.127  
0.860  
0.580  
6.700  
5.460  
Max.  
0.094  
0.005  
0.034  
0.023  
0.264  
0.215  
A
A1  
b
2.200  
0.000  
0.660  
0.460  
6.500  
5.100  
0.087  
0.000  
0.026  
0.018  
0.256  
0.201  
c
D
D1  
D2  
E
4.830 TYP.  
0.190 TYP.  
6.000  
2.186  
9.800  
6.200  
2.386  
0.236  
0.086  
0.386  
0.244  
0.094  
0.409  
e
L
10.400  
L1  
L2  
L3  
L4  
Φ
θ
2.900 TYP.  
1.600 TYP.  
0.114 TYP.  
0.063 TYP.  
1.400  
1.700  
0.055  
0.067  
0.600  
1.100  
0°  
1.000  
1.300  
8°  
0.024  
0.043  
0°  
0.039  
0.051  
8°  
h
0.000  
0.300  
0.000  
0.012  
V
5.350 TYP.  
0.211 TYP.  
5/5