Tritech-MOS-TM02N02I

Part #Tritech-MOS-TM02N02I
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Tritech-MOS-TM02N02I
-Channel Enhancement Mosfet  
N
TM02N02I  
Product Summary  
General Description  
• Low R  
DS(ON)  
• RoHS and Halogen-Free Compliant  
V

DS

= 20V
 
I

D

=2.3A  
(typ.)  
R

DS(ON)

=50 mΩ  
@ V

GS

=4.5V  
Applications  
• Load switch  
• PWM  
100% UIS Tested  
100% R

g

Tested  
I
:
S
O
T
–
2
3  
D
S
G
Marking: A2SHB
 
OR 02N02  
Absolute Maximum Ratings (T

C

=25
℃
unless otherwise noted)  
Symbol  
V

DS  

Parameter  
Rating  
Units  
V
Drain-Source Voltage  
2 0  
±
12  
V

GS  

Gate-Sou
r
ce Voltage  
V
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

2.3  
A
0.95  
A
8
A
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

3  

0.85  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
Max.  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction Case

1  

—  
162  
R
1/5  

-Channel Enhancement Mosfet  
N
TM02N02I  
Electrical Characteristics
(T

J

=25
℃
unless otherwise specified)  
Symbol  
Parameter  
Test Condition  
Min.  
Typ.  
Max.  
Units  
Off Characteristic  
V

(BR)DSS  

I

DSS  

Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
V

GS

=0V,I

D

=250μA  
V

DS

=20V, V

GS

= 0V,  
V

DS

=0V,V

GS

= ±12V  
20  
–
–
–
–
–
V
1.0  
μA  
nA  
I

GSS  

–
±100  
On Characteristics  
V

GS(th)

Gate Threshold Voltage  
V

DS

= V

GS

, I

D

=250μA  
V

GS

=4.5V, I

D

=3A  
V

GS

=2.5V, I

D

=2A  
0.4  
0.7  
50  
70  
1.0  
70  
V
–
–
Static Drain-Source on-Resistance  
R

DS(on)  

mΩ  
note2  
95  
Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
–
–
–
–
–
–
124  
28  
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
V

DS

=10V, V

GS

=0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
25  
2.7  
0.4  
0.5  
V

DS

=10V, I

D

=3A,  
V

GS

=4.5V  
Q

gs  

Q

gd  

Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
Switching Characteristics  
t

d(on)

Turn-on Delay Time  
t

r  

t

d(off)  

t

f  

–
–
–
–
4
–
–
–
–
ns  
ns  
ns  
ns  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
30  
10  
3.5  
V

DS

=10V,I

D

=3A,  
R

GEN

=3Ω, V

GS

=4.5V  
Drain-Source Diode Characteristics and Maximum Ratings  
Maximum Continuous Drain to Source Diode Forward  
I

S  

–
–
–
–
–
–
2.3  
10  
A
A
V
Current  
I

SM  

Maximum Pulsed Drain to Source Diode Forward Current  
Drain to Source Diode Forward  
V

GS

= 0V, I

S

=3A  
V

SD  

1.2  
Voltage  
Notes:1. Repetitive Rating: Pulse Width Limited by Maximum Junction
T
e
mperature  
2. Pulse
T
est: Pulse Width≤300μs, Duty Cycle≤0.5%  
2/5  

-Channel Enhancement Mosfet  
N
TM02N02I  
Typical Performance Characteristics  
Figure 2:
Typical Transfer Characteristics  
Figure1:
Output Characteristics  
I
D
(A)  
25  
I
D
(A)  
25  
20  
15  
10  
5
4.5V  
20  
3V  
15  
2.5V  
10  
25
℃
 
2.0V  
T
J
=125
℃  
5
V
GS
=1.5V  
V
GS
(V)  
V
DS
(V)  
0
0
0
1
2
3
4
5
0
0.5  
1.0  
1.5  
2.0  
2.5  
1.2  
20  
Figure 3:
On-resistance vs. Drain Current  
R
DS(ON)
(mΩ)  
Figure 4
: Body Diode Characteristics  
I
S
(A)  
10  
90  
80  
70  
60  
50  
40  
30  
V
GS
=2.5V  
125
℃  
T
J
=25
℃  
1
V
GS
=4.5V  
I
D
(A)  
V
SD
(V)  
0.1  
0.2  
0.4  
0.6  
0.8  
1.0  
0
1.5  
3.0  
4.5  
6.0  
Figure 5:
Gate Charge Characteristics  
Figure 6:
Capacitance Characteristics  
V
GS
(V)  
C(pF)  
10

3  

10

2  

4.5  
3.6  
2.7  
1.8  
V
GS
=4.5V  
I
D
=3A  
C
iss  
C
oss  
C
rss  
10

1  

0.9  
0
V
DS
(V)  
Q
g
(nC)  
10

0  

0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
4
8
12  
16  
3/5  

-Channel Enhancement Mosfet  
N
TM02N02I  
Figure 7:
Normalized Breakdown Voltage vs.  
Junction Temperature  
Figure 8:
Normalized on Resistance vs.  
Junction Temperature  
V
BR(DSS)  
1.3  
R
DS
(on)  
2.5  
1.2  
1.1  
1.0  
2.0  
1.5  
1.0  
0.5  
0.9  
Tj (
℃
)  
Tj (
℃
)  
0
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
Figure 9:
Maximum Safe Operating Area  
Figure 10:
Maximum Continuous Drain Current  
vs. Ambient Temperature  
I
D
(A
)
 
I
D
(A
)  
3.6  
100  
10  
1
Limited by
R
DS(on)  
3.0  
2.4  
1.8  
100μs  
1ms  
10ms  
1.2  
100ms  
T
A
=25
℃  
0.1  
Single pulse  
0.6  
0
DC  
T
A
(
℃
)  
V
DS
(V)  
0.01  
0.1  
1
10  
100  
0
25  
50  
75  
100  
125  
150  
Figure.11:
Maximum Effective Transient Thermal  
Impedance, Junction-to-Ambient  
Zth
J-A
(
℃
/W)  
10

3  

10

2  

10

1  

D=0.5  
D=0.2  
t1  
D=0.1  
t2  
10

0  

D=0.05  
D=0.02  
D=0.01  
Single pulse  
Notes:  
1.Duty factor D=t1/t2  
2.Peak T
J
=P
DM
*Z
thJA
+T
A  
10

-1  

T
P
(s)  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

10

2  

4/5  

Package Mechanical Data SOT-23  
:
Dimensions in Millimeters  
Symbol  
MIN.  
MAX.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
A
A1  
A2  
b
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
c
D
E
E1  
e
0.950TYP  
0.550REF  
e1  
L
1.800  
2.000  
L1  
θ
0.300  
0°  
0.500  
8°  
5/5