Tritech-MOS-TM09N02I

Part #Tritech-MOS-TM09N02I
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Tritech-MOS-TM09N02I
TM09N02I  
-Channel Enhancement Mosfet  
N
Product Summary  
General Description  
• Low R  
DS(ON)  
• RoHS and Halogen-Free Compliant  
V

DS

= 20V
 
I

D

=9.0A  
(
Typ
.)  
R

DS(ON)

=11 mΩ  
@ V

GS

=4.5V  
Applications  
• Load switch  
• PWM  
100% UIS Tested  
100% R

g

Tested  
I
:
S
O
T
–
2
3  
D
S
G
Marking: 07N02
 
OR 2312  
Absolute Maximum Ratings (T

C

=25
℃
unless otherwise noted)  
Symbol  
V

DS  

Parameter  
Rating  
Units  
Drain-Source Voltage  
20  
±
12  
7.5  
V
V
V

GS  

Gate-Sou  
r
ce Voltage  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 4.5V

1  

Continuous Drain Current, V

GS

@ 4.5V

1  

Pulsed Drain Current

2  

A
5.0  
A
32  
A
Total Power Dissipation

3  

2
W
W
℃
℃
P

D

@T

A

=25
℃  
P

D

@T

A

=70
℃  
T

STG  

Total Power Dissipation

3  

0.66  
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
Parameter  
Max.  
Unit  
Thermal Resistance Junction-ambient

1  

120  
℃
/W  
R

θJA  

1/5  

TM09N02I  
-Channel Enhancement Mosfet  
N
Electrical Characteristics
(T

J

=25
℃
unless otherwise specified)  
Symbol  
Parameter  
Test Condition  
Min.  
Typ.  
Max.  
Units  
Off Characteristic  
V

GS

=0V, I

D

=250μA  
V

DS

=20V, V

GS

=0V,  
V

DS

=0V, V

GS

=±12V  
V

(BR)DSS  

I

DSS  

Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
20  
–
–
–
–
–
V
1.0  
μA  
nA  
I

GSS  

–
±100  
On Characteristics  
V

DS

=V

GS

, I

D

=250μA  
V

GS

=4.5V, I

D

=8A  
V

GS

=2.5V, I

D

=5A  
V

GS(th)  

R

DS(on)  

Gate Threshold Voltage  
0.5  
0.7  
11  
15  
1.2  
16  
V
–
–
Static Drain-Source on-Resistance  
note2  
mΩ  
22.5  
Dynamic Characteristics  
C

iss  

Input Capacitance  
–
–
–
–
–
–
700  
132  
114  
15  
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
V

DS

=10V, V

GS

=0V,  
f=1.0MHz  
C

oss  

Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C

rss  

Q

g  

V

DS

=10V, I

D

=4A,  
V

GS

=4.5V  
Q

gs  

Q

gd  

Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
2
5.2  
Switching Characteristics  
Turn-on Delay Time  
–
–
–
–
9
–
–
–
–
ns  
ns  
ns  
ns  
t

d(on)  

t

r  

t

d(off)  

t

f  

V

DS

=10V,  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
25  
37  
14  
I

D

=4A, R

GEN

=3Ω,  
V

GS

=4.5V  
Drain-Source Diode Characteristics and Maximum Ratings  
Maximum Continuous Drain to Source Diode Forward  
I

S  

–
–
–
–
–
–
9.0  
32  
A
A
V
Current  
I

SM  

Maximum Pulsed Drain to Source Diode Forward Current  
Drain to Source Diode Forward  
V

GS

=0V, I

S

=8A  
V

SD  

1.2  
Voltage  
Notes:1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature  
2. Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%  
2/5  

TM09N02I  
-Channel Enhancement Mosfet  
N
Typical Performance Characteristics  
Figure 2:
Typical Transfer Characteristics  
Figure1:
Output Characteristics  
I

D

(A)  
I

D

(A)  
25  
25  
20  
15  
10  
5
2.5V  
20  
2.0V  
4.5V  
15  
10  
V

GS

=1.5V  
125
℃
 
25
℃  
5
0
V

GS

(V)  
V

DS

(V)  
0
0
0.5  
1
1.5  
2
2.5  
0
0.5  
1
1.5  
2.0  
2.5  
3.0  
Figure 3:
On-resistance vs. Drain Current  
R

DS(ON)

(mΩ)  
Figure 4
: Body Diode Characteristics  
I

S

(A)  
21  
1E+01  
1E+00  
1E-01  
18  
V

GS

=2.5V  
15  
12  
9
T

J

=125
℃  
25
℃  
1E-02  
1E-03  
V

GS

=4.5V  
1E-04  
1E-05  
I

D

(A)  
V

SD

(V)  
6
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
0
2
4
6
8
10  
12  
Figure 5:
Gate Charge Characteristics  
Figure 6:
Capacitance Characteristics  
V

GS

(V)  
C(pF)  
5
4
3
2
V

DS

=10V  
I

D

=4A  
10

3  

C

iss  

C

oss  

C

rss  

10

2  

10

1  

1
0
V

DS

(V)  
Q

g

(nC)  
0
3
6
9
12  
15  
0
4
8
12  
16  
20  
3/5  

TM09N02I  
-Channel Enhancement Mosfet  
N
Figure 8:
Normalized on Resistance vs.  
Figure 7:
Normalized Breakdown Voltage vs.  
Junction Temperature  
Junction Temperature  
R

DS

(on)  
V
BR(DSS)  
1.3  
2.5  
1.2  
1.1  
1.0  
2.0  
1.5  
1.0  
0.5  
0.9  
Tj (
℃
)  
Tj (
℃
)  
0
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
Figure 10:
Maximum Continuous Drain Current  
vs. Ambient Temperature  
Figure 9:
Maximum Safe Operating Area  
I

D

(A
)
 
I

D

(A
)  
10  
8
10

2  

10μs  
10

1  

10

0  

100μs  
6
1ms  
4
10ms  
Limited by R

DS(on)  

10

-1  

10

-2  

DC  
T

A

=25
℃  
Single pulse  
2
0
T

A

(
℃
)  
V

DS

(V)  
1
0.01  
0.1  
10  
0
25  
50  
75  
100  
125  
150  
Figure.11:
Maximum Effective Transient Thermal  
Impedance, Junction-to-Ambient  
Zth

J-A

(
℃
/W)  
10

3  

10

2  

10

1  

D=0.5  
t1  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
t2  
10

0  

Notes:  
Single pulse 1.Duty factor D=t1/t2  
2.Peak T

J

=P

DM

*Z

thJA

+T

A  

10

-1  

T

P

(s)  
10

-6  

10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

4/5  

Package Mechanical Data SOT-23  
:
Dimensions in Millimeters  
Symbol  
MIN.  
MAX.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
A
A1  
A2  
b
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
c
D
E
E1  
e
0.950TYP  
0.550REF  
e1  
L
1.800  
2.000  
L1  
θ
0.300  
0°  
0.500  
8°  
5/5