Tritech-MOS-TM20H04DF

Part #Tritech-MOS-TM20H04DF
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Tritech-MOS-TM20H04DF
N
TM20H04DF  
N+
-Channel  
Enhancement Mosfet  
General Description  
Product Summary  
• Low R  
DS(ON)  
V

DS

= 40V
 
I

D

=20A  
• RoHS and Halogen-Free Compliant  
mΩ  
@ V

GS

=10V  
(
Typ
.)  
R

DS(ON)

=17  
Applications  
• Load switch  
• PWM  
100% UIS Tested  
100% R

g

Tested  
DF:DFN3x3_8L  
Marking:4886  
(T =25°C Unless Otherwise Noted)  
A
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
Units  
V
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
40  
±
20  
V

GS  

V
Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

33  
A
I

D

@T

C

=25
℃  
I

D

@T

C

=100
℃  
I

DM  

21  
A
55  
A
EAS  
Single Pulse Avalanche Energy

3  

Avalanche Current  
22.1  
10  
mJ  
A
I

AS  

Total Power Dissipation

4  

31.3  
2
W
W
℃
℃
P

D

@T

C

=25
℃  
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

4  

Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θJA  

Parameter  
Typ.  
—  
Max.  
60  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)

1  

Thermal Resistance Junction-Case

1  

R

θJC  

—  
5.5  
1/5  

N
TM20H04DF  
N+
-Channel  
Enhancement Mosfet  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
40  
—  
—  
1.0  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
BV

DSS  

Drain-Source Breakdown Voltage  
V
V

GS

=10V , I

D

=6A  
17  
26  
33  
2.5  
1
R

DS(ON)  

V

GS(th)  

I

DSS  

Static Drain-Source On-Resistance

2  

Gate Threshold Voltage  
m
 
V
V

GS

=4.5V , I

D

=5A  
25  
V

GS

=V

DS

, I

D

=250uA  
1.5  
—  
V

DS

=32V , V

GS

=0V , T

J

=25
℃
 
V

DS

=32V , V

GS

=0V , T

J

=55
℃  
Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=12A  
30  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
2.1  
3.8  
2.8  
1.1  
12.2  
5.3  
18  
—  
Q

g  

Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
—  
V

DS

=32V , V

GS

=4.5V , I

D

=6A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
—  
—  
V

DD

=20V , V

GS

=10V , R

G

=3.3
  
—  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
I

D

=1A  
—  
9
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
376  
240  
19  
—  
Output Capacitance  
Reverse Transfer Capacitance  
V

DS

=15V , V

GS

=0V , f=1MHz  
—  
pF  
—  
Diode Characteristics  
Symbol  
Parameter  
Continuous Source Current

1,5  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
20  
Unit  
A
I

S  

V

SD  

t

rr  

—  
—  
1.2  
—  
V
—  
20  
nS  
nC  
Q

rr  

I
F
=6A , dI/dt=100A/µs , T

J

=25
℃  
—  
35  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=25V,V

GS

=10V,L=0.1mH,I

AS

=10A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2/5  

N
TM20H04DF  
N+
-Channel  
Enhancement Mosfet  
Typical Characteristics  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs G-S Voltage  
Fig.3 Source Drain Forward Characteristics  
Fig.4 Gate-Charge Characteristics  
Fig.5 Normalized V

GS(th)

vs T

J  

Fig.6 Normalized R

DSON

vs T

J  

3/5  

N
TM20H04DF  
N+
-Channel  
Enhancement Mosfet  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P

DM  

T

ON  

SINGLE  
0.01  
T
D = T

ON

/T  
T

Jpeak

= T

C

+P

DM

XR

θJC  

0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
1
BV

DSS  

BV

DSS

-V

DD  

EAS=  
BV

DSS  

L x I

AS

2

x  
2
V
DS  
90%  
V

DD  

I

AS  

10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

V

GS  

Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching Waveform  
4/5  

_
8L  
:
Package Mechanical Data DFN3x3  
Common  
mm  
Symbol  
Mim  
0.70  
/
Nom  
0.75  
/
Max  
0.85  
0.05  
0.40  
0.25  
3.45  
3.25  
2.65  
3.45  
3.20  
1.94  
0.65  
0.77  
0.30  
0.70  
0.89  
0.50  
0.20  
0.13  
14  
A
A1  
b
c
D
D1  
D2  
E
E1  
E2  
E3  
E4  
E5  
e
0.20  
0.10  
3.15  
3.00  
2.29  
3.15  
2.90  
1.54  
0.28  
0.37  
0.10  
0.60  
0.59  
0.30  
0.06  
0
0.30  
0.152  
3.30  
3.15  
2.45  
3.30  
3.05  
1.74  
0.48  
0.57  
0.20  
0.65  
0.69  
0.40  
0.125  
0.075  
12  
K
L
L1  
t
Φ
10  
5/5