Tritech-MOS-TM30N10D

Part #Tritech-MOS-TM30N10D
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Tritech-MOS-TM30N10D
-Channel  
N
TM30N10D  
Enhancement Mosfet  
General Features  
General Description  
V

DS

=100V I
 

D

=30A  
• Low R  
DS(ON)  
• RoHS and Halogen-Free Compliant  
=
32
mΩ(typ.)@V

GS

=10V  
R

DS(ON)  

Applications  
• Load switch  
• PWM  
100% UIS Tested  
100% R

g

Tested  
D:TO-252-3L  
D
D
D
S
G
Marking 30N10  
Absolute Maximum Ratings (T

C

=25
℃
unless otherwise noted)  
Symbol  
Parameter  
Rating  
100  
±
20  
30  
Units  
V

DS  

Drain-Source Voltage  
V
V
V

GS  

I

D

@T

C

=25
℃  
I

D

@T

C

=100
℃  
I

DM  

Gate-Sou
r
ce Voltage  
Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

A
15  
A
80  
A
EAS  
Single Pulse Avalanche Energy

3  

4 0  
mJ  
A
I

AS  

Avalanche Current  
30  
43.7  
P

D

@T

C

=25
℃  
T

STG  

Total Power Dissipation

3  

W
℃
℃
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θJA  

Parameter  
Typ.  
—  
Max.  
50  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

R

θJC  

—  
3.0  
1/5  

-Channel  
N
TM30N10D  
Enhancement Mosfet  
Electrical Characteristics
(
T

J

= 25°C, unless otherwise noted
)  
Parameter  
Symbol  
Test Conditions  
Min.
Typ. Max. Unit  
Static Characteristics  
V

(BR)DSS  

l

GSS  

Drain-Source Breakdown Voltage  
Gate-body Leakage current  
V

GS

= 0V, I

D

= 250µA  
V

DS

= 0V, V

GS

= ±20V  
100  
–
–
–
±100  
1
V
–
nA  
T

J

=25°C  
T

J

=100°C  
–
–
Zero Gate Voltage Drain  
Current  
I

DSS  

V

GS(th)  

R

DS(on)  

g

fs  

V

DS

=100V, V

GS

= 0V  
μA  
V
–
–
100  
2.5  
45  
75  
–
Gate-Threshold Voltage  
V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10V, I

D

= 5A  
V

GS

= 4.5V, I

D

= 3A  
V

DS

=5V , I

D

=5A  
1.2  
–
–
–
–
32  
38  
12  
Drain-Source on-Resistance

4  

Forward Transconductance

4  

mΩ  
S
Dynamic Characteristics

5  

Input Capacitance  
C

iss  

C

oss  

C

rss  

R

g  

–
–
–
–
2420  
99  
–
–
–
–
V

DS

= 15V, V

GS

=0V,  
f =1MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
84  
f =1MHz  
1.3  
Switching Characteristics

5  

Total Gate Charge  
Q

g  

Q

gs  

Q

gd  

–
–
–
40.6  
8
–
–
–
V

GS

= 10V, V

DS

= 50V,  
I

D

=5A  
Gate-Source Charge  
Gate-Drain Charge  
nC  
ns  
6.7  
t

d(on)  

Turn-On Delay Time  
–
8.7  
–
t

r  

t

d(off)  

t

f  

Rise Time  
–
–
–
41  
40  
32  
–
–
–
V

GS

=10V, V

DD

=50V,  
R

G

= 3Ω, I

D

= 5A  
Turn-Off Delay Time  
Fall Time  
Drain-Source Body Diode Characteristics  
Diode Forward Voltage

4  

V

SD  

I

S  

I

S

= 1A, V

GS

= 0V  
–
–
–
–
–
1.2  
30  
V
A
Continuous Source Current  
T

C

=25°C  
Notes:  
1. Repetitive rating, pulse width limited by junction temperature T

J(MAX)

=150°C.  
2.The data tested by pulsed , pulse width ≤ 300us , duty cycle ≤ 2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=25V,V

GS

=10V,L=0.1mH,I

AS

=8A  
4.The power dissipation is limited by 150°C junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2/5  

-Channel  
N
TM30N10D  
Enhancement Mosfet  
Typical Characteristics  
20  
20  
V
GS
= 10V  
V

DS

= 5V  
V

GS

= 4.5V  

GS

= 3.5V  
V
15  
10  
5
15  
10  
5
V

GS

= 3V  
0
0
0
1
2
3
4
5
0
1
2
3
4
5
Drain−source voltage V

DS

(V)  
Gate−source voltage V

GS

(V)  
Figure 1. Output Characteristics  
Figure 2. Transfer Characteristics  
10  
300  
250  
200  
150  
100  
50  
I
D
= 5A  
1
0.1  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
3
6
9
12  
15  
Gate−source voltage V

GS

(V)  
Source−drain voltage V

SD

(V)  
Figure 3. Forward Characteristics of Reverse  
Figure 4. R

DS(ON)

vs. V

GS  

150  
120  
90  
60  
30  
0
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V

GS

= 4.5V  
V

GS

= 10V  
0
2
4
6
8
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Drain current I
D
(A)  
Temperature T

j

(
°
C
)  
Figure 5. R

DS(ON)

vs. I

D  

Figure 6. Normalized R

DS(on)

vs. Temperature  
3/5  

-Channel  
N
TM30N10D  
Enhancement Mosfet  
10  
8
10000  
1000  
100  
V
DS
= 50V  
= 5A  
I
D
Ciss  
6
Coss  
Crss  
4
10  
2
F=1.0MHz  
1
0
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
Drain-source voltage V

DS

(
V
)  
Q

g

−Toal Gate Charge (nC)  
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
50  
40  
100  
10  
10μs  
30  
20  
10  
100μs  
1ms  
DC  
1
0.1  
10ms  
Limited by R

DS(on)  

Single Pulse  
T

C

=25  
T

J

=150  
℃
℃
0
0.01  
0
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
1000  
Case Temperature T

C

(
°
C)  
Drain−source voltage V

DS

(V)  
Figure 9. Power Dissipation  
Figure10. Safe Operating Area  
10  
1
Duty = 1.0  
Duty = 0.5  
Duty = 0.2  
Duty = 0.1  
Duty = 0.05  
0.1  
Duty = 0.02  
Duty = 0.01  
0.01  
e P  
ulse  
S
ngl  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t, Pulse Width(S)  
Figure 11. Normalized Maximum Transient Thermal Impedance  
4/5  

Package Mechanical Data:  
TO-252-3L  
Dimensions In Millimeters  
Dimensions In Inches  
Min.  
Symbol  
Min.  
Max.  
2.400  
0.127  
0.860  
0.580  
6.700  
5.460  
Max.  
0.094  
0.005  
0.034  
0.023  
0.264  
0.215  
A
A1  
b
2.200  
0.000  
0.660  
0.460  
6.500  
5.100  
0.087  
0.000  
0.026  
0.018  
0.256  
0.201  
c
D
D1  
D2  
E
4.830 TYP.  
0.190 TYP.  
6.000  
2.186  
9.800  
6.200  
2.386  
0.236  
0.086  
0.386  
0.244  
0.094  
0.409  
e
L
10.400  
L1  
L2  
L3  
L4  
Φ
θ
2.900 TYP.  
1.600 TYP.  
0.114 TYP.  
0.063 TYP.  
1.400  
1.700  
0.055  
0.067  
0.600  
1.100  
0°  
1.000  
1.300  
8°  
0.024  
0.043  
0°  
0.039  
0.051  
8°  
h
0.000  
0.300  
0.000  
0.012  
V
5.350 TYP.  
0.211 TYP.  
5/5