Tritech-MOS-TM90P03NF
| Part # | Tritech-MOS-TM90P03NF |
| Download | Tritech-MOS-TM90P03NF |
-Channel
TM90P03NF
P
Enhancement Mosfet
General Description
General Features
=
D
• Low R
DS(ON)
V
DS
= -30V
I -90
A
• RoHS and Halogen-Free Compliant
DS(ON)
R
= 3.6m
Ω
(typ.) @ V
GS
=-10V
Applications
• Load switch
• PWM
100% UIS Tested
100% R
g
Tested
NF:DFN5x6-8L
Marking: 90P03
Absolute Maximum Ratings
(T
A
= 25
°
C Unless Otherwise Noted)
Parameter
Drain-Source Voltage
Symbol
V
DS
Value
-30
Unit
V
V
GS
Gate-Source Voltage
±20
V
T
C
=25°C
-90
I
D
Continuous Drain Current
A
T
C
=100°C
-57
-360
Pulsed Drain Current
1
A
I
DM
Single Pulse Avalanche Energy
2
Total Power Dissipation
125
mJ
W
EAS
P
D
T
C
=25°C
60
Operating Junction and Storage Temperature Range
-55 to 150
°C
T
J
,
T
STG
Thermal Characteristics
Parameter
Symbol
R
θJA
Value
55
Unit
°C/W
°C/W
Thermal Resistance from Junction-to-Ambient
3
Thermal Resistance from Junction-to-Case
R
θJC
2.08
1/6
-Channel
TM90P03NF
P
Enhancement Mosfet
Electrical Characteristics
(T
J
= 25°C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min. Typ. Max. Unit
Static Characteristics
V
(BR)DSS
l
GSS
Drain-Source Breakdown Voltage
Gate-body Leakage current
V
GS
= 0V, I
D
= -250µA
V
DS
= 0V, V
GS
= ±20V
-30
–
–
–
±100
-1
V
–
nA
T
J
=25°C
T
J
=100°C
–
–
Zero Gate Voltage Drain
Current
I
DSS
V
GS(th)
R
DS(on)
g
fs
V
DS
= -30V, V
GS
= 0V
μA
V
–
–
-100
-2.5
5.5
6.9
–
Gate-Threshold Voltage
V
DS
= V
GS
, I
D
= -250µA
V
GS
= -10V, I
D
= -30A
-1.0
-1.6
3.6
5.5
90
–
–
–
Drain-Source On-Resistance
4
mΩ
S
V
GS
= -4.5V, I
D
= -15A
Forward Transconductance
4
Dynamic Characteristics
5
Input Capacitance
V
DS
= -10V, I
D
= -30A
C
iss
C
oss
C
rss
R
g
–
–
–
–
5070
695
580
4
–
–
–
–
V
DS
= -15V, V
GS
=0V,
Output Capacitance
pF
f =1MHz
Reverse Transfer Capacitance
Gate resistance
f =1MHz
Ω
Switching Characteristics
5
Total Gate Charge
Q
g
Q
gs
Q
gd
–
–
–
146
21.5
39
–
–
–
V
GS
= -10V,V
DS
= -15V,
Gate-Source Charge
Gate-Drain Charge
nC
ns
I
D
= -30A
t
d(on)
Turn-On Delay Time
–
23
–
t
r
t
d(off)
t
f
Rise Time
–
–
–
15
129
28
–
–
–
V
GS
= -10V, V
DD
= -15V,
R
G
= 3
Ω
, I
D
= -30A
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Diode Forward Voltage
4
I
S
= -30A, V
GS
= 0V
–
–
–
–
–
-1.2
-90
V
A
V
SD
I
S
Continuous Source Current
T
C
=25°C
Note :
1. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C
2. The EAS data shows Max. rating . The test condition is V
DD
= -25V, V
GS
= -10V, L= 0.1mH, I
AS
= -50A
3. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, The value in any given application depends on the
user’s specific board design.
2/6
-Channel
TM90P03NF
P
Enhancement Mosfet
Typical Characteristics
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
Figure 3. Forward Characteristics of Reverse
Figure 4. Gate Charge Characteristics
Figure 5. R
DS(on)
vs. V
GS
Figure 6. R
DS(on)
vs. I
D
3
3/6
-Channel
TM90P03NF
P
Enhancement Mosfet
Figure 7. Capacitance Characteristics
Figure 8. Safe Operating Area
Figure 9. Normalized Maximum Transient Thermal Impedance
Figure 10. Switching Time Waveform
Figure 11. Unclamped Inductive Switching
4
4/6
-Channel
TM90P03NF
P
Enhancement Mosfet
Test Circuit
V
GS
Qg
V
DS
Qgs
V
GS
Qgd
DUT
I
G
=const
Figure A. Gate Charge Test Circuit & Waveforms
R
L
V
DS
V
DD
V
GS
R
G
DUT
V
GS
Figure B. Switching Test Circuit & Waveforms
L
V
DS
I
D
R
G
V
DD
DUT
V
GS
tp
Figure C. Unclamped Inductive Switching Circuit & Waveforms
5/6
Package Mechanical Data DFN5x6-8L
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