Tritech-MOS-TMN3020DF
| Part # | Tritech-MOS-TMN3020DF |
Download  | Tritech-MOS-TMN3020DF |
-Channel
N
Enhancement Mosfet
TMN3020DF
General Description
General Features
• Low R
DS(ON)
V
DS
= 30V
I
D
=20A
• RoHS and Halogen-Free Compliant
(
typ
.
)
R
DS(ON)
= 15 mΩ
@ V
GS
=10V
Applications
• Load switch
• PWM
100% UIS Tested
100% R
g
Tested
DF:DFN3x3_8L
Marking: 20N03
(T
A
= 25
°
C Unless Otherwise Noted)
Absolute Maximum Ratings
Rating
Steady State
Parameter
Units
Symbol
V
DS
10s
Drain-Source Voltage
30
±
20
20
V
V
V
GS
Gate-Sou
r
ce Voltage
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Pulsed Drain Current
2
I
D
@T
C
=25
℃
A
I
D
@T
C
=100
℃
A
8
I
DM
38
A
28
EAS
Single Pulse Avalanche Energy
3
Avalanche Current
mJ
A
I
AS
P
D
@T
C
=25
℃
T
STG
13.8
5.5
Total Power Dissipation
4
W
℃
℃
Storage Temperature Range
Operating Junction Temperature Range
-55 to 175
-55 to 175
T
J
Thermal Data
Symbol
Parameter
Typ.
Max.
Unit
R
θJC
Thermal Resistance Junction-Case
1
—
℃
/W
36
1/6
-Channel
N
Enhancement Mosfet
TMN3020DF
Electrical Characteristics
(T
J
=25
℃
unless otherwise specified)
Symbol
Parameter
Test Condition
Min.
Typ.
Max. Units
Off Characteristic
V
(BR)DSS
I
DSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Body Leakage Current
V
GS
=0V, I
D
=250μA
V
DS
=30V, V
GS
= 0V,
V
DS
=0V, V
GS
= ±20V
30
–
–
–
–
–
V
1.0
μA
nA
I
GSS
–
±100
On Characteristics
V
GS(th)
Gate Threshold Voltage
V
DS
=V
GS
, I
D
=250μA
V
GS
=10V, I
D
=5A
V
GS
=4.5V, I
D
=3A
1.0
1.5
15
21
2.5
20
29
V
–
–
Static Drain-Source on-Resistance
R
DS(on)
mΩ
note3
Dynamic Characteristics
C
iss
C
oss
C
rss
Q
g
Input Capacitance
–
–
–
–
–
–
490
79
–
–
–
–
–
–
pF
pF
pF
nC
nC
nC
V
DS
=15V, V
GS
=0V,
f=1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
61
10
V
DS
=15V, I
D
=5.8A,
V
GS
=10V
Q
gs
Q
gd
Gate-Source Charge
Gate-Drain(“Miller”) Charge
1.7
2.5
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
–
–
–
–
6
–
–
–
–
ns
ns
ns
ns
15
17
17
V
DS
=15V, I
D
=3A,
V
GS
=10V, R
REN
=3Ω
Drain-Source Diode Characteristics and Maximum Ratings
Maximum Continuous Drain to Source Diode Forward
I
S
–
–
–
–
–
–
–
20
36
1.2
–
A
A
Current
I
SM
V
SD
trr
Maximum Pulsed Drain to Source Diode Forward Current
Drain to Source Diode Forward
V
GS
=0V, I
S
=9A
–
V
Voltage
Body Diode Reverse Recovery Time
7
2
ns
nC
I
F
=5A, dI/dt=100A/μs
Body Diode Reverse Recovery
Charge
Qrr
–
Notes:1. Repetitive Rating: Pulse Width Limited by Maximum Junction
T
e
mperature
2. EAS condition : T
J
=25
℃
,V
DD
=15V,V
G
=10V,L=0.5mH,Rg=25Ω,I
AS
=6A
3. Pulse
T
est: Pulse Width≤300μs, Duty Cycle≤0.5%
2/6
-Channel
N
Enhancement Mosfet
TMN3020DF
Typical Performance Characteristics
Figure 2:
Typical Transfer Characteristics
Figure1:
Output Characteristics
I
D
(A)
25
I
D
(A)
25
20
10V
4.5V
20
3.5V
4V
15
15
125
℃
25
℃
3V
10
5
10
5
2.5V
V
GS
(V)
V
DS
(V)
0
0
0
1
2
3
4
5
0
1.0
2.0
3.0
4.0
5.0
6.0
1.8
25
Figure 4
: Body Diode Characteristics
Figure 3:
On-resistance vs. Drain Current
I
S
(A)
R
DS(ON)
(mΩ)
10
3
40
32
24
16
8
10
2
10
1
10
0
V
GS
=4.5V
T
J
=125
℃
T
J
=25
℃
V
GS
=10V
V
GS
=0V
1.6
I
D
(A)
V
SD
(V)
1.0
0
0.2
0.4
0.6
0.8
1.2
1.4
0
3
6
9
12
Figure 5:
Gate Charge Characteristics
Figure 6:
Capacitance Characteristics
V
GS
(V)
C(pF)
10
8
V
DS
=15V
I
D
=5.8A
C
iss
1000
6
4
C
oss
100
10
C
rss
2
0
V
DS
(V)
Q
g
(nC)
0
2
4
6
8
10
12
0
5
10
15
20
3/6
-Channel
N
Enhancement Mosfet
TMN3020DF
Figure 7:
Normalized Breakdown Voltage vs.
Figure 8:
Normalized on Resistance vs.
Junction Temperature
Junction Temperature
V
BR(DSS)
1.3
R
DS
(on)
2.5
1.2
1.1
1.0
0.9
2.0
1.5
1.0
0.5
Tj (
℃
)
Tj (
℃
)
0
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
Figure 9:
Maximum Safe Operating Area
Figure 10:
Maximum Continuous Drain Current
vs. Ambient Temperature
I
D
(A
)
I
D
(A
)
10
100
10
8
6
4
10μs
100μs
1ms
1
Limited by R
DS(on)
10ms
100ms
T
A
=25
℃
Single pulse
0.1
.01
2
0
DC
T
A
(
℃
)
75 100
V
DS
(V)
1
0.01
0.1
10
100
0
25
50
125
150
175
Figure.11:
Maximum Effective Transient Thermal
Impedance, Junction-to-Ambient
Zth
J-A
(
℃
/W)
10
2
10
1
10
0
D=0.5
t1
D=0.2
D=0.1
t2
D=0.05
D=0.02
D=0.01
Single pulse
10
-1
10
-2
Notes:
1.Duty factor D=t1/t2
2.Peak T
J
=P
DM
*Z
thJA
+T
A
T
P
(s)
10
-2
10
-6
10
-5
10
-4
10
-3
10
-1
10
0
10
1
4/6
-Channel
N
Enhancement Mosfet
TMN3020DF
Test Circuit
Figure1:Gate Charge Test Circuit & Waveform
Figure 2: Resistive Switching Test Circuit & Waveforms
Figure 3:Unclamped Inductive Switching Test Circuit & Waveforms
5/6
_
Package Mechanical Dat
a
:
DFN3x3
8L
Common
mm
Symbol
Mim
0.70
/
Nom
0.75
/
Max
0.85
0.05
0.40
0.25
3.45
3.25
2.65
3.45
3.20
1.94
0.65
0.77
0.30
0.70
0.89
0.50
0.20
0.13
14
A
A1
b
c
D
D1
D2
E
E1
E2
E3
E4
E5
e
0.20
0.10
3.15
3.00
2.29
3.15
2.90
1.54
0.28
0.37
0.10
0.60
0.59
0.30
0.06
0
0.30
0.152
3.30
3.15
2.45
3.30
3.05
1.74
0.48
0.57
0.20
0.65
0.69
0.40
0.125
0.075
12
K
L
L1
t
Φ
10
6/6
