Tritech-MOS-TMN3030LD

Part #Tritech-MOS-TMN3030LD
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Tritech-MOS-TMN3030LD
-Channel  
N
TMN3030LD  
Enhancement Mosfet  
General Description  
General Features  
V

DS

=30V I

D  

• Low R

DS(ON)  

=30  
A
• RoHS and Halogen-Free Compliant  
R

DS(ON)

=
15
m
W
(
Typ
.) @ V

GS

=10V  
Applications  
• Load switch  
• PWM  
100% UIS Tested  
100% R

g

Tested  
D:TO-252-3L  
D
D
S
G
Marking: 30NL03  
Absolute Maximum Ratings
:
(T

C

=25
℃
unless otherwise noted)  
Symbol  
V

DS  

Parameter  
Ratings  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
30  
V
V
V

GS  

±
12  
Continuous Drain Current-T

C

=25
℃  
Continuous Drain Current-T

C

=100
℃  
Single Pulse Avalanche Energy

1  

Pulsed Drain Current

2  

30  
I

D  

A
16  
E

AS  

I

DM  

20  
90  
mJ  
A
P

D  

30  
W
℃
Power Dissipation,
T

C

=25
℃
 
T

J

, T

STG  

Operating and Storage Junction Temperature Range  
-55 to +150  
Thermal Characteristics
:  
Symbol  
R

Ɵ
JC  

Parameter  
Max  
Units  
Thermal Resistance,Junction to Case  
Thermal Resistance Junction to mbient  
4
–
℃
/W  
R

Ɵ
JA  

1/5  

-Channel  
N
TMN3030LD  
Enhancement Mosfet  
Electrical Characteristics
:
(T

A

=25
℃
unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
Off Characteristics  
Drain-Sourtce Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage Current  
V

GS

=0V,I

D

=250
μ
A  
V

GS

=0V, V

DS

=30V  
V

GS

=
±
12V, V

DS

=0A  
30  
—  
—  
—  
—  
—  
—  
1
V
BV

DSS  

μ
A  
nA  
I

DSS  

I

GSS  

±
100  
On Characteristics  
V

GS(th)  

GATE-Source Threshold Voltage  
Drain-Source On Resistance  
Drain-Source On Resistance  
Drain-Source On Resistance  
V

GS

=V

DS

, I

D

=250
μ
A  
V

GS

=10V,I

D

=10A  
V

GS

=4.5V,I

D

=8A  
V

GS

=2.5V,I

D

=6A  
0.5  
—  
—  
—  
0.9  
15  
21  
25  
1
V
22  
25  
35  
m
Ω  
m
Ω  
m
Ω  
R

DS(ON)  

Dynamic Characteristics  
Input Capacitance  
—  
—  
—  
550  
65  
—  
—  
—  
C

iss  

C

oss  

C

rss  

Output Capacitance  
V

DS

=15V, V

GS

=0V, f=1MHz  
pF  
Reverse Transfer Capacitance  
55  
Switching Characteristics  
Turn-On Delay Time  
—  
—  
—  
—  
—  
—  
—  
17  
48  
—  
—  
—  
—  
—  
—  
—  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
t

d(on)  

t

r  

t

d(off)  

t

f  

Rise Time  
V

GS

=4.5V ,V

DD

=15V, I

D

=2A  
R

GEN

=3.3
Ω
 
Turn-Off Delay Time  
Fall Time  
20  
13  
T
o
tal Gate Charge  
Gate-Source Charge  
Gate-Drain
“
Miller
”
Charge  
5.5  
1.2  
1.8  
Q

g  

V

GS

=4.5V, V

DS

=15V,  
I

D

=4A  
Q

gs  

Q

gd  

Drain-Source Diode Characteristics  
Source-Drain Diode Forward Voltage  
I

D

=30A  
—  
—  
—  
—  
9.1  
2
1.2  
—  
V
V

SD  

trr  
Reverse Recovery Time  
ns  
nC  
I F =10A,T J =25
℃  
diF/dt=100A/μs  
Reverse Recovery Charge  
—  
Qrr  
1.The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V DD =25V,V GS =10V,L=0.1mH,I AS =12.7A  
Notes:  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation.  
2/5  

-Channel  
N
TMN3030LD  
Enhancement Mosfet  
Typical Characteristics
:
(T

C

=25
℃
unless otherwise noted)  
Figure 2:
Typical Transfer Characteristics  
Figure1:
Output Characteristics  
I
D
(A)  
I
D
(A)  
25  
20  
25  
20  
4.5V  
10V  
3V  
2.5V  
15  
15  
125
℃
 
25
℃  
10  
5
10  
5
2V  
V
GS
(V)  
V
DS
(V)  
0
0
0
1
2
3
4
5
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
Figure 4
: Body Diode Characteristics  
I
S
(A)  
Figure 3:
On-resistance vs. Drain Current  
R
DS(ON)
(mΩ)  
10

3  

10

2  

10

1  

10

0  

60  
50  
40  
30  
T
J
=125
℃  
V
GS
=2.5V  
V
GS
=4.5V  
T
J
=25
℃  
20  
10  
V
GS
=10V  
V
GS
=0V  
1.6  
I
D
(A)  
V
SD
(V)  
1.0  
0
0.2  
0.4  
0.6  
0.8  
1.2  
1.4  
1.8  
0
1
2
3
4
5
Figure 5:
Gate Charge Characteristics  
Figure 6:
Capacitance Characteristics  
V
GS
(V)  
C(pF)  
10

4  

5
V
DS
=15V  
I
D
=4A  
4
3
2
C
iss  
10

3  

C
oss  
10

2  

1
0

1  

1
0
C
rss  
V
DS
(V)  
Q
g
(nC)  
0
1
2
3
4
5
0
5
10  
15  
20  
25  
3/5  

-Channel  
N
TMN3030LD  
Enhancement Mosfet  
Figure 8:  
Safe Operating Area  
Figure 7:
Normalized on Resistance vs.  
Junction Temperature  
100.00  
10.00  
1.00  
R
DS
(on)  
2.5  
100us  
1ms  
2.0  
1.5  
1.0  
10ms  
100ms  
DC  
0.10  
Tc=25

o

C  
Single Pulse  
Tj (
℃
)  
0.5  
-100  
0.01  
-50  
0
50  
100  
150  
200  
0.1  
1
10  
100  
1000  
V

DS

(V)  
Figure 9:  
Normalized Maximum Transient Thermal Impedance  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
P

DM  

T

ON  

0.02  
0.01  
T
D =
T

ON

/T  
SINGLE  
T

Jpeak

=
T

C

+P

D
M

XR

θJC  

0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Pulse Width (s)  
4/5  

Package Information:TO-252-3L  
Dimensions In Millimeters  
Dimensions In Inches  
Min.  
Symbol  
Min.  
2.200  
0.000  
0.660  
0.460  
6.500  
5.100  
Max.  
2.400  
0.127  
0.860  
0.580  
6.700  
5.460  
Max.  
0.094  
0.005  
0.034  
0.023  
0.264  
0.215  
A
A1  
b
0.087  
0.000  
0.026  
0.018  
0.256  
0.201  
c
D
D1  
D2  
E
4.830 TYP.  
0.190 TYP.  
6.000  
2.186  
9.800  
6.200  
2.386  
0.236  
0.086  
0.386  
0.244  
0.094  
0.409  
e
L
10.400  
L1  
L2  
L3  
L4  
Φ
θ
2.900 TYP.  
1.600 TYP.  
0.114 TYP.  
0.063 TYP.  
1.400  
1.700  
0.055  
0.067  
0.600  
1.100  
0°  
1.000  
1.300  
8°  
0.024  
0.043  
0°  
0.039  
0.051  
8°  
h
0.000  
0.300  
0.000  
0.012  
V
5.350 TYP.  
0.211 TYP.  
5/5