Truesemi-TSF20N65MR

Part #Truesemi-TSF20N65MR
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Truesemi-TSF20N65MR
TSF20N65MR  
6
5
0V N-Channel MOSFET  
General Description  
Features  
This Power MOSFET is produced using
 
Truesemi‘s  
• 20A,6
5
0V,R

DS(on)

=0.
48
Ω
@ V

GS

=10V  
• Low gate charge(typical
 
57nC)  
• High ruggedness  
• Fast switching  
• 100% avalanche tested  
• Improved dv/dt capability  
advanced planar stripe DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand
 
high energy pulse in
 
the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction based on
 
half bridge  
topology.  
Absolute Maximum Ratings  
T

C

=25
℃
unless otherwise specified  
Value  
Symbol  
V

DSS  

Parameter  
Units  
V
Drain-Source Voltage  
Gate-Source Voltage  
6
5
0  
V

GS  

30  
V
±
T

C

= 25
℃
 
20*  
A
I

D  

Drain Current  
T

C

= 100
℃  
12*  
A
I

DM  

E

AS  

Pulsed Drain Current  
76
*  
A
Single Pulsed Avalanche Energy  
Repetitive Avalanche Energy  
Repetitive avalanche current  
Power Dissipation (T

C

= 25
℃
)  
(Note 2)  
(Note 1)  
(Note 1)  
884  
mJ  
mJ  
A
E

AR  

4
20  
I

AR  

P

D  

W
℃
40  
T

J

, T

STG  

Operating and Storage Temperature Range  
-55 to +150  
* Drain current limited by maximum junction temperature.  
Thermal Resistance
 
Characteristics  
Value  
3.13  
62.5  
Symbol  
Parameter  
Units  
℃
/W  
℃
/W  
R

θ
JC  

Thermal Resistance,Junction-to-Case  
Thermal Resistance,Junction-to-Ambient  
R

θ
JA  

©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1  

Electrical Characteristics
T

C

=25
℃
unless otherwise specified  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max Units  
On Characteristics  
V

GS  

Gate Threshold Voltage  
V

DS

= V

GS

, I

D

= 250 uA
㎂
 
3
—  
5
V
Static Drain-Source  
On-Resistance  
R

DS(ON)  

V

GS

= 10 V, I

D

= 10A  
—  
0.
4
0  
0.
48  
Ω
Forward transfer conductance(note 3)  
g

fs  

—  
1
8
 
—  
S
V

DS

= 10 V, I

D

= 10A
 
(Note 3)  
Off Characteristics  
BV

DSS

Drain-Source Breakdown Voltage
 
V

GS

= 0 V, I

D

= 250 uA
㎂  
6
5
0  
—  
—  
—  
—  
—  
—  
—  
1
V
V

DS

= 6
5
0 V, V

GS

= 0 V  
I

DSS  

Zero Gate Voltage Drain Current  
uA  
—  
100  
100  
-100  
V

DS

= 6
5
0 V, T

C

=125
℃  
V

GS

= 30 V, V

DS

= 0 V  
V

GS

=- 30 V, V

DS

= 0 V  
Gate-Body Leakage Current,Forward  
Gate-Body Leakage Current,Reverse  
I

GSSF  

I

GSSR  

—  
nA
㎁  
nA
㎁  
—  
Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
—  
—  
5150  
264  
24  
—  
—  
—  
pF
㎊  
pF
㎊  
pF  
V

DS

= 25 V, V

GS

= 0 V,  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-On Time  
—  
—  
—  
—  
—  
—  
—  
197  
149  
468  
83  
—  
—  
ns  
V

DS

= 300 V, I

D

= 20A,  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
ns
㎱  
ns
㎱  
ns
㎱  
nC  
R

G

= 25 Ω  
(Note 3,4)  
—  
—  
Q

g  

Q

gs  

Q

gd  

57  
65  
—  
V

DS

= 480 V,
 
I

D

= 20A,  
V

GS

= 10 V  
23  
nC  
(Note 3,4)  
13  
—  
nC  
Source-Drain Diode Maximum Ratings and Characteristics  
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source-Drain Diode Forward Current  
Pulsed Source-Drain Diode Forward Current  
—  
—  
—  
—  
—  
—  
20  
72  
1.4  
—  
A
Source-Drain Diode Forward Voltage
 
I

S

= 20A, V

GS

= 0 V  
—  
V
Reverse Recovery Time  
I

S

=20A, V

GS

= 0 V  
435  
ns
㎱  
uC  
di

F

/dt = 100 A/μs
 
(Note 3,4)  
Reverse Recovery Charge  
—  
4.1  
—  
Q

rr  

Note:  
1. Repeated rating: Pulse width limited by safe operating area  
2. L=5mH, IAS=20A, VDD=50V, RG=25Ω, Starting TJ=25
℃  
3. Pulse test: Pulse width≤300us, Duty cycle≤2%  
4. Essentially independent of operating temperature typical characteristics  
©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1  

Typical Characteristics  
©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1  

Typical Characteristics  
©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1  

Fig 12.
 
Gate Charge Test Circuit
 
& Waveform  
V

GS  

Same Type  
50KΩ  
as DUT  
Q

g  

12V  
200nF  
10V  
300nF  
V

DS  

V

GS  

Q

gs  

Q

gd  

DUT  
3mA  
Charge  
Fig 13.
 
Resistive Switching Test Circuit
 
& Waveforms  
R

L  

V

DS  

90%  
V

DS  

V

DD  

( 0.5 rated V

DS  

)
R

G  

10%  
V

in  

DUT  
10V  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

on  

t

off  

Fig 14.
 
Unclamped Inductive Switching Test Circuit
 
& Waveforms  
L
1
2
2
—-  
E

AS  

=
L

L

I

AS  

V

DS  

V

DD  

BV

DSS  

I

AS  

I

D  

R

G  

I

D

(t)  
DUT  
V

DD  

V

DS

(t)  
10V  
t

p  

Time  
©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1  

Fig 15.
 
Peak Diode Recovery dv/dt Test Circuit
 
& Waveforms  
DUT  
+
V

DS  

_
I

S  

L
Driver  
R

G  

Same Type  
as DUT  
V

DD  

V

GS  

•
dv/dt controlled by
 
R

G  

•
I

S

controlled by pulse period  
Gate Pulse Width  
————————–  
V

GS  

D =  
Gate Pulse Period  
10V  
( Driver )  
I

FM

, Body Diode Forward Current  
I

S  

di/dt  
( DUT )  
I

RM  

Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V

f  

V

DS  

( DUT )  
V

DD  

Body Diode  
Forward Voltage Drop  
©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1  

Package Dimension  
TO-220F  
©
2018
Truesemi Semiconductor
 
Corporation  
Ver.B1