TWGMC-TW1504ESG

Part #TWGMC-TW1504ESG
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TWGMC-TW1504ESG
TW1504ESG  
N-Channel Enhancement Mode Power MOSFET  
Features  
General Description  
V

DS

= 20V,  
•
Load / power switching for portable devices  
•
Battery operated systems  
I

D

= 0.67A  
R

DS(ON)

@V

GS

= 4.5V, TYP 255
mΩ  
R

DS(ON)

@V

GS

= 2.5V, TYP 348
mΩ  
R

DS(ON)

@V

GS

= 1.8V, TYP 542
mΩ  
•
Power supply converter circuits  
Pin Configurations  
SOT523  
Absolute Maximum Ratings
@T

A

=25
℃
unless otherwise noted  
Parameter Symbol  
Ratings  
20  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
V

DSS  

V

GSS  

±
10  
0.67  
0.53  
2
V
T
A
=25°C  
T
A
=70°C  
Drain Current (Continuous) *AC  
I

D  

A
Drain Current (Pulse)
 
*B  
Power Dissipation  
I

DM  

P

D  

A
T
A
=25°C  
0.22  
-55~150  
W
℃
Operating Temperature/ Storage Temperature  
T

J

/T

STG  

Thermal Resistance Ratings  
Parameter  
Symbol  
Maximum  
Unit  
Maximum Junction-to-Ambient  
t
≤
5s  
530  
°C/W  
R

thJA  

1

TW1504ESG  
Electrical Characteristics
@T

A

=25
℃
unless otherwise noted  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Static
*D  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Curren
t  
Gate Threshold Voltage  
V

(BR)DSS  

I

DSS  

V

GS(TH)  

I

GSS  

V

GS

= 0V, I

D

= 250
μ
A  
V

DS

= 20V, V

GS

= 0V  
V

GS

= V
DS
, I
DS
= 250
μ
A  
V
GS
=

8V
, V
DS
= 0V  
V

GS

= 4.5V, I

D

= 0.5A  
20  
—  
—  
—  
—  
V
μ
A  
V
1
0.4  
—  
—  
0.85  
±5  
Gate Leakage Current  
—  
μ
A  
mΩ  
mΩ  
mΩ  
V
—  
255  
348  
542  
—  
332  
452  
705  
1.2  
0.18  
R

DS(on)  

R

DS(on)  

R

DS(on)  

V

SD  

V

GS

= 2.5V, I

D

= 0.2A  
V

GS

= 1.8V, I

D

= 0.1A  
—  
Drain-Source On-state Resistance  
—  
Diode Forward Voltage  
Diode Forward Current
*AC  
Switching  
I
SD
= 0.5A ,
V
GS
=0V  
T

A

= 25°C  
—  
I
S  
—  
—  
A
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-Off Fall Time  
Dynamic  
Q

g  

Q

gs  

Q

gd  

t

d ( on )  

t
r  
—  
—  
—  
—  
—  
—  
—  
1
0.16  
0.13  
2
—  
—  
—  
—  
—  
—  
—  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
DS
= 10V, I
D
= 0.5A,  
V
GS
= 4.5V  
V
DD
= 10V, I
D
= 0.4A,  
14  
t

d( off )  

V
GS
= 4.5V, R
GEN
= 1
 
16  
t
f  
11  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
C
iss  
C
oss  
C
rss  
—  
—  
—  
43  
14  
8
—  
—  
—  
pF  
pF  
pF  
V
DS
= 10V,V
GS
=0V, f=1.0MHz  
A: The value of R
θ
JA
is measured with the device mounted on 1in

2

FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The value in any given  
application depends on the user’s specific board design.  
B: Repetitive rating, pulse width limited by junction temperature.  
C:
The current rating is based on the t≤ 10s junction to a
mbient thermal resistance rating.  
D: Pulse Test
:
Pulse Wide
≤
300
μ
s
,
Duty Cycle
≤
2%.  
2

TW1504ESG  
Typical Performance Characteristics
(
(TJ = 25 °C, unless otherwise noted)
)  
3

TW1504ESG  
4

TW1504ESG  
5

TW1504ESG  
Package Information  
6