TWGMC-TW4614SQ-X

Part #TWGMC-TW4614SQ-X
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TWGMC-TW4614SQ-X
TW4614SQ-X  
60V Complementary Enhancement Mode Power MOSFET  
Features  
General Description  
•
used in inverter  
N-channel  
V

DS

= 60V,  
P-channel  
V

DS

= -60 V  
•
other applications  
I

D

= 4.4A  
I
D
= -4.2A  
R

DS(ON)  

R

DS(ON)  

V

GS

= 10V, TYP 37
mΩ  
V

GS

= 4.5V, TYP 43
mΩ  
V

GS

= -10V, TYP 53
mΩ  
V

GS

= -4.5V, TYP 60
mΩ  
Pin Configurations  
SOP8  
Absolute Maximum Ratings
@T

A

=25
℃
unless otherwise noted  
Parameter  
Symbol  
V

DSS  

N-Ratings  
60  
P-Ratings  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
-60  
±
20  
-4.2  
-3.4  
-17  
V

GSS  

±
20  
4.4  
V
T
A
=25°C  
T
A
=70°C  
Drain Current (Continuous) *AC  
I

D  

A
3.5  
Drain Current (Pulse)
 
*B  
Power Dissipation  
I

DM  

P

D  

21  
A
T
A
=25°C  
2
W
℃
Operating Temperature/ Storage Temperature  
T

J

/T

STG  

-55~150  
-55~150  
Thermal Resistance Ratings  
Parameter  
Symbol  
R

thJA  

R

thJL  

Typ  
Maximum  
62.5  
Unit  
N-channel  
t
≤
10s  
Maximum Junction-to-Ambient  
Maximum Junction-to
Lead  
48  
35  
°C/W  
Steady State  
60  
Parameter  
Maximum Junction-to-Ambient  
Maximum Junction-to
Lead  
Symbol  
R

thJA  

R

thJL  

Typ  
48  
Maximum  
62.5  
Unit  
P-channel  
t
≤
10s  
°C/W  
Steady State  
35  
40  
1

TW4614SQ-X  
N-channel
Electrical Characteristics
@T

A

=25
℃
unless otherwise noted  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Static  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Curren
t  
Gate Threshold Voltage  
V

(BR)DSS  

I

DSS  

V

GS(TH)  

I

GSS  

V

GS

= 0V, I

D

= 250
μ
A  
V

DS

= 48V, V

GS

= 0V  
V

GS

= V
DS
, I
DS
= 250
μ
A  
V
GS
=
20V
, V
DS
=0V  
V

GS

= 10V, I

D

= 5.3A  
60  
—  
1
—  
—  
—  
1
V
μA  
V
1.6  
—  
3
Gate Leakage Current  
—  
—  
—  
—  
—  
—  
nA  
mΩ  
mΩ  
S
100  
48  
37  
43  
27  
—  
R

DS(on)  

R

DS(on)  

g

FS  

Drain-Source On-state Resistance  
V

GS

= 4.5V, I

D

= 4.7A  
56  
—  
Forward Transconductance  
Diode Forward Voltage  
Diode Forward Current  
Switching  
V
DS
= 5V,
I
D
= 6.3A  
I
SD
= 1A ,
V
GS
=0V  
T

A

=25°C  
V

SD  

1.2  
4.4  
V
I
S  
—  
A
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-Off Fall Time  
Dynamic  
Q

g  

Q

gs  

Q

gd  

t

d ( on )  

t
r  
—  
—  
—  
—  
—  
—  
—  
24.2  
6
—  
—  
—  
—  
—  
—  
—  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
GS
=10V, V
DS
=30V, I
D
=6.3A  
14.4  
7.6  
5
V
GS
=10V, V
DS
=30V, R
L
=4.7
,  
R
GEN
=3
  
t

d( off )  

28.9  
5.5  
t
f  
Input Capacitance  
C
iss  
C
oss  
C
rss  
—  
—  
—  
1920  
155  
—  
—  
—  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
V
GS
=0V, V
DS
=30V, f=1MHz  
116  
A: The value of R
θ
JA
is measured with the device mounted on 1in

2

FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The value in any given  
application depends on the user’s specific board design.  
B: Repetitive rating, pulse width limited by junction temperature.  
C:
The current rating is based on the t≤ 10s junction t
o ambient thermal resistance rating.  
2

TW4614SQ-X  
P-channel
Electrical Characteristics
@T

A

=25
℃
unless otherwise noted  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Static  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Curren
t  
Gate Threshold Voltage  
V

(BR)DSS  

I

DSS  

V

GS(TH)  

I

GSS  

V

GS

= 0V, I

D

= -250
μ
A  
V

DS

= -48V, V

GS

= 0V  
V

GS

= V
DS
, I
DS
= -250
μ
A  
V
GS
=
20V
, V
DS
=0V  
V

GS

= -10V, I

D

= -5A  
-60  
—  
—  
—  
—  
-1  
V
μA  
V
-1  
—  
-1.6  
—  
-3  
Gate Leakage Current  
nA  
mΩ  
mΩ  
S
100  
-65  
—  
-53  
-60  
18  
—  
R

DS(on)  

R

DS(on)  

g

FS  

Drain-Source On-state Resistance  
V

GS

= -4.5V, I

D

= -3A  
—  
-80  
—  
Forward Transconductance  
Diode Forward Voltage  
Diode Forward Current  
Switching  
V
DS
= -5V,
I
D
= -4.9A  
I
SD
= -1A ,
V
GS
=0V  
T

A

=25°C  
—  
V

SD  

—  
-1.2  
-4.2  
V
I
S  
—  
—  
A
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-Off Fall Time  
Dynamic  
Q

g  

Q

gs  

Q

gd  

t

d ( on )  

t
r  
—  
—  
—  
—  
—  
—  
—  
22.8  
5.8  
9.6  
9.8  
6.1  
44  
—  
—  
—  
—  
—  
—  
—  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
GS
=-10V, V
DS
=-30V, I
D
=-4.9A  
V
GS
=-10V, V
DS
=-30V,  
t

d( off )  

R
L
=6.2
,R
GEN
=3
  
t
f  
12.7  
Input Capacitance  
C
iss  
C
oss  
C
rss  
—  
—  
—  
2417  
179  
—  
—  
—  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
V
GS
=0V, V
DS
=-30V, f=1MHz  
120  
A: The value of R
θ
JA
is measured with the device mounted on 1in

2

FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The value in any given  
application depends on the user’s specific board design.  
B: Repetitive rating, pulse width limited by junction temperature.  
C:
The current rating is based on the t≤ 10s junction to ambient thermal resistance rating.  
3

TW4614SQ-X  
N-channel
Typical Performance Characteristics
(
(TJ = 25 °C, unless otherwise noted)
)  
4

TW4614SQ-X  
5

TW4614SQ-X  
P-channel
Typical Performance Characteristics
(
(TJ = 25 °C, unless otherwise noted)
)  
6

TW4614SQ-X  
7

TW4614SQ-X  
Package Information  
8