UMW-Youtai-Semiconductor-Co—Ltd–FDN336P-UMW

Part #UMW-Youtai-Semiconductor-Co—Ltd–FDN336P-UMW
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UMW-Youtai-Semiconductor-Co—Ltd–FDN336P-UMW
R
FDN336  
P-Channel 2.5 V (D-S) MOSFET  
UMW  
General Description  
SOT
–
23  

especially tailored to

the on-state resistance  
and yet maintain
 
low gate charge for superior  
switching performance.  
These devices are well suited for portable electronics  
applications: load switching and power management,  
battery charging circuits and DC/DC conversion.  
1. GATE  
2. SOURCE  
3. DRAIN  
Features  
V
DS (V)
= -20V  
R
DS(ON)  
R
DS(ON)  
91m  
(V
GS
= -4.5V)  
(V
GS
= -2.5V)  
108m  
D
S
G
Absolute Maximum Ratings  
T

A

=25

o

C unless otherwise noted  
Symbol  
V

DSS  

Parameter  
Drain-Source Voltage  
Ratings  
Units  
V
–20  
V

GSS  

I

D  

Gate-Source Voltage  
V
A
±
8  
Drain Current
 
– Continuous  
– Pulsed  
(Note 1a)  
–
1.3  
–10  
P

D  

Maximum Power Dissipation  
(Note 1a)  
(Note 1b)  
0.5  
0.46  
W
T

J

, T

STG  

Operating and Storage Junction Temperature Range  
–55 to +150  
°
C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1)  
250  
75  
R

θ
JA  

°
C/W  
°
C/W  
Thermal Resistance, Junction-to-Case  
R

θ
JC  

1
UTD Semiconductor Co.,Limited  

R
FDN336  
P-Channel 2.5 V (D-S) MOSFET  
UMW  
O
Electrical Characteristic
s
(T

A

= 25 C
 
un
l
e
ss otherw
i
s
e noted )  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
BV

DSS  

Drain-Source Breakdown Voltage  
V

GS

= 0 V,
 
I

D

= -250 µA  
-20  
V
I

D

= -250 µA, Referenced to
 
25

o

C  
mV /

o

C  
Breakdown Voltage Temp. Coefficient  
Zero Gate Voltage
 
Drain Current  
-16  
D
BV

DSS

/
D
T

J  

-1  
µA  
µA  
nA  
nA  
I

DSS  

V

DS

= -16 V,
 
V

GS

= 0 V  
-10  
T

J

= 55°C  
I

GSSF  

I

GSSR  

Gate – Body Leakage, Forward  
Gate – Body Leakage, Reverse  
V

GS

= 8 V, V

DS

= 0
 
V  
V

GS

= -8
 
V, V

DS

= 0
 
V  
100  
-100  
ON CHARACTERISTICS
(Note 2)  
V

GS(th)  

Gate Threshold Voltage  
V

DS

= V

GS

, I

D

= -250 µA  
I

D

= -250 µA, Referenced to
 
25

o

C  
-0.4  
-0.9  
3
-1.5  
V
mV /

o

C  
Gate Threshold Voltage Temp. Coefficient  
D
V

GS(th)

/
D
T

J  

R

DS(ON)  

Static Drain-Source On-Resistance  
88  
91  
V

GS

= -4.5 V,
 
I

D

= -1.3 A  
m
W
103  
108  
V

GS

= -2.5 V,
 
I

D

= -1.1 A  
V

GS

= -4.5 V,
 
V

DS

= -5 V  
V

DS

= -4.5 V,
 
I

D

= -2 A  
I

D(ON)  

g

FS  

On-State Drain Current  
-5  
A
Forward Transconductance  
4
S
DYNAMIC CHARACTERISTICS  
C

iss  

C

oss  

C

rss  

Input Capacitance  
V

DS

= -10 V,
 
V

GS

= 0 V,  
f =
 
1.0 MHz  
330  
80  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
35  
SWITCHING CHARACTERISTICS
 
(Note 2)  
Turn – On Delay Time  
Turn – On Rise Time  
Turn – Off Delay Time  
Turn – Off Fall Time  
Total Gate Charge  
7
15  
22  
26  
12  
5
ns  
ns  
t

D(on)  

t

r  

t

D(off)  

t

f  

V

DD

= -5 V,
 
I

D

= -0.5 A,  
V

GS

= -4.5 V,
 
R

GEN

= 6
W  
12  
16  
5
ns  
ns  
3.6  
0.8  
0.7  
nC  
nC  
nC  
Q

g  

Q

gs  

Q

gd  

V

DS

= -10 V,
 
I

D

= – 2 A,  
V

GS

= -4.5 V  
Gate-Source Charge  
Gate-Drain Charge  
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
Maximum Continuous Drain-Source Diode Forward Current  
Drain-Source Diode Forward Voltage
 
V

GS

= 0 V,
 
I

S

= -0.42 A
 
(Note)  
-0.42  
-1.2  
A
V
I

S  

V

SD  

Note:  
-0.7  
1. R

q

JA

is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the
 
solder mounting surface of
 
the drain
 
pins. R

q

JC

is guaranteed by  
design while R

q

CA

is determined by the user’s board design.  
a. 250

o

C/W when mounted on  
a 0.02 in

2

pad of 2oz Cu.  
b. 270

o

C/W when mounted on  
a 0.001 in

2

pad of 2oz Cu.  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.  
2
UTD Semiconductor Co.,Limited  

R
FDN336  
P-Channel 2.5 V (D-S) MOSFET  
UMW  
Typical Electrical Characteristics  
2
1.8  
1.6  
1.4  
1.2  
1
V
= -4.5V  
GS  
8
6
4
2
0
-3.5V  
-3.0V  
V
= -2.5 V  
GS  
-2.5V  
-3.0V  
-3.5V  
-4.0V  
-4.5V  
-2.0V  
0.8  
0
1
2
3
4
5
0
2
4
6
8
10  
-V ,
 
DRAIN-SOURCE VOLTAGE (V)  
DS  
– I
 
, DRAIN CURRENT (A)  
D
Fi
g
ure 2. On-Res
i
s
tance
V
a
r
i
a
t
i
o
n w
i
t
h  
Drain Current and Gate  
Figure 1. On-Region Characteristics
.  
0.5  
1.6  
1.4  
1.2  
1
I

D

= -0.6A  
I
= -1.3A  
= -4.5V  
D
V
0.4  
0.3  
0.2  
0.1  
0
GS  
T
= 125°C  
A
0.8  
25°C  
8
0
2
4
6
10  
0.6  
-50  
-25  
0
T
25  
50  
75  
100  
125  
150  
– V  
, GATE TO SOURCE VOLTAGE (V)  
GS  
, JUNCTION TEMPERATURE (°C)  
J
Fi
g
ure 4. On-Res
i
s
tance
V
a
r
i
a
t
i
o
n w
i
t
h  
Gate-to-Source Vo
l
t
age.  
Fi
g
ure 3. On-Res
i
s
tance
V
a
r
i
a
t
i
o
n  
w
i
t
h Temperature
.  
10  
4
3
2
1
0
V

G
S

= 0V  
V

DS

= -5V  
T =
 
-55°C  
J
25°C  
T =
 
125°C  
J
1
125°C  
25°C  
-55°C  
0.1  
0.01  
0.001  
0.5  
1
1.5  
2
2.5  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
-V ,
 
GATE TO SOURCE VOLTAGE (V)  
GS  
-V ,
 
BODY DIODE FORWARD VOLTAGE (V)  
SD  
Fi
g
ure 5
 
. Transfer Character
i
s
t
i
c
s.  
Fi
g
ure 6.
B
o
dy Diode For
w
a
r
d Voltage  
V
a
r
i
a
t
i
o
n w
i
t
h Source  
Current  
and Temperature.  
3
UTD Semiconductor Co.,Limited  

R
FDN336  
P-Channel 2.5 V (D-S) MOSFET  
UMW  
Typical Electrical Characteristics
(
c
ont
i
n
ued)  
700  
400  

I

= -1.3A  
V

DS

= -5V  
-10V  
-15V  
4
3
2
1
0
C
iss  
200  
100  
C
oss  
40  
f = 1 MHz  
V

GS

= 0 V  
C
rss  
0
1
2
3
4
0.1  
0.2  
0.5  
1
2
5
10  
20  
Q
, GATE CHARGE (nC)  
g
-V ,
 
DRAIN TO SOURCE VOLTAGE (V)  
DS  
Fi
g
ure 7. Gate Charge Character
i
s
t
i
c
s.  
Fi
g
ure 8. Capac
i
t
ance Character
i
s
t
i
c
s
.  
30  
10  
50  
SINGLE PULSE  
40  
30  
20  
10  
JA  
R

q

=270°C/W  
3
T

A

= 25°C  
1
100ms  
0.3  
V

GS

= -4.5V  
0.1  
SINGLE PULSE  
R

q  

= 270°C/W  
JA  
0.03  
0.01  
T

A

= 25°C  
0
0.0001  
0.001  
0.01  
0.1  
1
10  
100 300  
0.2  
0.5  
1
3
5
10  
30  
SINGLE PULSE TIME (SEC)  
-V ,
 
DRAIN-SOURCE VOLTAGE (V)  
DS  
Fi
g
ure 9. Max
i
m
um Safe Operat
i
n
g Area.  
Fi
g
ure 10. S
i
n
g
l
e Pul
s
e
M
aximum Po
w
er  
Di
s
s
i
p
at
i
o
n.  
1
D = 0.5  
0.5  
0.2  
0.2  
R
(t) = r(t)
 
* R  
JA JA  
q
q
R
= 270 °C/W  
JA  
q
0.1  
0.1  
0.05  
0.05  
P(pk)  
0.02  
0.02  
0.01  
0.01  
t
1
t
2
Single Pulse  
T
– T
 
= P
 
* R  
(t)  
JA  
0.005  
J
A
q
Duty Cycle, D = t
 
/t  
1
2
0.002  
0.001  
0.0001  
0.001  
0.01  
0.1  
, TIME (sec)  
1
10  
100  
300  
t
1
Fi
g
ure 11. Trans
i
e
nt Thermal Response Curve.  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
4
UTD Semiconductor Co.,Limited  

R
FDN336  
P-Channel 2.5 V (D-S) MOSFET  
UMW  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
Max.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
Min.  
0.035  
0.000  
0.035  
0.012  
0.003  
0.110  
0.047  
0.089  
Max.  
0.045  
0.004  
0.041  
0.020  
0.006  
0.118  
0.055  
0.100  
A
A1  
A2  
b
c
D
E
E1  
e
e1  
L
0.950 T
Y
P
.  
0.550 REF.  
0.037 T
Y
P
.  
0.022 REF.  
1.800  
2.000  
0.071  
0.079  
L1  
θ
0.300  
0°  
0.500  
8°  
0.012  
0°  
0.020  
8°  
Marking  
Ordering information  
Deliver
y
m
ode  
Package  
Baseqty  
Order code  
UMW FDN336P  
Tape and
 
reel  
SOT-23  
3000  
5
UTD Semiconductor Co.,Limited