UMW-Youtai-Semiconductor-Co—Ltd–IRF7328TR-UMW

Part #UMW-Youtai-Semiconductor-Co—Ltd–IRF7328TR-UMW
Download 
UMW-Youtai-Semiconductor-Co—Ltd–IRF7328TR-UMW
R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
Features  

Trench Tech

nology  

Ultra Low O

n-Resistance  
Dual P-Channel MOSFET  
Available in Tape & Reel  
Lead-Free  
1
2
8
7
S1  
G1  
D1  
D1  
3
4
6
5
S2  
D2  
D2  
G2  
V

DSS  

-30V  
R

DS(on)

max  
21m
Ω
@V

GS

= -10V  
32m
Ω
@V

GS

= -4.5V  
I

D  

-8.0A  
Top View  
-6.8A  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
V

DS  

Drain-Source Voltage  
-30  
-8.0  
-6.4  
-32  
2.0  
1.3  
16  
V
I

D

@ T

A

= 25°C  
I

D

@ T

A

= 70°C  
I

DM  

Continuous Drain Current, V

GS

@ -10V  
Continuous Drain Current, V

GS

@ -10V  
Pulsed Drain Current

 
Maximum Power Dissipation
ƒ  
Maximum Power Dissipation
ƒ  
Linear Derating Factor  
A
P

D

@T

A

= 25°C  
P

D

@T

A

= 70°C  
W
W
mW/°C  
V
V

GS  

Gate-to-Source Voltage  
± 20  
T

J

, T

STG  

Junction and Storage Temperature Range  
-55 to
 
+ 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient
ƒ  
Max.  
62.5  
Units  
°C/W  
R

θ
JA  

1
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
Electrical Characteristics @ T

J

= 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
-30 ––– –––  
V
V

GS

= 0V, I

D

= -250µA  

∆

/

Breakdown Voltage Temp. Coefficient  
––– -0.018 –––
 
V/°C Reference
 
to 25°C, I

D

= -1mA  
––– 17  
21  
V

GS

= -10V, I

D

= -8.0A
‚  
V

GS

= -4.5V, I

D

= -6.8A
‚  
V

DS

= V

GS

, I

D

= -250µA  
V

DS

= -10V, I

D

= -8.0A  
V

DS

= -24V, V

GS

= 0V  
V

DS

= -24V, V

GS

= 0V, T

J

= 70°C  
V

GS

= -20V  
R

DS(on)  

Static Drain-to-Source On-Resistance  
m
Ω  
–––
26.8 32  
-1.0 ––– -2.5  
12 –––
 
–––  
––– ––– -15  
––– ––– -25  
––– ––– -100  
––– ––– 100  
V

GS(th)  

g

fs  

Gate Threshold Voltage  
V
S
Forward Transconductance  
I

DSS  

I

GSS  

Drain-to-Source Leakage Current  
µA  
nA  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
V

GS

= 20V  
Q

g  

––– 52  
78  
I

D

= -8.0A  
Q

gs  

Q

gd  

t

d(on)  

t

r  

Gate-to-Source Charge  
Gate-to-Drain (“Miller”) Charge  
Turn-On Delay Time  
Rise Time  
––– 9.8 –––  
––– 8.3 –––  
nC  
ns  
pF  
V

DS

= -15V  
V

GS

= -10V  
––– 13  
––– 15  
20  
23  
V

DD

= -15V, V

GS

= -10.0V  
I

D

= -1.0A  
t

d(off)  

t

f  

Turn-Off Delay Time  
Fall Time  
––– 198 297  
––– 98 147  
––– 2675 –––  
––– 409 –––  
––– 262 –––  
R

G

= 6.0
Ω  
R

D

= 15
Ω
‚  
V

GS

= 0V  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
V

DS

= -25V  
Reverse Transfer Capacitance  
ƒ = 1.0MHz  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
showing the  
D
S
I

S  

––– ––– –
2.0  
A
G
I

SM  

Pulsed Source Current  
(Body Diode)

 
integral reverse  
–––  
-32  
–––  
p-n junction diode.  
V

SD  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
––– ––– -1.2  
V
T

J

= 25°C, I

S

= -2.0A, V

GS

= 0V
‚
 
T

J

= 25°C, I

F

= -2.0A  
––– 37  
––– 36  
56  
54  
ns  
Q

rr  

nC di/dt
 
= -100A/µs
‚  
Notes:  

Repetitive rating;
 
pulse width limited by  
max. junction temperature.  
‚
Pulse width
≤
400µs
;
duty cycle
≤
2%.  
ƒ
Surface mounted on FR-4 board,
t
≤
10sec
.  
2
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
100  
10  
1
100  
10  
1
VGS  
VGS  
TOP  
-10.0V  
-5.0V  
-4.5V  
-4.0V  
-3.5V  
-3.3V  
-3.0V  
TOP  
-10.0V  
-5.0V  
-4.5V  
-4.0V  
-3.5V  
-3.3V  
-3.0V  
BOTTOM -2.7V  
BOTTOM -2.7V  
-2.7V  
-2.7V  
20µs PULSE WIDTH  
Tj = 150°C  
20µs PULSE WIDTH  
Tj = 25°C  
0.1  
0.1  
0.1  
1
10  
100  
0.1  
1
10  
100  
-V ,
 
Drain-to-Source Voltage (V)  
DS  
-V ,
 
Drain-to-Source Voltage (V)  
DS  
Fig 1.
 
Typical Output Characteristics  
Fig 2.
 
Typical Output Characteristics  
100  
2.0  
-8.0A  
=
I
D
1.5  
1.0  
0.5  
0.0  
°
T =
 
150 C  
J
10  
°
T =
 
25 C  
J
1
V
= -15V  
DS  
V
=
–
10V  
20µs PULSE WIDTH  
GS  
0.1  
2.0  
3.0  
4.0  
5.0 6.0  
-60 -40 -20  
0
20 40 60 80
 
100 120 140 160  
°
-V ,
 
Gate-to-Source Voltage (V)  
GS  
T ,
 
Junction Temperature (
 
C)  
J
Fig 4.
 
Normalized On-Resistance  
Fig 3.
 
Typical Transfer Characteristics  
Vs. Temperature  
3
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
4000  
3000  
2000  
1000  
0
14  
12  
10  
8
V
= 0V,  
f = 1MHz  
gd ,
 
ds  
I =
 
-8A  
D
GS  
C
= C
 
+ C  
gs  
C
SHORTED  
iss  
V
V
=-24V  
=-15V  
DS  
DS  
C
= C  
gd  
= C
 
+ C  
ds  
rss  
C
oss  
gd  
C
iss  
6
4
C
C
oss  
2
rss  
0
1
10  
100  
0
10  
20  
30  
40  
50  
60  
-V ,
 
Drain-to-Source Voltage (V)  
DS  
Q ,
 
Total Gate Charge (nC)  
G
Fig 6.
 
Typical Gate Charge Vs.  
Fig 5.
 
Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
100  
10  
100  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
°
T =
 
150 C  
J
10  
1
°
T =
 
25 C  
J
100us  
1ms  
°
T =
 
25 C  
J
C
°
T =
 
150 C  
Single Pulse  
10ms  
V
= 0 V  
GS  
0.1  
0.2  
1
0.1  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1
10  
100  
-V ,Source-to-Drain
 
Voltage (V)  
SD  
-V ,
 
Drain-to-Source Voltage (V)  
DS  
Fig 8.
 
Maximum Safe Operating Area  
Fig 7.
 
Typical Source-Drain Diode  
Forward Voltage  
4
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
R

D  

V

DS  

V

GS  

D.U.T.  
R

G  

–
+
V

DD  

V

GS  

Pulse Width
≤ 1
µs  
Duty Factor
≤ 0.1 %  
Fig 10a.
 
Switching Time Test Circuit  
t
t
r
t
t
f
d(on)  
d(off)  
V
GS  
10%  
25  
50  
75  
100  
125  
150  
°
, Case Temperatur
e
(
 
C
)  
T

A  

90%  
Fig 9.
 
Maximum Drain Current Vs.  
V
DS  
Case Temperature  
Fig 10b.
 
Switching Time Waveforms  
1000  
100  
10  
D = 0.50  
0.20  
0.10  
0.05  
P
DM  
0.02  
0.01  
t
1
1
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D = t
 
/ t  
1
2
2. Peak T
 
=
P  
J
x Z  
+ T  
thJA A  
DM  
0.1  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t ,
 
Rectangular Pulse Duration (sec)  
1
Fig 11.
 
Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
5
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
0.100  
0.075  
0.050  
0.025  
0.000  
0.060  
0.050  
0.040  
0.030  
0.020  
0.010  
0.000  
I
= -8.0A  
D
VGS = -4.5V  
VGS = -10V  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0
10  
20  
30  
40  
50  
60  
70  
-I ,
 
Drain Current ( A )  
-V  
GS,  
Gate -to -Source Voltage
 
(V)  
D
Fig 12.
 
Typical On-Resistance Vs.  
Fig 13.
 
Typical On-Resistance Vs.  
Gate Voltage  
Drain Current  
Current Regulator  
Same Type as D.U.
T
.  
50K
Ω  
.2
µ
F  
12V  
.3
µ
F  
Q
G
–
V
+
DS  
10 V  
D.U.
T
.  
Q
Q
GD  
GS  
V
GS  
-3mA  
V
G
I
I
D
G
Current Sampling Resistors  
Charge  
Fig 14a.
 
Basic Gate Charge Waveform  
Fig 14b.
 
Gate Charge Test Circuit  
6
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
SO
P-8  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min  
Max  
Min  
Max  
A
A1  
A2  
b
c
D
E
E1  
e
L
1.350  
0.100  
1.350  
0.330  
0.170  
4.700  
3.800  
5.800  
1.750  
0.250  
1.550  
0.510  
0.250  
5.100  
4.000  
6.200  
0.053  
0.004  
0.053  
0.013  
0.006  
0.185  
0.150  
0.228  
0.069  
0.010  
0.061  
0.020  
0.010  
0.200  
0.157  
0.244  
1.270(BSC)  
0.050(BSC)  
0.050  
0.400  
1.270  
0.016  
θ
0°  
8°  
0°  
8°  
7
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7328  
Dual P-Channel 30 V (D-S) MOSFET  
Marking  
Ordering information  
Package  
SOP-8  
Deliverymode  
Tape and
 
reel  
Baseqty  
3000  
Order code  
UMW IRF7328TR  
8
UTD Semiconductor Co.,Limited