UMW-Youtai-Semiconductor-Co—Ltd–IRF7413TR-UMW

Part #UMW-Youtai-Semiconductor-Co—Ltd–IRF7413TR-UMW
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UMW-Youtai-Semiconductor-Co—Ltd–IRF7413TR-UMW
R
UMW  
IRF7413  
A
D
1
2
3
4
8
7
l
S
S
S
G
Generation VTechnology  
l
l
l
l
l
l
l
l
Ultra Low On-Resistance  
N-Channel Mosfet  
Surface Mount  
Available in Tape &Reel  
Dynamic dv/dt Rating  
Fast Switching  
D
D
D
6
5
100% Rg Tested  
Lead-Free  
Top View  
Features  
V
DS (V)
= 30V  
R
DS(ON)  
R
DS(ON)  
12m  
17m  
(V
GS
= 10V)  
(V
GS
= 4.5V)  
Absolute Maximum Ratings  
S
y  
mbol  
Parameter  
Drain-to-Source Volta  
Gate-to-Source Volta  
Max  
30  
Units  
V

DS  

g
e
V
V
g
e  
± 20  
13  
GS  
Continuous Drain Current, V

GS

@ 10V  
Continuous Drain Current, V

GS

@ 10V  
I
I
I
@ T

A

= 25°C  
D
D
@ T

A

= 70°C  
9.2  
58  
A
P
u
l
se
d D
ra  
Power Dissipation  
Linear Derating Factor  
i
n
C
urren
t  
DM  
P
@T

A

= 25°C  
2.5  
W
mW/°C  
mJ  
D
0.02  
260  
Si gl
 
se va
 
anc
h
e
E
ner
g
enc
y  
n
e
P
u  
l
A
l
E
AS  
V/ns  
°C  
dv/dt  
Peak Diode Recovery dv/dt  
Junction and Storage Temperature Range  
5.0  

J,

T

STG  

T
-55 to +150  
Thermal Resistance Ratings  
S
y  
mbol  
Parameter  
Junction-to-Drain Lead  
Junction-to-Ambient  
T
–––  
y
p
Max  
20  
Units  
R

θ
JL  

R

θ
JA  

°C/W  
–––  
50  
1
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Symbol  
Parameter  
Min Typ Max
 
Units  
Conditions  

Dra

in-to-Source Breakdown Voltage  
30  
–––  
–––  
V
V

GS

= 0V, I

D

= 250µA  

Brea

kdown Voltage Temp. Coefficient  
––– 0.034 –––
 
V/°C Reference
 
to 25°C, I

D

= 1mA  
V

GS

= 10V, I

D

= 7.3A  
V

GS

= 4.5V, I

D

= 3.7A  
V

DS

= V

GS

, I

D

= 250µA  
–––  
–––  
12  
R

DS(on)  

Static Drain-to-Source On-Resistance  
m
Ω
–––  
1.0  
–––  
–––  
17  
3.0  
V

GS(th)  

g

fs  

Gate Threshold Voltage  
V
Forward Transconductance  
10  
–––  
–––  
–––  
–––  
12  
S
V

DS

= 10V, I

D

= 3.7A  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
V

DS

= 30V, V

GS

= 0V  
I

DSS  

I

GSS  

Drain-to-Source Leakage Current  
µA  
25  
V

DS

= 24V, V

GS

= 0V, T

J

= 125°C  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
––– -100  
V

GS

= -20V  
nA  
–––  
52  
100  
79  
V

GS

= 20V  
I

D

= 7.3A  
Q

g  

Q

gs  

Q

gd  

R

G  

Gate-to-Source Charge  
Gate-to-Drain (“Miller”) Charge  
Gate Resistance  
6.1  
16  
9.2  
23  
nC V

DS

= 24V  
V

GS

= 10V, See Fig. 6 and 9  
Ω
–––  
8.6  
50  
3.7  
–––  
–––  
–––  
–––  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-On Delay Time  
Rise Time  
V

DD

= 15V  
I

D

= 7.3A  
Ω
ns R

G

= 6.2  
Turn-Off Delay Time  
Fall Time  
52  
Ω,  
46  
R

G

= 2.0
 
See Fig. 10  
C

iss  

C

oss  

C

rss  

Input Capacitance  
––– 1800 –––  
V

GS

= 0V  
Output Capacitance  
–––  
–––  
680  
240  
–––  
–––  
V

DS

= 25V  
pF  
Reverse Transfer Capacitance  
ƒ = 1.0MHz, See Fig. 5  
Source-Drain Ratings and Characteristics  
Symbol  
Parameter  
Min. Typ. Max.
 
Units  
Conditions  
Continuous Source Current  
(Body Diode)  
MOSFET symbol  
showing the  
I
I
–––  
–––  
3.1  
S
A
Pulsed Source Current  
integral reverse  
–––  
–––  
58  
SM  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
74  
1.0  
110  
300  
V
T =
 
25°C, I
 
= 7.3A, V
 
= 0V  
SD  
J
S
GS  
Reverse Recovery Time  
Reverse Recovery Charge  
ns T
 
= 25°C, I
 
= 7.3A  
J F  
rr  
di/dt = 100A/µs  
Q
200  
nC  
rr  
Notes:  

Repetitive rating;
 
pulse width limited by  
max. junction temperature. ( See fig. 11 )  
‚
Starting T

J

= 25°C, L = 9.8mH  
R

G

= 25
Ω
, I

AS

=7.3A. (See Figure 12)  
ƒ
I

SD

≤
7.3A, di/dt
≤
100A/µs, V

DD

≤
V

(BR)DSS  

T

J

≤
150°C  
,
„
Pulse width
≤
300µs; duty cycle
≤
2%.  
ꢀ
Surface mounted on FR-4 board  
†
R

θ

is measured at T

J

approximately 90°C  
2
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  

Typical Ch

aracteristics  
100  
10  
1
100  
VGS  
VGS  
15V  
TOP  
15V  
TOP  
10V  
10V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
7
.
0
V  
5
.
5
V  
4
.
5
V  
4
.
0
V  
3
.
5
V  
BOTTOM 3.0V  
BOTTOM 3.0V  
10  
3.0V  
3.0V  
20µs PULSE WIDTH  
= 150°C  
20µs PULSE WIDTH  
= 25°C  
T
J
T
J
A
A
1
0.1  
1
10  
0.1  
1
10  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 1.
 
Typical Output Characteristics  
Fig 2.
 
Typical Output Characteristics  
100  
2.0  
1.5  
1.0  
0.5  
0.0  
I
= 7.3A  
D
T =
 
150°C  
J
T

J

= 25°C  
10  
V

DS

= 10V  
20µs PULSE WIDTH  
V
= 10V  
GS  
1
A

4.5

A  
3.0  
3.5  
4.0  
-60 -40 -20  
0
20 40 60 80
 
100 120 140 160  
T ,
 
Junction Temperature (°C)  
V

GS

, Gate-to-Source Voltage (V)  
J
Fig 4.
 
Normalized On-Resistance  
Fig 3.
 
Typical Transfer Characteristics  
Vs. Temperature  
3
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  

Typical Ch

aracteristics  
20  
16  
12  
8
3200  
I
= 7.3A  
V
C
C
C
= 0V,  
f = 1MHz  
D
GS  
iss  
rss  
oss  
= C
 
+ C  
,
C
SHORTED  
V
V
= 24V  
= 15V  
gs  
gd  
gd  
ds  
DS  
DS  
2800  
2400  
2000  
1600  
1200  
800  
= C  
C
C
= C
 
+ C  
iss  
ds  
gd  
oss  
C
rss  
4
400  
FOR TEST CIRCUIT  
SEE FIGURE 9  
0
0
A
A
1
10  
100  
0
10  
20  
30  
40  
50  
60  
V
, Drain-to-Source Voltage (V)  
Q
, Total Gate Charge (nC)  
DS  
G
Fig 5.
 
Typical Capacitance Vs.  
Fig 6.
 
Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
1
1000  
100  
10  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
T =
 
25°C  
J
T =
 
150°C  
J
100us  
1ms  
°
T =
 
25 C  
C
J
10ms  
°
T =
 
150 C  
Single Pulse  
V
GS  
= 0V  
1
0.1  
A
1
10  
100  
0.4  
1.2  
2.0  
2.8  
3.6  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Source-to-Drain Voltage (V)  
SD  
Fig 7.
 
Typical Source-Drain Diode  
Fig 8.
 
Maximum Safe Operating Area  
Forward Voltage  
4
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  
R

D  

V

DS  

Q
G
V

GS  

10V  
D.U.T.  
Q
Q
GD  
GS  
R

G  

+

V

DD  

–
V
G
10V  
Pulse Width
≤ 1
µs  
Duty Factor
≤ 0.1 %  
Charge  
Fig 9a.
 
Basic Gate Charge Waveform  
Fig 10a.
 
Switching Time Test Circuit  
Current Regulator  
Same Type as D.U.
T
.  
V
DS  
50K
Ω  
90%  
.2
µ
F  
12V  
.3
µ
F  
+
V
DS  
D.U.
T
.  
–
10%  
V
GS  
V
GS  
3mA  
t
t
r
t
t
f
d(on)  
d(off)  
I
I
D
G
Current Sampling Resistors  
Fig 9b.
 
Gate Charge Test Circuit  
Fig 10b.
 
Switching Time Waveforms  
100  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
P
2
DM  
0.02  
0.01  
t
1
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D = t
 
/ t  
1
2. Peak T
 
= P  
J
x Z  
+ T  
A
DM  
thJA  
0.1  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t ,
 
Rectangular Pulse Duration (sec)  
1
Fig 11.
 
Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
5
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  
15V  
DRIVER  
+
L
V
DS  
600  
500  
400  
300  
200  
100  
0
I
D
TOP  
3.3A  
6.0A  
D.U.T  
R
G
V
DD  
–
BOTTOM 7.3A  
I
A
AS  
20V  
0.01  
Ω
t
p
Fig 12a.
 
Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
Starting T
 
, Junction Temperature (

o

C)  
J
I
AS  
Fig 12c.
 
Maximum Avalanche Energy  
Fig 12b.
 
Unclamped Inductive Waveforms  
Vs. Drain Current  
6
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  
SO
P-8  
Dimensions In Millimeters  
Dimensions In Inches  
Min Max  
Symbol  
Min  
Max  
A
A1  
A2  
b
c
D
E
E1  
e
L
1.350  
0.100  
1.350  
0.330  
0.170  
4.700  
3.800  
5.800  
1.750  
0.250  
1.550  
0.510  
0.250  
5.100  
4.000  
6.200  
0.053  
0.004  
0.053  
0.013  
0.006  
0.185  
0.150  
0.228  
0.069  
0.010  
0.061  
0.020  
0.010  
0.200  
0.157  
0.244  
1.270(BSC)  
0.050(BSC)  
0.050  
0.400  
1.270  
0.016  
θ
0°  
8°  
0°  
8°  
7
UTD Semiconductor Co.,Limited  

R
UMW  
IRF7413  
Ordering information  
Package  
SOP-8  
Deliverymode  
Baseqty  
3000  
Order code  
Tape and
 
reel  
UMW IRF7413TR  
8
UTD Semiconductor Co.,Limited