UMW-Youtai-Semiconductor-Co—Ltd–IRFML8244TR-UMW

R

UMW  

I

RFR0

24

N  

D

S

The D-PAK is designed for surface mounting  

using vapor phase, infrared,or wave soldering  

technigues. Power dissipation levels up to 1.5  

watts are possible in typical surface mount app-  

lications.  

G

Features  

V

DS

(V) = 55V  

I

D

= 17A (V

GS

= 10V)  

R

DS(ON)

=75m

Ω

(V

GS

= 10V)  

1

UTD Semiconductor Co.,Limited  

R

UMW  

I

RFR0

24

N  

2

UTD Semiconductor Co.,Limited  

R

UMW  

I

RFR0

24

N  

3

UTD Semiconductor Co.,Limited  

R

UMW  

I

RFR0

24

N  

4

UTD Semiconductor Co.,Limited  

R

UMW  

I

RFR0

24

N  

5

UTD Semiconductor Co.,Limited  

R

UMW  

I

RFR0

24

N  

6

UTD Semiconductor Co.,Limited  

R

UMW  

I

RFR0

24

N  

ical Data  

TO-252  

E

A

B2  

Dimensions  

C2  

V 1  

Ref.  

Millimeters  

Typ.  

Inches  

Typ.  

Min.  

2.10  

0

Max.  

Min.  

0.083  

0

Max.  

0.098  

0.004  

0.034  

0.216  

0.024  

0.023  

0.248  

2.50  

0.10  

0.86  

5.48  

0.60  

0.58  

6.30  

A

A2  

B

0.66  

5.18  

0.40  

0.44  

5.90  

0.026  

0.202  

0.016  

0.017  

0.232  

B2  

C

C2  

D

C

B

G

5.30REF  

0.209REF  

D1  

E

DETAIL A  

6.40  

4.63  

4.47  

9.50  

1.09  

1.35  

6.80  

0.252  

0.182  

0.176  

0.374  

0.043  

0.053  

0.268  

V1  

E1  

G

4.67  

10.70  

1.21  

0.184  

0.421  

0.048  

0.065  

V 2  

H

L

V1  

1.65  

L2  

V1  

V2  

E1  

L2  

7°  

7°  

DETAIL A  

0°  

6°  

0°  

6°  

Ordering information  

Order code  

Package  

Baseqty  

2500  

Delivery mode  

Tape and reel  

UMW IRFR024NTR  

TO-252  

7

UTD Semiconductor Co.,Limited