UMW-Youtai-Semiconductor-Co—Ltd–IRLML6344TR-UMW

Part #UMW-Youtai-Semiconductor-Co—Ltd–IRLML6344TR-UMW
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UMW-Youtai-Semiconductor-Co—Ltd–IRLML6344TR-UMW
R
UMW  
IRLML6344  
SOT
–
23  
2
9
m  
3
7
m  
(
V

GS  

R
DS(ON)  
R
DS(ON)  
=
=
4.5V)  
2.5V)  
GS  
(V  
Application(s)  
Load/ System Switch  
1. GATE  
Benefits  
2. SOURCE  
3. DRAIN  
Lower Conduction Losses  
Multi-vendor compatibility  
Environmentally friendly  
Increased Reliability  
G
S
1
2
3
D
Absolute Maximum Ratings  
Symbol  
Parameter  
Drain-Source Voltage  
Max.  
30  
Units  
V
V

DS  

I

D

@ T

A

= 25°C  
I

D

@ T

A

= 70°C  
I

DM  

Continuous Drain Current, V

GS

@ 10V  
5.0  
Continuous Drain Current, V

GS

@ 10V  
Pulsed Drain Current  
4.0  
25  
A
P

D

@T

A

= 25°C  
P

D

@T

A

= 70°C  
1.3  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
W
0.8  
0.01  
± 12  
W/°C  
V
V

GS  

Gate-to-Source Voltage  
T

J,

T

STG  

-55 to
 
+ 150  
Junction and Storage Temperature Range  
°C  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
Max.  
Units  
R

θ  

Junction-to-Ambient  
100  
JA  
°C/W  
R

θ  

99  
JA  
Junction-to-Ambient (t<10s)  
8
1
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
Electric Characteristics @ T

J

= 25°C (unless otherwise specified)  
Conditions  
Symbol  
Parameter  
Min. Typ. Max.
 
Units  
V

GS

= 0V, I

D

= 250
μ
A  
Drain-to-Source Breakdown Voltage  
30  
V
Reference to 25°C, I

D

= 1mA  

Δ

/

Breakdown Voltage Temp. Coefficient  
0.02  
22  
V/°C  
V

GS

= 4.5V, I

D

= 5.0A  
29  
37  
R

DS(on)  

m
Ω  
Static Drain-to-Source On-Resistance  
V

GS

= 2.5V, I

D

= 4.0A  
27  
V

DS

= V

GS

, I

D

= 10
μ
A  
V

GS(th)  

I

DSS  

Gate Threshold Voltage  
0.5  
0.8  
1.1  
V
V

DS

=24V, V

GS

= 0V  
1.0  
Drain-to-Source Leakage Current  
μ
A  
V

DS

= 24V, V

GS

= 0V, T

J

= 125°C  
150  
100  
-100  
V

GS

= 12V  

GS

= -12V  
I

GSS  

Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Internal Gate Resistance  
Forward Transconductance  
Total Gate Charge  
nA  
V
R

G  

1.7  
Ω
V

DS

= 10V, I

D

= 5.0A  

D

= 5.0A  
gfs  
Q

g  

19  
S
I
6.8  
0.3  
2.4  
4.2  
5.6  
22  
nC  
ns  
V

DS

=15V  
Q

gs  

Q

gd  

t

d(on)  

t

r  

Gate-to-Source Charge  
Gate-to-Drain (“Miller”) Charge  
Turn-On Delay Time  
V

GS

= 4.5V  
V

DD

=15V  
I

D

= 1.0A  
Rise Time  
Ω
R

G

= 6.8  
t

d(off)  

t

f  

Turn-Off Delay Time  
V

GS

= 4.5V  
Fall Time  
9.1  
650  
65  
V

GS

= 0V  
C

iss  

C

oss  

C

rss  

Input Capacitance  
pF  
V

DS

= 25V  
Output Capacitance  
ƒ = 1.0MHz  
Reverse Transfer Capacitance  
46  
Source – Drain Ratings and Characteristics  
Conditions  
Symbol  
Parameter  
Min. Typ. Max.
 
Units  
MOSFET symbol  
I

S  

Continuous Source Current  
D
1.3  
showing the  
(Body Diode)  
A
G
integral reverse  
I

SM  

Pulsed Source Current  
(Body Diode)  
25  
S
p-n junction diode.  
T

J

= 25°C, I

S

= 5.0A, V

GS

= 0V  
T

J

= 25°C, V

R

= 15V, I

F

=1.3A  
V

SD  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
1.2  
15  
V
10  
ns  
Q

rr  

3.8  
5.7  
nC di/dt
 
= 100A/
μ
s  
Notes:  

‚
ƒ
Repetitive rating;
 
pulse width limited by max. junction temperature.  
Pulse width
≤
400
μ
s; duty cycle
≤
2%.  
Surface mounted on 1 in square Cu board  
8
2
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
100  
100  
10  
1
VGS  
10V  
VGS  
10V  
TOP  
TOP  
4.5V  
2.5V  
2.0V  
1.9V  
1.7V  
1.5V  
1.4V  
4.5V  
2.5V  
2.0V  
1.9V  
1.7V  
1.5V  
1.4V  
10  
1
BOTTOM  
BOTTOM  
1.4V  
1.4V  
1
≤
60
μ
s PULSE WIDTH  
≤
60
μ
s PULSE
 
WIDTH  
Tj = 150°C  
Tj = 25°C  
0.1  
0.1  
0.1  
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 2.
 
Typical Output Characteristics  
Fig 1.
 
Typical Output Characteristics  
100  
10  
2.0  
1.5  
1.0  
0.5  
I
= 5.0A  
D
V
= 4.5V  
GS  
T
= 150°C  
J
1
T
= 25°C  
V
J
= 15V  
DS  
≤
60
μ
s PULSE WIDTH  
0.1  
1.0  
1.5  
2.0  
2.5  
-60 -40 -20  
0
20 40 60 80
 
100 12
0
1
40 160  
T
J
, Junction Temperature (°C)  
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3.
 
Typical Transfer Characteristics  
Fig 4.
 
Normalized On-Resistance  
Vs. Temperature  
8
3
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
14.0  
12.0  
10.0  
8.0  
10000  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I =
 
5.0A  
D
V
= 24V  
= 15V  
= 6.0V  
C
C
C
+ C
 
, C  
SHORTED  
ds  
DS  
iss  
gs  
gd  
= C  
V
rss  
oss  
gd  
= C
 
+ C  
DS  
V
ds  
gd  
DS  
1000  
100  
10  
C
iss  
6.0  
C
C
oss  
rss  
4.0  
2.0  
0.0  
0.0  
4.0  
Q
8.0  
12.0  
16.0  
20.0  
1
10  
, Drain-to-Source Voltage (V)  
100  
, Total
 
Gate Charge (nC)  
V
G
DS  
Fig 5.
 
Typical Capacitance Vs.  
Fig 6.
 
Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
100  
10  
1
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
1msec  
T
= 150°C  
J
100
μ
sec  
1
T
= 25°C  
0.1  
0.01  
J
T
= 25°C  
A
Tj = 150°C  
Single Pulse  
10msec  
10  
V
= 0V  
1.0  
GS  
0.1  
0.1  
1
100  
0.4  
0.5  
V
0.6  
0.7  
0.8  
0.9  
1.1  
V
, Drain-to-Source Voltage (V)  
DS  
, Source-to-Drain Voltage (V)  
SD  
Fig 7.
 
Typical Source-Drain Diode  
Fig 8.
 
Maximum Safe Operating Area  
Forward Voltage  
8
4
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
R

D  

V

DS  

V

GS  

D.U.T.  
R

G  

+

V

DD  

–
V

GS  

Pulse Width
≤ 1
µs  
Duty Factor
≤ 0.1 %  
Fig 10a.
 
Switching Time Test Circuit  
V
DS  
90%  
25  
50  
75  
100  
125  
150  
T
, Ambient Temperature (°C)  
A
10%  
Fig 9.
 
Maximum Drain Current Vs.  
V
GS  
Ambient Temperature  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 10b.
 
Switching Time Waveforms  
1000  
100  
10  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
1
0.1  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthja + T  
0.01  
SINGLE PULSE  
( THERMAL RESPONSE )  
A
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11.
 
Typical Effective Transient Thermal Impedance, Junction-to-Ambient  
8
5
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
60  
50  
40  
30  
20  
10  
80  
60  
40  
20  
0
I
= 5.0A  
D
Vgs = 2.5V  
T
= 125°C  
J
Vgs = 4.5V  
T
= 25°C  
J
0
1
2
3
4
5
6
7
8
9
10 11 12  
0
10  
20  
, Drain Current (A)  
30  
40  
I
D
V
Gate -to -Source Voltage
 
(V)  
GS,  
Fig 13.
 
Typical On-Resistance Vs. Drain  
Fig 12.
 
Typical On-Resistance Vs. Gate  
Current  
Voltage  
Id  
Vds  
Vgs  
L
VCC  
DUT  
0
Vgs(th)  
20K  
Qgs1  
Qgs2  
Qgodr  
Qgd  
Fig 14a.
 
Basic Gate Charge Waveform  
Fig 14b.
 
Gate Charge Test Circuit  
8
6
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
100  
80  
60  
40  
20  
0
I
I
= 10
μ
A  
D
D
= 250
μ
A  
1E-005 0.0001
 
0.001  
0.01  
0.1  
1
10  
-75 -50 -25  
0
25 50 75
 
100 125 150  
Time (sec)  
T ,
 
Temperature ( °C )  
J
Fig 16.
 
Typical Power Vs. Time  
Fig 15.
 
Typical Threshold Voltage Vs.  
Junction Temperature  
8
7
UTD Semiconductor Co.,Limited  

R
UMW  
IRLML6344  
SOT-23 PACKAGE
 
OUTLINE DIMENSIONS  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
Max.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
Min.  
0.035  
0.000  
0.035  
0.012  
0.003  
0.110  
0.047  
0.089  
Max.  
0.045  
0.004  
0.041  
0.020  
0.006  
0.118  
0.055  
0.100  
A
A1  
A2  
b
c
D
E
E1  
e
e1  
L
0.950 T
Y
P
.  
0.550 REF.  
0.037 T
Y
P
.  
0.022 REF.  
1.800  
2.000  
0.071  
0.079  
L1  
θ
0.300  
0°  
0.500  
8°  
0.012  
0°  
0.020  
8°  
Marking  
Ordering information  
Package  
Deliverymode  
Order code  
Baseqty  
UMW
IRLML6344TR  
Tape and
 
reel  
SOT-23  
3000  
8
8
UTD Semiconductor Co.,Limited