VBsemi-Elec-2SK2963-VB

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VBsemi-Elec-2SK2963-VB
2SK2963  
N-Channel 100 V (D-S) MOSFET  
FEATURES  
•
MOSFET PRODUCT SUMMARY  
TrenchFET

®

Power MOSFET  
I

D

(A)

a  

V

DS

(V)  
R

DS(on)

(
) Typ.  
0.102 at V

GS

= 10 V  
0.1
2
0 at V

GS

= 6 V  
0.1
2
5 at V

GS

= 4.5 V  
Q

g

(Typ.)  
•
100 % R
 
and UIS Tested  
g
4.2  
100  
3.8  
2.9 nC  
3.6  
APPLICATIONS  
•
•
•
•
DC/DC Converters / Boost Converters  
Load Switch  
LED Backlighting in LCD TVs  
Power Management for Mobile Computing  
D
D
G
S
G
D
S
N
-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
100  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

± 20  
4.2  
T

C

= 25 °C  
T

C

= 70 °C  

A

= 25 °C  
3.5  
I

D  

Continuous Drain Current (T

J

= 150 °C)  
3.2

b,c  

2.8

b,c  

15  
T
T

A

= 70 °C  
A
I

DM  

I

S  

Pulsed Drain Current (t = 300 µs)  
T

C

= 25 °C  

A

= 25 °C  
2.1  
1

b, c  

Continuous Source-Drain Diode Current  
T
I

AS  

Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
3
L = 0.1 mH  
E

AS  

mJ  
W
0.45  
2.5  
T

C

= 25 °C  
T

C

= 70 °C  
1.6  
P

D  

Maximum Power Dissipation  
1.25

b, c  

0.8

b, c  

– 55 to 150  
T

A

= 25 °C  
T

A

= 70 °C  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
R

thJA  

Typical  
75  
Maximum  
Unit  
Maximum Junction-to-Ambient

b, d  

Maximum Junction-to-Foot (Drain)  

5 s  
Steady State  
100  
50  
°C/W  
R

thJF  

40  
Notes:  
a. Based on T

C

= 25 °C.  
b. Surface mounted on 1″ x 1″ FR4 board.  
c. t
 
= 5 s.  
d. Maximum
 
under steady state conditions is 166 °C/W.  
服务热线:400-655-8788  
1

2SK2963  
MOSFET SPECIFICATIONS
(T =
 
25 °C, unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
V

DS

T
e
mperature Coefficient  
100  
V
V

DS

/T

J  

59  
mV/°C  
V

GS(th)

T
e
mperature Coefficient  
V  
/T  
– 4.8  
GS(th) J  
V

GS(th)  

I

GSS  

V

DS

= V

GS

, I

D

= 250 µA  
V

DS

= 0
V
,
V

GS

= ± 20 V  
V

DS

= 100
V
,
V

GS

= 0 V  

DS

= 100
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
V

DS


5
V
,
V

GS

= 10 V  
V

GS

= 10
V
,
I

D

= 2 A  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
1.2  
3
V
± 100  
– 1  
nA  
I

DSS  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

µA  
A
V
– 10  
I

D(on)  

5
0.1
0
2  
0.120  
0.125  
5
Drain-Source On-State Resistance

a  

Forward
T
r
ansconductance

a  

R

DS(on)  

V

GS

= 6
V
,
I

D

= 1 A  
V

GS

= 4.5
V
,
I

D

= 1 A  
g

fs  

V

DS

= 20
V
,
I

D

= 2 A  
S
Dynamic

b  

C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
196  
67  
14  
5.2  
2.9  
1
V

DS

= 50
V
,
V

GS

= 0
V
, f = 1
M
Hz  
pF  
V

DS

= 50
V
,
V

GS

= 10
V
,
I

D

= 2.2 A  
10.4  
5.8  
Q

g  

T
o
tal Gate Charge  
nC  
Q

gs  

Q

gd  

R

g  

Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
T
u
rn-On Delay Time  
Rise Time  
V

DS

= 50
V
,
V

GS

= 4.5
V
,
I

D

= 2.2 A  
f = 1 MHz  
1.4  
4.3  
40  
68  
14  
20  
8
0.9  
8.6  
60  
102  
21  
30  
16  
20  
20  
14  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

V

DD

= 50
V
,
R

L

= 27.7
  
I

D

= 1.8 A, V

GEN

= 4.5
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
Fall Time  
ns  
T
u
rn-On Delay Time  
Rise Time  
10  
10  
7
V

DD

= 50
V
,
R

L

= 27.7
  
I

D

= 1.8 A, V

GEN

= 10
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
Fall Time  
Drain-Source Body Diode Characteristics  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
I

S

= 1.8 A  
Continuous Source-Drain Diode Current  
– 2.1  
– 8  
A
Pulse Diode Forward Current

a  

Body Diode Voltage  
– 0.8  
23  
21  
17  
6
– 1.2  
35  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Q

rr  

t

a  

32  
I

F

= 1.8 A, dI/dt = 100 A/µs,  
T

J

= 25 °C  
ns  
t

b  

Notes:  
a. Pulse test; pulse width
300 µs, duty cycle
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

2SK2963  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
1
0.8  
0.6  
0.4  
0.2  
0
8
6
4
2
0
V

GS

= 10 V thru 5 V  
V

GS

= 4.5 V  
V

GS

= 4 V  
T

C

= 25
°
C  
T

C

= 125
°
C  
V

GS

= 3 V  
T

C

= – 55
°
C  
0
0.5  
1
1.5  
2
0
1
2
3
4
V

DS

– Drain-to-Source Voltage (V)  
V

GS

– Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
280  
210  
140  
70  
0.15  
0.13  
0.11  
0.09  
0.07  
C

iss  

V

GS

= 4.5 V  
V

GS

= 6 V  
V

GS

= 10 V  
C

oss  

C

rss  

0
0
2
4
6
8
0
20  
40  
60  
80  
100  
I

D

– Drain Current (A)  
V

DS

– Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
2
1.7  
1.4  
1.1  
0.8  
0.5  
10  
V

GS

= 10 V, 2 A  
I

D

= 2.2 A  
8
6
4
2
0
V

DS

= 25 V  
V

GS

= 4.5 V, 1 A  
V

DS

= 80 V  
V

GS

= 6 V, 1 A  
0
1.5  
3
4.5  
6
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
Q

g

– Total Gate Charge (nC)  
T

J

– Junction Temperature (
°
C)  
Gate Charge  
On-Resistance vs. Junction Temperature  
服务热线:400-655-8788  
3

2SK2963  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
100.0  
10.0  
1.0  
0.35  
0.28  
0.21  
0.14  
0.07  
0
I

D

= 2 A  
T

J

= 125
°
C  
T

J

= 150
°
C  
T

J

= 25
°
C  
T

J

= 25
°
C  
0.1  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
V

SD

– Source-to-Drain Voltage (V)  
V

GS

– Gate-to-Source Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
10  
8
2.8  
2.5  
2.2  
1.9  
1.6  
6
I

D

= 250 μA  
4
2
T =
 
25 °C  
A
0
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
100  
1000  
Time (s)  
T

J

– Temperature (
°
C)  
Threshold Voltage  
Single Pulse Power  
100  
Limited by R

DS(on)  

*
10  
1
100 μs  
1 ms  
10 ms  
0.1  
0.01  
100 ms  
10 s, 1s  
DC  
BVDSS Limited  
T

A

= 25
°
C  
Single Pulse  
0.001  
0.1  
1
10  
100  
1000  
V

DS

– Drain-to-Source Voltage (V)  
* V

GS

> minimum V

GS

at which R

DS(on)

is specified  
Safe Operating Area  
服务热线:400-655-8788  
4

2SK2963  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
3.5  
2.8  
2.1  
1.4  
0.7  
0
0
25  
50  
75  
100  
125  
150  
T

C

– Case Temperature (
°
C)  
Current Derating*  
3
2.4  
1.8  
1.2  
0.6  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T

A

– Ambient Temperature (
°
C)  
T

C

– Case Temperature (
°
C)  
Power, Junction-to-Foot  
Power, Junction-to-Ambient  
* The power dissipation P

D

is based on T

J(max.)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
服务热线:400-655-8788  
5

2SK2963  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
N
otes:  
P
DM  
0.05  
t
1
0.02  
t
2
t
t
1
2
1. D
u
ty Cycle, D =  
2. Per Unit Base = R  
= 166 °C/
W  
thJA  
(t)  
= P  
Z
3. T
 
– T  
A
DM thJA  
JM  
4. S
u
rface Mo
u
nted  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
100  
1000  
10  
S
qu
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
S
qu
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
服务热线:400-655-8788  
6

2SK2963  
Package outline – SOT89  
D
A
C
D1  
E
E1  
H
L
B
e
B1  
e1  
DIM  
Millimeters  
Inches  
DIM  
Millimeters  
Inches  
Min  
Max  
1.60  
0.56  
0.48  
0.44  
4.60  
1.83  
Min  
Max  
Min  
Max  
2.60  
2.29  
Min  
Max  
0.102  
0.090  
A
B
1.40  
0.44  
0.36  
0.35  
4.40  
1.62  
0.550  
0.017  
0.014  
0.014  
0.173  
0.064  
0.630  
0.022  
0.019  
0.017  
0.181  
0.072  
E
E1  
e
2.29  
2.13  
0.090  
0.084  
B1  
C
1.50 BSC  
3.00 BSC  
0.059 BSC  
0.118 BSC  
e1  
H
D
3.94  
0.89  
4.25  
1.20  
0.155  
0.035  
0.167  
0.047  
D1  
L
Note:
Controlling dimensions are in millimeters. Approximate dimensions are provided in inches  
服务热线:400-655-8788  
7

2SK2963  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
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T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
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names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
RoHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as

Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
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conform to confirm compliance with IEC 61249-2-21 standard level JS709A.