VBsemi-Elec-BSO200N03S-VB

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VBsemi-Elec-BSO200N03S-VB
BSO200N03S  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
Halogen-free According to IEC 61249-2-21  
V

DS

(V)  
R

DS(on)

(
Ω
)  
Q

g

(Typ.)  
I

D

(A)

a  

Definition  
•
•
T
r
enchFET

®

Power MOSFET  
Compliant to RoHS Directive 2002/95/EC  
0.0
16
at V

GS

= 10 V  
0.
029
at V

GS

= 4.5 V  
6.8  
5.8  
30  
9.2 nC  
APPLICATIONS  
•
Notebook Load Switch  
D
•
Low Current dc-to-dc  
SO-8  
S
S
S
G
D
D
D
D
1
2
3
4
8
7
6
5
G
S
T
o
p
V
ie
w  
N
-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
T =
 
25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

± 20  
6.8

a  

5

a  

6.5

b,c  

4.9

b,c  

30  
T

C

= 25 °C  

C

= 70 °C  
T
Continuous Drain Current (T

J

= 150 °C)  
I

D  

T

A

= 25 °C  
T

A

= 70 °C  
A
I

DM  

I

S  

Pulsed Drain Current  
2.7  
1.7

b,c  

T

C

= 25 °C  
T

A

= 25 °C  
T

C

= 25 °C  
Continuous Source-Drain Diode Current  
4.1  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
2.6  
2

b,c  

1.25

b,c  

P

D  

Maximum Power Dissipation  
W
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
45  
Maximum  
Unit  
°C/W  
Maximum Junction-to-Ambient

b, d  

Maximum Junction-to-Foot  
R

thJA  

R

thJF  

t
≤
5 s  
Steady State  
62.5  
30  
25  
Notes:  
a. Package
 
Limited.  
b. Surface
 
mounted on 1″ x 1″ FR4 board.  
c. t
 
= 5 s.  
d. Maximum
 
under Steady State conditions is 110 °C/W.  
服务热线:400-655-8788  
1

BSO200N03S  
SPECIFICATIONS
T =
 
25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

Δ
V

DS

/T

J  

Δ
V

GS(th)

/T

J  

V

GS(th)  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
30  
V
V

DS

T
e
mperature Coefficient  
33  
mV/°C  
V

GS(th)

T
e
mperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
– 6.2  
V

DS

= V

GS

, I

D

= 250 µA  
V

DS

= 0
V
,
V

GS

= ± 20 V  
1
3
± 100  
1
V
I

GSS  

nA  
V

DS

= 30
V
,
V

GS

= 0 V  
I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

µA  
A
V

DS

= 30
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
10  
V

DS

≥
5
V
,
V

GS

= 10 V  
V

GS

= 10
V
,
I

D

= 5 A  
V

GS

= 4.5
V
,
I

D

= 4 A  
V

DS

= 10
V
,
I

D

= 5 A  
20  
0.016  
0.029  
24  
Drain-Source On-State Resistance

a  

Forward
T
r
ansconductance

a  

Ω
S
Dynamic

b  

C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
1295  
170  
72  
V

DS

= 15
V
,
V

GS

= 0
V
, f = 1
M
Hz  
pF  
V

DS

= 15
V
,
V

GS

= 10
V
,
I

D

= 5 A  
21.8  
9.2  
3.8  
2.5  
2.4  
21  
33  
14  
Q

g  

T
o
tal Gate Charge  
nC  
Q

gs  

Q

gd  

R

g  

V

DS

= 15
V
,
V

GS

= 4.5
V
,
I

D

= 5 A  
f = 1 MHz  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
T
u
rn-On Delay Time  
Rise Time  
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

40  
25  
40  
18  
20  
16  
35  
16  
V

DD

= 15
V
,
R

L

= 3
Ω  
14  
I

D

≅
5 A, V

GEN

= 4.5
V
,
R

g

= 1
Ω  
T
u
rn-Off DelayTime  
Fall Time  
20  
9
ns  
T
u
rn-On Delay Time  
Rise Time  
10  
V

DD

= 15
V
,
R

L

= 3
Ω  
8
I

D

≅
5 A, V

GEN

= 10
V
,
R

g

= 1
Ω  
T
u
rn-Off DelayTime  
Fall Time  
21  
8
Drain-Source Body Diode Characteristics  
Continous Source-Drain Diode Current  
Pulse Diode Forward Current  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
2.7  
30  
A
I

S

= 1.7 A, V

GS

= 0 V  
Body Diode Voltage  
0.77  
21  
15  
13  
8
1.2  
40  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
ns  
nC  
Q

rr  

t

a  

30  
I

F

= 3 A, dI/dt = 100 A/µs, T

J

= 25 °C  
ns  
t

b  

Reverse Recovery Rise Time  
Notes:  
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

BSO200N03S  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
30  
1.5  
1.2  
0.9  
0.6  
0.3  
0.0  
V
GS  
= 10
V
thr
u
4
V  
24  
1
8  
12  
6
T
C
= 25 °C  
T
C
= 125 °C  
V
GS  
= 3
V  
T
C
= – 55 °C  
4
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0
1
2
3
5
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
Output Characteristics  
Transfer Characteristics  
0.030  
0.026  
0.022  
0.01
8  
0.014  
0.010  
1600  
12
8
0  
960  
640  
320  
0
C
iss  
V
GS  
= 4.5
V  
V
GS  
= 10
V  
C
oss  
C
rss  
0
6
12  
1
8  
24  
30  
0
6
12  
1
8  
24  
30  
I
– Drain C
u
rrent (A)  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
D
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
10  
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
I
D
= 5 A  
I
D
= 5 A  
8
6
4
2
0
V
DS  
= 10
V  
V
GS  
= 10
V  
V
= 15
V  
DS  
V
GS  
= 4.5
V  
V
DS  
= 20
V  
0
5
10  
15  
20  
25  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
Q
g
–
T
o
tal Gate Charge (nC)  
T –
 
J
u
nction
T
e
mperat
u
re (°C)  
J
Gate Charge  
On-Resistance vs. Junction Temperature  
服务热线:400-655-8788  
3

BSO200N03S  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
100  
0.10  
0.0
8  
0.06  
0.04  
0.02  
0
10  
T
J
= 150 °C  
1
0.1  
T
J
= 25 °C  
T
= 125 °C  
= 25 °C  
A
0.01  
0.001  
T
A
0
1
2
3
4
5
6
7
8
9
10  
0.0  
0.2  
0.4  
0.6  
0.
8  
1.0  
1.2  
V
SD  
– So
u
rce-to-Drain
V
oltage (
V
)  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Temperature  
0.6  
0.3  
60  
I
= 250
µ
A  
D
4
8  
36  
24  
12  
0
I
= 5 mA  
D
0
– 0.3  
– 0.6  
– 0.9  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
T
J
–
T
e
mperat
u
re (°C)  
Time (s)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
100  
Limited
b
y R  
*
DS(on)  
10  
1
1 ms  
10 ms  
100 ms  
0.1  
1 s, 10 s  
DC  
0.01  
0.001  
T
= 25 °C  
A
Single P
u
lse  
0.1  
1
10  
100  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
*
V  
GS  
minim
u
m
V
at
w
hich R  
is specified  
DS(on)  
GS  
Safe Operating Area, Junction-to-Ambient  
服务热线:400-655-8788  
4

BSO200N03S  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
12  
10  
Package Limited  
7
5
2
0
0
25  
50  
75  
100  
125  
150  
T
C
– Case
T
e
mperat
u
re (°C)  
Current Derating*  
5
4
3
2
1
0
1.5  
1.2  
0.9  
0.6  
0.3  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T
C
– Case
T
e
mperat
u
re (°C)  
T
A
– Am
b
ient
T
e
mperat
u
re (°C)  
Power Derating, Junction-to-Foot  
Power Derating, Junction-to-Ambient  
* The power dissipation P

D

is based on T

J(max)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
服务热线:400-655-8788  
5

BSO200N03S  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
N
otes:  
0.1  
P
DM  
0.05  
0.01  
t
1
t
2
t
t
0.02  
1
1. D
u
ty Cycle, D =  
2
2. Per Unit Base = R  
= 110 °C/
W  
thJA  
(t)  
3. T
 
– T
 
= P  
Z
JM  
A
DM thJA  
Single P
u
lse  
4. S
u
rface Mo
u
nted  
0.001  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
1000  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
服务热线:400-655-8788  
6

BSO200N03S  
S
OIC (NARROW): 8-LEAD  
JEDEC P
a
rt N
u
m
b
er: M
S
-012  
8
6
7
2
5
4
E
H
1
3
S
h x 45  
D
C
0.25 mm (G
a
ge Pl
a
ne)  
A
All Le
a
d
s  
0.101 mm  
0.004″  
q
e
B
A
1
L
MILLIMETERS  
Max  
INCHES  
DIM  
A
Min  
Min  
Max  
1.35  
0.10  
0.35  
0.19  
4.80  
3.80  
1.75  
0.20  
0.51  
0.25  
5.00  
4.00  
0.053  
0.004  
0.014  
0.0075  
0.189  
0.150  
0.069  
0.008  
0.020  
0.010  
0.196  
0.157  
A

1  

B
C
D
E
e
1.27 BSC  
0.050 BSC  
H
h
5.80  
0.25  
0.50  
0°  
6.20  
0.50  
0.93  
8°  
0.228  
0.010  
0.020  
0°  
0.244  
0.020  
0.037  
8°  
L
q
S
0.44  
0.64  
0.018  
0.026  
ECN: C-06527-Rev. I, 11-Sep-06  
DWG: 5498  
服务热线:400-655-8788  
7

BSO200N03S  
RECOMMENDED MINIMUM
P
A
DS FOR SO-8  
0.172  
(4.369)  
0.028  
(0.711)  
0.022  
0.050  
(0.559)  
(1.270)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
服务热线:400-655-8788  
8

BSO200N03S  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
injury or death, use or sale of products used in
T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
The information provided in this document and the company’s products without a license, express or implied,  
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product  
names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
RoHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as

Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.