VBsemi-Elec-CSD17304Q3-VB

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VBsemi-Elec-CSD17304Q3-VB
CSD17304Q3  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
•
Halogen-free According to IEC 61249-2-21  
PRODUCT SUMMARY  
Definition  
V

DS

(V)  
R

DS(on)

(
) Typ.  
Q

g

(Typ.)  
I

D

(A)  
•
•
•
TrenchFET

®

Power MOSFET  
100 % R

g

and UIS Tested  
Compliant to RoHS Directive 2002/95/EC  
0.004 at V

GS

= 4.5 V  
0.005 at
V

GS

= 2.5 V  
6
0  
30  
33.5 nC  
50  
APPLICATIONS  
•
•
•
•
Motor Control  
Industrial  
Load Switch  
ORing  
DFN 3×3 EP  
D
Bottom View  
Top View  
Top View  
1
8
2
3
7
6
G
4
5
S
Pin 1  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
Unit  
V

DS  

V

GS  

Drain-Source Voltage  
Gate-Source Voltage  
30  
20  
V
6
0

a, e  

T

C

= 25 °C  
40

a, e  

T
T

C

= 70 °C  

A

= 25 °C  
I

D  

Continuous Drain Current (T

J

= 150 °C)  
22

b, c  

15

b, c  

150  
T

A

= 70 °C  
A
I

DM  

I

S  

Pulsed Drain Current (t = 300 µs)  
T

C

= 25 °C  
35  
Continuous Source-Drain Diode Current  
3.3

b, c  

20  
T

A

= 25 °C  
I

AS  

E

AS  

Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
mJ  
W
20  
52  
33  
T

C

= 25 °C  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
P

D  

Maximum Power Dissipation  
3.7

b, c  

2.4

b, c  

– 55 to 150  
260  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
Soldering Recommendations (Peak
T
e
mperature)  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
R

thJA  

R

thJC  

Typical  
24  
Maximum  
Unit  
Maximum Junction-to-Ambient

b, d  

Maximum Junction-to-Case (Drain)  
t
10 s  
Steady State  
33  
°C/W  
1.9  
2.4  
Notes:  
a. Based on T

C

= 25 °C.  
b. Surface mounted on 1″ x 1″ FR4 board.  
c. t = 10 s.  
d. Maximum under steady state conditions is 90 °C/W.  
e. Calculated based on maximum junction temperature. Package limitation current is
8
0 A.  
服务热线:400-655-8788  
1

CSD17304Q3  
SPECIFICATIONS
(T =
 
25 °C, unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

V

DS

/T

J  

V

GS(th)

/T

J  

V

GS(th)  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
V

DS

T
e
mperature Coefficient  
V

GS(th)

T
e
mperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
30  
V
30  
mV/°C  
– 5.6  
V

DS

= V

GS

, I

D

= 250 µA  
0.5  
30  
1.5  
100  
1
V
I

GSS  

V

DS

= 0
V
,
V

GS  

=
20 V  
nA  
V

DS

= 30
V
,
V

GS

= 0 V  

DS

= 30
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
V

DS


5
V
,
V

GS

= 10 V  
V

GS

4.5 V, I

D

= 10 A  
V

GS


2.5 V,
I

D

= 7 A  
I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

µA  
A
V
10  
0.0040  
0.0050  
65  
Drain-Source On-State Resistance

a  

S
Forward
T
r
ansconductance

a  

V

DS

= 15
V
,
I

D

= 10 A  
Dynamic

b  

C

iss  

C

oss  

C

rss  

Input Capacitance  
6000  
406  
360  
68  
V

DS

= 15
V
,
V

GS

= 0
V
, f = 1
M
Hz  
Output Capacitance  
pF  
Reverse
T
r
ansfer Capacitance  
V

DS

= 15
V
,
V

GS

= 10
V
,
I

D

= 10 A  
102  
51  
Q

g  

T
o
tal Gate Charge  
33.5  
7.7  
13.8  
0.7  
24  
nC  
Q

gs  

Q

gd  

R

g  

Gate-Source Charge  
V

DS

= 15
V
,
V

GS

= 4.5
V
,
I

D

= 10 A  
f = 1 MHz  
Gate-Drain Charge  
Gate Resistance  
0.3  
1.4  
45  
45  
60  
24  
28  
26  
60  
16  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-On Delay Time  
Rise Time  
24  
V

DD

= 15
V
,
R

L

= 1.5
  
I

D

10 A, V

GEN

= 4.5
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
32  
Fall Time  
12  
ns  
T
u
rn-On Delay Time  
14  
Rise Time  
13  
V

DD

= 15
V
,
R

L

= 1.5
  
I

D

10 A, V

GEN

= 10
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
33  
Fall Time  
8
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Current  
Body Diode Voltage  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
35  
70  
0.7  
21  
10  
9
A
I

S

= 3 A, V

GS


0 V  
1.1  
40  
20  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Q

rr  

t

a  

I

F

= 10 A, dI/dt = 100 A/µs, T

J

= 25 °C  
ns  
t

b  

12  
Notes:  
a. Pulse test; pulse width
300 µs, duty cycle
2 %  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

CSD17304Q3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
70  
56  
42  
28  
14  
10  
V

GS

= 10 V thru 4 V  
8
6
V

GS

= 3 V  
T

C

= 25
°
C  
4
V

GS

= 2 V  
2
T

C

= – 55
°
C  
T

C

= 125
°
C  
0
0
6.0  
0
0.5  
1
1.5  
2
2.5  
0
3.0  
4.5  
1.5  
7.5  
V

DS

– Drain-to-Source Voltage (V)  
V

GS

– Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.0120  
0.0100  
0.0080  
0.0060  
0.0040  
0.0020  
4500  
3600  
2700  
1800  
900  
C

iss  

V

GS

= 4.5 V  
V

GS

= 10 V  
C

oss  

C

rss  

0
0
12  
24  
36  
48  
60  
0
5
10  
15  
20  
25  
30  
I

D

– Drain Current (A)  
V

DS

– Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
10  
1.8  
I

D

= 10 A  
I

D

= 10 A  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
8
V

GS

= 10 V  
V

DS

= 15 V  
6
V

DS

= 10 V  
V

GS

= 4.5 V  
V

DS

= 20 V  
4
2
0
– 50  
– 25  
0
25  
50  
75  
100  
125  
150  
0
14  
28  
42  
56  
70  
Q

g

– Total Gate Charge (nC)  
T

J

– Junction Temperature (
°
C)  
Gate Charge  
On-Resistance vs. Junction Temperature  
服务热线:400-655-8788  
3

CSD17304Q3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
0.015  
0.012  
0.009  
0.006  
0.003  
0.000  
100  
I

D

= 10 A  
10  
T

J

= 150
°
C  
T

J

= 25 °C  
1
0.1  
T

J

= 125
°
C  
0.01  
0.001  
T

J

= 25
°
C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
2
4
6
8
10  
V

SD

– Source-to-Drain Voltage (V)  
V

GS

– Gate-to-Source Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.4  
0.2  
100  
80  
60  
40  
20  
0
0
I

D

= 5 mA  
– 0.2  
– 0.4  
– 0.6  
– 0.8  
I

D

= 250 μA  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
100  
T

J

– Temperature (
°
C)  
Time (s)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
100  
I

DM

Limited  
I

D

Limited  
100 μs  
10  
1
1 ms  
Limited by R

DS(on)  

*
10 ms  
100 ms  
1 s  
0.1  
0.01  
10 s  
T

A

= 25
°
C  
DC  
Single Pulse  
BVDSS Limited  
10  
0.01  
0.1  
1
100  
V

DS

– Drain-to-Source Voltage (V)  
* V

GS

> minimum V

GS

at which R

DS(on)

is specified  
Safe Operating Area, Junction-to-Ambient  
服务热线:400-655-8788  
4

CSD17304Q3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
100  
80  
60  
40  
20  
0
Limited by Package  
0
25  
50  
75  
100  
125  
150  
T

C

– Case Temperature (
°
C)  
Current Derating*  
65  
52  
39  
26  
13  
0
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T

C

– Case Temperature (°C)  
T

A

– Ambient Temperature (°C)  
Power, Junction-to-Case  
Power, Junction-to-Ambient  
* The power dissipation P

D

is based on T

J(max.)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
服务热线:400-655-8788  
5

CSD17304Q3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
1
Duty Cycle = 0.5  
0.2  
Notes:  
0.1  
0.1  
P
DM  
0.05  
0.02  
t
1
t
2
t
1
1. Duty Cycle, D =  
t
2
2. Per Unit Base = R  
= 81 °C/W  
thJA  
(t)  
3. T
 
– T
 
= P  
JM  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.02  
0.1  
Single Pulse  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
服务热线:400-655-8788  
6

CSD17304Q3  
服务热线:400-655-8788  
7

CSD17304Q3  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
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representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
product.(www.VBsemi.com)  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
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including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
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aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
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aiwan VBsemi products are not intended for use in medical, life saving,  
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T
aiwan VBsemi such applications using client did not express their  
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T
aiwan VBsemi people who are related to product design applications and  
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Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
oHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as inconsistent.(www.VBsemi.com)  
Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.