VBsemi-Elec-IRFR3709ZCT-VB

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VBsemi-Elec-IRFR3709ZCT-VB
IRFR3709ZCT  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
TrenchFET

®

Power MOSFET  
PRODUCT SUMMARY  
•
•
•
V

DS

(V)  
R

DS(on)

(
)  
Q

g

(Typ)  
I

D

(A)

a, e  

100  
100 % R

g

and UIS Tested  
Compliant to RoHS Directive 2011/65/EU  
0.00
2
at V

GS

= 10 V  
0.00
3
at V

GS

= 4.5 V  
30  
7
2 nC  
90  
APPLICATIONS  
D
•
•
•
OR-ing  
Server  
DC/DC  
TO-252  
G
G
D
S
Top View  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

± 20  
100

a, e  

80

e  

T

C

= 25 °C  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
Continuous Drain Current (T

J

= 175 °C)  
I

D  

35
.8

b, c  

A
2
7

b, c  

300  
3
9  
I

DM  

I

AS  

Pulsed Drain Current  
Avalanche Current Pulse  
Single Pulse Avalanche Energy  
L = 0.1 mH  
E

AS  

9
4.8  
90

a, e  

mJ  
T

C

= 25 °C  
T

A

= 25 °C  
T

C

= 25 °C  
I

S  

Continuous Source-Drain Diode Current  
A
3.13

b, c  

235

a  

165  
T

C

= 70 °C  

A

= 25 °C  
P

D  

Maximum Power Dissipation  
W
3.75

b, c  

T
2.63

b, c  

T

A

= 70 °C  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 175  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typ.  
32  
Max.  
40  
Unit  
Maximum Junction-to-Ambient

b, d  

Maximum Junction-to-Case  
R

thJA  

t
10 sec  
°C/W  
R

thJC  

Steady State  
0.5  
0.6  
Notes:  
a. Based on T

C

= 25 °C.  
b. Surface mounted on 1″ x 1″ FR4 board.  
c. t = 10 sec.  
d. Maximum under steady state conditions is 90 °C/W.  
e. Calculated based on maximum junction temperature. Package limitation current is 90 A.  
1
1

IRFR3709ZCT  
SPECIFICATIONS
(T =
 
25 °C, unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

V

DS

/T

J  

V

GS(th)

/T

J  

V

GS(th)  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
30  
V
V

DS

T
e
mperature Coefficient  
35  
mV/°C  
V

GS(th)

T
e
mperature Coefficient  
– 7.5  
V

DS

= V

GS

, I

D

= 250 µA  
V

DS

= 0
V
,
V

GS

= ± 20 V  
V

DS

= 30
V
,
V

GS

= 0 V  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
1.5  
90  
2.5  
± 100  
1
V
I

GSS  

nA  
I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

µA  
A
V

DS

= 30
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
V

DS


5
V
,
V

GS

= 10 V  
10  
V

GS

= 10 V, I

D

=
3
8.8 A  
V

GS

= 4.5 V, I

D

=
3
7 A  
0.00
2  
0.00
3  
160  
Drain-Source On-State Resistance

a  

S
Forward
T
r
ansconductance

a  

Dynamic

b  

V

DS

= 15 V, I

D

=
3
8.8 A  
C

iss  

C

oss  

C

rss  

Input Capacitance  
5201  
1525  
770  
151  
71.5  
30  
V

DS

= 15
V
,
V

GS

= 0
V
, f = 1
M
Hz  
V

DS

= 15 V, V

GS

= 10 V, I

D

=
3
8.8 A  
V

DS

= 15 V, V

GS

= 4.5 V, I

D

=
2
8.8 A  
f = 1 MHz  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
pF  
227  
103  
Q

g  

T
o
tal Gate Charge  
nC  
Q

gs  

Q

gd  

R

g  

Gate-Source Charge  
Gate-Drain Charge  
24  
Gate Resistance  
1.4  
18  
2.1  
27  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-On Delay Time  
Rise Time  
11  
17  
V

DD

= 15
V
,
R

L

= 0.625
  
I

D

24 A, V

GEN

= 10
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
70  
105  
15  
Fall Time  
10  
ns  
T
u
rn-On Delay Time  
55  
83  
Rise Time  
180  
55  
270  
83  
V

DD

= 15
V
,
R

L

= 0.67
  
I

D

22.5 A, V

GEN

= 4.5
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
Fall Time  
12  
18  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Current

a  

Body Diode Voltage  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
I

S

= 22 A  
120  
120  
1.2  
78  
A
0.8  
52  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Q

rr  

t

a  

70.2  
27  
105  
I

F

= 20 A, di/dt = 100 A/µs, T

J

= 25 °C  
ns  
t

b  

25  
Notes:  
a. Pulse test; pulse width
300 µs, duty cycle
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
2
2

IRFR3709ZCT  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
90  
75  
60  
45  
30  
15  
0
3.0  
2.4  
1.
8  
1.2  
0.6  
0.0  
V
= 10
V
thr
u
4
V  
GS  
T
= 25 °C  
C
T
C
= 125 °C  
V
GS  
= 2
V  
V
GS  
= 3
V  
T
C
= – 55 °C  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0
1
2
3
4
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
Output Characteristics  
Transfer Characteristics  
600  
500  
400  
300  
200  
100  
0
0.00
60  
0.00
50  
0.00
4
0  
0.00
3
0  
0.00
20  
0.00
10  
0.00
0
 
T
= 25 °C  
C
T
= 125 °C  
= – 55 °C  
C
V
= 4.5
V  
= 10
V  
GS  
V
GS  
T
C
0
10  
20  
30  
40  
50  
60  
70  
8
0  
90  
0
15  
30  
45  
60  
75  
90  
I
D
– Drain
 
C
u
rrent (A)  
I
D
– Drain
 
C
u
rrent (A)  
Transconductance  
R

DS(on)

vs. Drain Current  
8
000  
6
000  
4
000  
2
000  
1
000  
0
10  
8
V
DS  
= 15
V  
I
D
=
3
8
.
8
A  
C
iss  
V
DS  
= 24
V  
6
4
C
oss  
2
C
rss  
0
0
6
12  
1
8  
24  
30  
0
30  
60  
90  
120  
150  
1
8
0  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
Q
–
T
o
tal
 
Gate Charge (nC)  
g
Capacitance  
Gate Charge  
3
3

IRFR3709ZCT  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
100  
1.
2  
1.
0  
0
.
8  
0
.
6  
0.
4  
0.
2  
V
= 10
V
, I
 
=
3
8
.
8
A  
GS  
D
V
= 4.5
V
, I
 
= 27 A  
GS  
D
10  
1
T
= 150 °C  
J
T
= 25 °C  
J
0.1  
0.01  
0.001  
0
0.2  
0.4  
– So
u
rce-to-Drain
V
oltage (
V
)  
SD  
0.6  
0.
8  
1
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
V
T
– J
u
nction
T
e
mperat
u
re (°C)  
J
On-Resistance vs. Junction Temperature  
Forward Diode Voltage vs. Temperature  
0.005  
0.004  
0.003  
0.002  
0.001  
0.000  
2.
8  
2.4  
2.0  
1.6  
1.2  
0.
8  
I
=
3
8
.
8
A  
D
T
A
= 125 °C  
I
D
= 250
µ
A  
T
= 25 °C  
A
0
2
4
6
8
10  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150
 
175  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
T
J
–
T
e
mperat
u
re (°C)  
R

DS(on)

vs. V

GS

vs. Temperature  
Threshold Voltage  
1000  
*Limited by r  
DS (on)  
100  
10  
10 ms  
100 ms  
1
0.1  
1 s  
10 s  
dc  
0.01  
T
= 25 °C  
A
Single Pulse  
0.001  
0.1  
1
10  
100  
V
DS  
– Drain-to-Source Voltage (V)  
*V  
GS  
minimum V
 
at which r  
is specified  
GS  
DS(on)  
Safe Operating Area, Junction-to-Ambient  
4
4

IRFR3709ZCT  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
300  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
Package Limited  
0
0
0
25  
50  
75  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
150  
175  
T
T
C
– Case
T
e
mperat
u
re (°C)  
– Case
T
e
mperat
u
re (°C)  
C
Current Derating*  
Power Derating  
*The power dissipation P

D

is based on T

J(max)

= 175 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
–
4  
–
3  
10  
–
2  
10  
–
1  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Case  
5
5

IRFR3709ZCT  
TO-252AA CASE OUTLINE  
E
A
MILLIMETERS  
INCHES  
C2  
b3  
DIM.  
A
MIN.  
MAX.  
2.38  
0.127  
0.88  
1.14  
5.46  
0.61  
0.89  
6.22  
–
MIN.  
MAX.  
0.094  
0.005  
0.035  
0.045  
0.215  
0.024  
0.035  
0.245  
–
2.18  
–
0.086  
–
A1  
b
0.64  
0.76  
4.95  
0.46  
0.46  
5.97  
5.21  
6.35  
4.32  
9.40  
0.025  
0.030  
0.195  
0.018  
0.018  
0.235  
0.205  
0.250  
0.170  
0.370  
b2  
b3  
C
C2  
D
D1  
E
6.73  
–
0.265  
–
E1  
H
b
C
b2  
e
10.41  
0.410  
A1  
e1  
e
2.28 BSC  
4.56 BSC  
1.40  
0.090 BSC  
0.180 BSC  
e1  
L
1.78  
1.27  
1.02  
1.52  
0.055  
0.070  
0.050  
0.040  
0.060  
L3  
L4  
L5  
0.89  
–
0.035  
–
1.14  
0.045  
ECN:
X12-0247
-Rev. M, 24-Dec-12  
DWG: 5347  
E1  
Note  
Dimension L3 is for reference only.  
•
6
6

IRFR3709ZCT  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
injury or death, use or sale of products used in
T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
The information provided in this document and the company’s products without a license, express or implied,  
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product  
names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
RoHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as

Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.  
7