VBsemi-Elec-RSS065N06-TB-VB

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VBsemi-Elec-RSS065N06-TB-VB
RSS065N06-TB  
N-Channel 60-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
Halogen-free According to IEC 61249-2-21  
I

D

(A)

d  

V

DS

(V)  
R

DS(on)

(
Ω
)  
Q

g

(Typ.)  
Definition  
•
•
TrenchFET

®

Power MOSFET  
Optimized for “Low Side” Synchronous  
Rectifier Operation  
0.025 at V

GS

= 10 V  
7.6  
6.5  
60  
10.5 nC  
0.03
5
at V

GS

= 4.5 V  
•
100 % R

g

and UIS Tested  
APPLICATIONS  
D
•
CCFL Inverter  
SO-8  
S
S
S
G
1
2
3
4
8
7
6
5
D
D
G
D
D
S
Top View  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
T =
 
25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
60  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

± 20  
7.6

a  

T

C

= 25 °C  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
6.8  
Continuous Drain Current (T

J

= 150 °C)  
I

D  

6.1

b, c  

4.8

b, c  

25  
A
I

DM  

I

S  

Pulsed Drain Current  
T

C

= 25 °C  
T

A

= 25 °C  
4.2  
2.1

b, c  

Continuous Source-Drain Diode Current  
I

AS  

Avalanche Current  
15  
L = 0.1 mH  
E

AS  

Single-Pulse Avalanche Energy  
11.2  
5
mJ  
W
T

C

= 25 °C  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
3.2  
P

D  

Maximum Power Dissipation  
2.5

b, c  

1.6

b, c  

– 55 to 150  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambient

b, d  

Symbol  
Typical  
38  
Maximum  
Unit  
°C/W  
R

thJA  

R

thJF  

t
≤
10 s  
Steady State  
50  
25  
Maximum Junction-to-Foot (Drain)  
20  
Notes:  
a. Package
 
limited.  
b. Surface
 
mounted on 1″ x 1″ FR4 board.  
c. t
 
= 10 s.  
d. Maximum
 
under Steady State conditions is 85 °C/W.  
服务热线:400-655-8788  
1

RSS065N06-TB  
SPECIFICATIONS
T =
 
25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

Δ
V

DS

/T

J  

Δ
V

GS(th)

/T

J  

V

GS(th)  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
60  
V
V

DS

T
e
mperature Coefficient  
55  
mV/°C  
V

GS(th)

T
e
mperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
– 6.3  
V

DS

= V

GS

, I

D

= 250 µA  
V

DS

= 0
V
,
V

GS

= ± 20 V  
1.2  
25  
2.5  
± 100  
1
V
I

GSS  

nA  
V

DS

= 60
V
,
V

GS

= 0 V  
I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

µA  
A
V

DS

= 60
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
10  
V

DS

≥
5
V
,
V

GS

= 10 V  
V

GS

= 10
V
,
I

D

= 4.6 A  
V

GS

= 4.5
V
,
I

D

= 4.2 A  
V

DS

= 15
V
,
I

D

= 4.6 A  
0.025  
0.035  
20  
Drain-Source On-State Resistance

a  

Forward
T
r
ansconductance

a  

Ω
S
Dynamic

b  

C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
1100  
90  
V

DS

= 30
V
,
V

GS

= 0
V
, f = 1
M
Hz  
pF  
55  
V

DS

= 30
V
,
V

GS

= 10
V
,
I

D

= 4.6 A  
21  
32  
16  
Q

g  

T
o
tal Gate Charge  
10.5  
3.5  
4.2  
3.3  
20  
nC  
Q

gs  

Q

gd  

R

g  

V

DS

= 30
V
,
V

GS

= 4.5
V
,
I

D

= 4.6 A  
f = 1 MHz  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
T
u
rn-On Delay Time  
Rise Time  
5
30  
225  
30  
90  
15  
25  
40  
15  
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

V

DD

= 30
V
,
R

L

= 5.4
Ω  
150  
20  
I

D

≅
5.6 A, V

GEN

= 4.5
V
,
R

g

= 1
Ω  
T
u
rn-Off DelayTime  
Fall Time  
60  
ns  
T
u
rn-On Delay Time  
Rise Time  
10  
V

DD

= 30
V
,
R

L

= 5.4
Ω  
15  
I

D

≅
5.6 A, V

GEN

= 10
V
,
R

g

= 1
Ω  
T
u
rn-Off DelayTime  
Fall Time  
25  
10  
Drain-Source Body Diode Characteristics  
Continous Source-Drain Diode Current  
Pulse Diode Forward Current

a  

I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
I

S

= 2 A  
4.2  
25  
A
Body Diode Voltage  
0.8  
25  
25  
19  
6
1.2  
50  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
ns  
nC  
Q

rr  

t

a  

50  
I

F

= 5.5 A, dI/dt = 100 A/µs, T

J

= 25 °C  
ns  
Reverse Recovery Rise Time  
t

b  

Notes:  
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

RSS065N06-TB  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
25  
5
4
3
2
1
0
V
GS  
= 10
V
thr
u
4
V  
T
= – 55 °C  
C
20  
15  
10  
5
I
D
= 25 °C  
I
D
= 125 °C  
V
GS  
= 3
V  
0
0.0 0.2 0.4 0.6 0.
8
1.0 1.2 1.4 1.6 1.
8
2.0  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
V
– Drain-to-So
u
rce
V
oltage (
V
)  
V
– Gate-to-So
u
rce
V
oltage (
V
)  
DS  
GS  
Output Characteristics  
Transfer Characteristics  
0.040  
1500  
1200  
900  
600  
300  
0
C
iss  
V
= 4.5
V  
= 10
V  
0.036  
0.032  
0.02
8  
0.024  
GS  
V
GS  
C
oss  
C
rss  
0
5
10  
15  
20  
25  
0
10  
20  
30  
40  
50  
60  
I
– Drain C
u
rrent (A)  
V
– Drain-to-So
u
rce
V
oltage (
V
)  
D
DS  
Capacitance  
On-Resistance vs. Drain Current  
10  
8
2.0  
1.
8  
1.6  
1.4  
1.2  
1.0  
0.
8  
0.6  
I
= 4.6 A  
D
V
= 10
V
,  
= 4.6 A  
GS  
I
D
V
DS  
= 30
V  
6
V
DS  
= 4
8 V  
4
2
0
0
5
10  
15  
20  
25  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
Q
–
T
o
tal Gate Charge (nC)  
T –
 
J
u
nction
T
e
mperat
u
re (°C)  
g
J
Gate Charge  
On-Resistance vs. Junction Temperature  
服务热线:400-655-8788  
3

RSS065N06-TB  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
30  
0.0
8  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
I
D
= 4.6 A  
125 °C  
T
J
= 150 °C  
10  
T
J
= 25 °C  
25 °C  
4
1
0.0  
0.2  
0.4  
0.6  
0.
8  
1.0  
1.2  
0
2
6
8
10  
V
– So
u
rce-to-Drain
V
oltage (
V
)  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
SD  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
2.6  
2.4  
2.2  
2.0  
1.
8  
1.6  
1.4  
1.2  
1.0  
50  
40  
I
D
= 250
µ
A  
30  
20  
10  
0
-3  
-2  
-1  
10  
10  
10  
1
10  
100  
600  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
Time (s)  
T
–
T
e
mperat
u
re (°C)  
J
Single Pulse Power, Junction-to-Ambient  
Threshold Voltage  
100  
Limited
b
y R  
*
DS(on)  
10  
1
100
µ
s  
1 ms  
10 ms  
100 ms  
0.1  
T
= 25 °C  
A
1 s  
Single P
u
lse  
10 s  
DC  
B
V
DSS Limited  
0.01  
0.1  
1
10  
100  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
*
V
> minim
u
m
V
at
w
hich R
 
is specified  
GS  
GS  
DS(on)  
Safe Operating Area  
服务热线:400-655-8788  
4

RSS065N06-TB  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
12  
5
4
3
2
1
0
9
Package Limited  
6
3
0
0
25  
50  
75  
100  
125  
150  
25  
50  
75  
100  
125  
150  
T
C
– Case
T
e
mperat
u
re (°C)  
T
C
– Case
T
e
mperat
u
re (°C)  
Current Derating*  
Power, Junction-to-Foot  
* The power dissipation P

D

is based on T

J(max)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
服务热线:400-655-8788  
5

RSS065N06-TB  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
2
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
N
otes:  
P
DM  
0.1  
0.05  
t
1
t
2
t
t
1
0.02  
1. D
u
ty Cycle, D =  
2
2. Per Unit Base = R  
= 70
 
C/
W  
thJA  
(t)  
Single P
u
lse  
3. T
 
– T
 
= P  
Z
JM DM
 
thJA  
A
4. S
u
rface Mo
u
nted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
600  
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
服务热线:400-655-8788  
6

RSS065N06-TB  
S
OIC (NARROW): 8-LEAD  
JEDEC P
a
rt N
u
m
b
er: M
S
-012  
8
6
7
2
5
4
E
H
1
3
S
h x 45  
D
C
0.25 mm (G
a
ge Pl
a
ne)  
A
All Le
a
d
s  
0.101 mm  
0.004″  
q
e
B
A
1
L
MILLIMETERS  
Max  
INCHES  
DIM  
A
Min  
Min  
Max  
1.35  
0.10  
0.35  
0.19  
4.80  
3.80  
1.75  
0.20  
0.51  
0.25  
5.00  
4.00  
0.053  
0.004  
0.014  
0.0075  
0.189  
0.150  
0.069  
0.008  
0.020  
0.010  
0.196  
0.157  
A

1  

B
C
D
E
e
1.27 BSC  
0.050 BSC  
H
h
5.80  
0.25  
0.50  
0°  
6.20  
0.50  
0.93  
8°  
0.228  
0.010  
0.020  
0°  
0.244  
0.020  
0.037  
8°  
L
q
S
0.44  
0.64  
0.018  
0.026  
ECN: C-06527-Rev. I, 11-Sep-06  
DWG: 5498  
服务热线:400-655-8788  
7

RSS065N06-TB  
RECOMMENDED MINIMUM
P
A
DS FOR SO-8  
0.172  
(4.369)  
0.028  
(0.711)  
0.022  
0.050  
(0.559)  
(1.270)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
服务热线:400-655-8788  
8

RSS065N06-TB  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
product.(www.VBsemi.com)  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
injury or death, use or sale of products used in
T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
The information provided in this document and the company’s products without a license, express or implied,  
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product  
names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
RoHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as inconsistent.(www.VBsemi.com)  
Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.