VBsemi-Elec-SI4920DY-T1-E3-VB

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VBsemi-Elec-SI4920DY-T1-E3-VB
SI4920DY-T1-E3  
Dual N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
•
•
TrenchFET



Power MOSFET  
100 % R

g

Tested  
I

D

(A)

a  

8.5  
V

DS

(V)  
R

DS(on)

(
)  
Q

g

(Typ.)  
0.016 at V

GS

= 10 V  
0.020 at V

GS

= 4.5 V  
100 % UIS Tested  
30  
7.1  
•
Compliant to RoHS Directive 2002/95/EC  
7.6  
APPLICATIONS  
•
Notebook System Power  
•
Low Current DC/DC  
D
1
D
2
SO-8  
S
G
S
D
1
D
1
D
2
D
2
1
2
3
4
8
7
6
5
1
1
2
2
G
G
2
1
G
S
1
S
2
Top
V
ie
w  
N
-Channel MOSFET  
N
-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25 °C, unless otherwise noted)  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
V

DS  

V

GS  

Limit  
30  
Unit  
V
20  
T

C

= 25 °C  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
8.5  
7.5  
7.2

b, c  

5.9

b, c  

30  
Continuous Drain Current (T

J

= 150 °C)  
I

D  

Pulsed Drain Current  
I

DM  

I

S  

A
T

C

= 25 °C  
T

A

= 25 °C  
2.8  
1.8

b, c  

30  
Source-Drain Current Diode Current  
Pulsed Source-Drain Current  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
I

SM  

I

AS  

10  
5
L = 0.1 mH  
E

AS  

T

C

= 25 °C  
T

C

= 70 °C  
3.1  
2.0  
2.0

b, c  

1.25

b, c  

P

D  

Maximum Power Dissipation  
W
T

A

= 25 °C  
T

A

= 70 °C  
Operating Junction and Storage
T
e
mperature Range  
T

J

, T

stg  

°C  
– 55 to 150  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambient

b, d  

Maximum Junction-to-Foot (Drain)  
Symbol  
R

thJA  

R

thJF  

Typ.  
52  
Max.  
62.5  
40  
Unit  
°C/W  
t
10 s  
Steady-State  
30  
Notes:  
a. Based on T

C

= 25 °C.  
b. Surface mounted on 1″ x 1″ FR4 board.  
c. t = 10 s.  
d. Maximum under steady state conditions is 110 °C/W.  
服务热线:400-655-8788  
1

SI4920DY-T1-E3  
SPECIFICATIONS
(T =
 
25 °C, unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

V

DS

/T

J  

V

GS(th)

/T

J  

V

GS(th)  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
30  
V
V
V

DS

T
e
mperature Coefficient  

GS(th)

T
e
mperature Coefficient  
3.0  
mV/°C  
I

D

= 250
 
µA  
– 5.2  
V

DS

= V

GS

, I

D

= 250 µA  
Gate Threshold Voltage  
Gate-Body Leakage  
1.2  
20  
2.5  
100  
1
V
I

GSS  

V

DS

= 0
V
,
V

GS  

=
20 V  
nA  
V

DS

= 30
V
,
V

GS

= 0 V  

DS

= 30
V
,
V

GS

= 0
V
,
T
J = 55 °C  
V

DS

= 5
V
,
V

GS

= 10 V  
I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

Zero Gate Voltage Drain Current  
On -State Drain Current

b  

µA  
A
V
10  
V

GS

= 10
V
,
I

D

= 8 A  
0.016  
0.020  
27  
Drain-Source On-State Resistance

b  

Forward
T
r
ansconductance

b  

S
V

GS

= 4.5
V
,
I

D

= 5 A  
V

DS

= 15
V
,
I

D

= 8 A  
Dynamic

a  

C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
660  
140  
86  
V

DS

= 15
V
,
V

GS

= 0
V
,
I

D

= 1 MHz  
pF  
V

DS

= 15
V
,
V

GS

= 10
V
,
I

D

= 8 A  
14.5  
7.1  
1.9  
2.7  
2.6  
14  
22  
11  
Q

g  

T
o
tal Gate Charge  
nC  
Q

gs  

Q

gd  

R

g  

Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
V

DS

= 15
V
,
V

GS

= 4.5
V
,
I

D

= 8 A  
f = 1 MHz  
0.5  
5.2  
28  
80  
35  
24  
14  
20  
30  
14  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-On Delay Time  
Rise Time  
45  
V

DD

= 15
V
,
R

L

= 3
  
I

D

5 A, V

GEN

= 4.5
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
Fall Time  
18  
12  
ns  
T
u
rn-On Delay Time  
Rise Time  
7
10  
V

DD

= 15
V
,
R

L

= 3
  
I

D

5 A, V

GEN

= 10
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
Fall Time  
15  
7
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
I

S

= 2 A  
2.8  
30  
A
Pulse Diode Forward Current

a  

Body Diode Voltage  
0.77  
17  
9
1.1  
34  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Q

rr  

t

a  

18  
I

F

= 5 A, dI/dt = 100 A/µs, T

J

= 25 °C  
10  
7
nS  
t

b  

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

SI4920DY-T1-E3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
10  
8
40  
V
GS  
= 10
V
thr
u
4
V  
32  
24  
16  
8
6
V
GS  
= 3
V  
4
T
C
= 25 °C  
2
T
C
= 125 °C  
1
T
C
= – 55 °C  
0
0
0
2
3
4
5
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
Transfer Characteristics  
Output Characteristics  
1000  
8
00  
600  
400  
200  
0
0.030  
0.026  
0.022  
0.01
8  
0.014  
0.010  
C
iss  
V
= 4.5
V  
GS  
C
oss  
V
= 10
V  
GS  
C
rss  
0
6
12  
1
8  
24  
30  
0
10  
20  
30  
40  
50  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
I
– Drain C
u
rrent (A)  
D
Capacitance  
On-Resistance vs. Drain Current and Gate Voltage  
1.
8  
1.6  
1.4  
1.2  
1.0  
0.
8  
0.6  
10  
I
=
8
A  
D
I
=
8
A  
D
8
V
= 10
V  
GS  
V
DS  
= 10
V  
6
V
= 20
V  
DS  
V
GS  
= 4.5
V  
V
= 15
V  
DS  
4
2
0
0.0  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
3.2  
6.4  
9.6  
12.
8  
16  
T
J
– J
u
nction
T
e
mperat
u
re (°C)  
Q
g
–
T
o
tal Gate Charge (nC)  
On-Resistance vs. Junction Temperature  
Gate Charge  
服务热线:400-655-8788  
3

SI4920DY-T1-E3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
0.10  
100  
10  
1
I
=
8
A  
D
T
J
= 150 °C  
0.0
8  
0.06  
0.04  
0.02  
0.00  
T
J
= 25 °C  
0.1  
0.01  
T
J
= 125 °C  
T
= 25 °C  
9
J
0.001  
0.0  
0.2  
0.4  
0.6  
0.
8  
1.0  
1.2  
0
1
2
3
4
5
6
7
8
10  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
V
SD  
– So
u
rce-to-Drain
V
oltage (
V
)  
On-Resistance vs. Gate-to-Source Voltage  
Source-Drain Diode Forward Voltage  
0.5  
0.2  
50  
40  
30  
20  
10  
0
– 0.1  
– 0.4  
– 0.7  
– 1.0  
I
= 5 mA  
D
I
= 250
µ
A  
D
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
Time (s)  
T
J
–
T
e
mperat
u
re (°C)  
Single Pulse Power, Junction-to-Ambient  
Threshold Voltage  
100  
Limited
b
y R  
*
DS(on)  
10  
1
1 ms  
10 ms  
100 ms  
0.1  
1 s  
10 s  
DC  
T
= 25 °C  
A
Single P
u
lse  
B
V
DSS Limited  
0.01  
0.01  
0.1  
1
10  
100  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
*
V
> minim
u
m
V
at
w
hich R
 
is specified  
DS(on)  
GS  
GS  
Safe Operating Area, Junction-to-Ambient  
服务热线:400-655-8788  
4

SI4920DY-T1-E3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
10  
8
6
4
2
0
0
25  
50  
75  
100  
125  
150  
T
C
– Case
T
e
mperat
u
re (°C)  
Current Derating*  
4.0  
3.2  
2.4  
1.6  
0.
8  
0.0  
1.5  
1.2  
0.9  
0.6  
0.3  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
T –
 
Am
b
ient
T
e
mperat
u
re (°C)  
A
75  
100  
125  
150  
T
C
– Case
T
e
mperat
u
re (°C)  
Power Derating, Junction-to-Ambient  
Power Derating, Junction-to-Foot  
* The power dissipation P

D

is based on T

J(max)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
服务热线:400-655-8788  
5

SI4920DY-T1-E3  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
N
otes:  
P
DM  
0.05  
t
1
t
2
t
t
1
2
0.02  
1. D
u
ty Cycle, D =  
2. Per Unit Base = R  
= 110 °C/
W  
thJA  
(t)  
3. T
 
– T
 
= P  
Z
JM  
A
DM thJA  
Single P
u
lse  
4. S
u
rface Mo
u
nted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
100  
1000  
10  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
服务热线:400-655-8788  
6

SI4920DY-T1-E3  
S
OIC (NARROW): 8-LEAD  
JEDEC P
a
rt N
u
m
b
er: M
S
-012  
8
6
7
2
5
4
E
H
1
3
S
h x 45  
D
C
0.25 mm (G
a
ge Pl
a
ne)  
A
All Le
a
d
s  
0.101 mm  
0.004″  
q
e
B
A
1
L
MILLIMETERS  
Max  
INCHES  
DIM  
A
Min  
Min  
Max  
1.35  
0.10  
0.35  
0.19  
4.80  
3.80  
1.75  
0.20  
0.51  
0.25  
5.00  
4.00  
0.053  
0.004  
0.014  
0.0075  
0.189  
0.150  
0.069  
0.008  
0.020  
0.010  
0.196  
0.157  
A

1  

B
C
D
E
e
1.27 BSC  
0.050 BSC  
H
h
5.80  
0.25  
0.50  
0°  
6.20  
0.50  
0.93  
8°  
0.228  
0.010  
0.020  
0°  
0.244  
0.020  
0.037  
8°  
L
q
S
0.44  
0.64  
0.018  
0.026  
ECN: C-06527-Rev. I, 11-Sep-06  
DWG: 5498  
服务热线:400-655-8788  
7

SI4920DY-T1-E3  
RECOMMENDED MINIMUM
P
A
DS FOR SO-8  
0.172  
(4.369)  
0.028  
(0.711)  
0.022  
0.050  
(0.559)  
(1.270)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
服务热线:400-655-8788  
8

SI4920DY-T1-E3  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
product.(www.VBsemi.com)  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
injury or death, use or sale of products used in
T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
The information provided in this document and the company’s products without a license, express or implied,  
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product  
names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
oHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as inconsistent.(www.VBsemi.com)  
Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.