VBsemi-Elec-VBM1158N

Part #VBsemi-Elec-VBM1158N
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VBsemi-Elec-VBM1158N
VBM1158N  
N-Channel 150 V (D-S)
 
MOSFET  
FEATURES  
• TrenchFET

®

power MOSFET  
PRODUCT SUMMARY  
V

DS

(V)  
150  
0.075  
20  
• Package with low thermal resistance  
• 100 % R

g

and UIS tested  
R

DS(on)

(
Ω
) at V

GS

= 10 V  
I

D

(A)  
Configuration  
Package  
Single  
TO-220  
TO-220AB  
D
G
S
N-Channel MOSFET  
S
D
G
Top View  
ABSOLUTE MAXIMUM RATINGS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
V

DS  

150  
V
V

GS  

20  
T

C

= 25 °C  
20  
Continuous Drain Current  
I

D  

T

C

= 125 °C  
14  
Continuous Source Current (Diode Conduction)

a  

Pulsed Drain Current

b  

I

S  

50  
A
I

DM  

I

AS  

E

AS  

60  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Current  
30  
45  
L = 0.1 mH  
mJ  
W
T

C

= 25 °C  
107  
Maximum Power Dissipation

b  

P

D  

T

C

= 125 °C  
35  
Operating Junction and Storage Temperature Range  
T

J

, T

stg  

-55 to +175  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
R

thJA  

LIMIT  
50  
UNIT  
Junction-to-Ambient  
PCB Mount

c  

°C/W  
Junction-to-Case (Drain)  
R

thJC  

1.4  
Notes  
a. Package
 
limited.  
b. Pulse
 
test; pulse width
≤
300 μs, duty cycle
≤
2 %.  
c. When
 
mounted on 1″ square PCB (FR4 material).  
d. Parametric
 
verification ongoing.  
服务热线:400-655-8788  
1

VBM1158N  
SPECIFICATIONS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= 250 μA  
V

DS

= V

GS

, I

D

= 250 μA  
150  
–
–
V
1.5  
–
–
3.5  
V

DS

= 0 V, V

GS  

V

GS

= 0 V
 
V

DS

= 150 V  

GS

= 0 V  
=
20 V  
–
100  
1
nA  
μA  
A
–
–
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

V
V

DS

= 150 V, T

J

= 125 °C  
V

DS

= 150 V, T

J

= 175 °C  
V

DS

≥
5 V  
–
–
–
50  
250  
–
V

GS

= 0 V  
–
V

GS

= 10 V  
30  
–
–
V

GS

= 10 V  
I

D

= 12 A  
0.075  
0.116  
0.158  
33  
–
–
–
Drain-Source On-State Resistance

a  

V

GS

= 10 V  
V

GS

= 10 V  
I

D

= 12 A, T

J

= 125 °C  
I

D

= 12 A, T

J

= 175 °C  
–
Ω
–
Forward Transconductance

b  

Dynamic

b  

V

DS

= 12 V, I

D

= 15 A  
–
–
S
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
Turn-On Delay Time

c  

Rise Time

c  

Turn-Off Delay Time

c  

Fall Time

c  

C

iss  

C

oss  

C

rss  

Q

g  

–
–
–
1090  
165  
82  
1660  
200  
V

GS

= 0 V  
V

DS

= 25 V, f = 1 MHz  
pF  
120  
–
–
27  
7.5  
50  
–
Q

gs  

Q

gd  

R

g  

V

GS

= 10 V  
V

DS

= 75 V, I

D

= 20 A  
f = 1 MHz  
nC  
–
10.2  
1.0  
11  
–
0.35  
3.2  
17  
33  
30  
20  
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
21  
V

DD

= 75 V, R

L

= 3
Ω  
ns  
I

D

≅
20A, V

GEN

= 10 V, R

g

= 1
Ω  
20  
12  
Source-Drain Diode Ratings and Characteristics

b  

Pulsed Current

a  

I

SM  

–
–
–
65  
A
V
Forward Voltage  
V

SD  

I

F

= 20 A, V

GS

= 0 V  
0.85  
1.5  
Notes  
a. Pulse
 
test; pulse width
≤
300 μs, duty cycle
≤
2 %.  
b. Guaranteed
 
by design, not subject to production testing.  
c. Independent
 
of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

VBM1158N  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
V

GS

= 10 V thru 5V  
V

GS

= 4V  
T

C

= 25
°
C  
V

GS

= 3  
T

C

= – 55
°
C  
T

C

= 125
°
C  
0
2
4
6
8
10  
0
2
4
6
8
10  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Output Characteristics  
Transfer Characteristics  
10  
8
60  
48  
36  
24  
12  
0
T

C

= – 55
°
C  
T

C

= 25
°
C  
6
T

C

= 125
°
C  
T

C

= 25
°
C  
4
2
T

C

= – 55
°
C  
T

C

= 125
°
C  
0
0
5
10  
15  
20  
25  
0
2
4
6
8
10  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
I

D

– Drain Current (A)  
Transfer Characteristics  
Transconductance  
0.15  
0.12  
0.09  
0.06  
0.03  
0.00  
3000  
2500  
2000  
1500  
1000  
500  
V
= 10 V  
C

i
ss  

C

o
ss  

C

r
ss  

0
0
10  
20  
30  
40  
50  
0
15  
30  
45  
60  
75  
I

D

– Drain Current (A)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
On-Resistance vs. Drain Current  
Capacitance  
服务热线:400-655-8788  
3

VBM1158N  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
10  
8
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
I

D

= 12 A  
I

D

= 20A  

D
S

= 75 V  
V
6
V

GS

= 10 V  
4
2
0
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
0
8
16  
24  
32  
40  
Q

g

– Total
G
ate Charge (nC)  
T

J

– Junction Temperature (
°
C)  
Gate Charge  
On-Resistance vs. Junction Temperature  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
100  
10  
T

J

= 150
°
C  
1
T

J

= 150
°
C  
0.1  
T

J

= 25
°
C  
0.01  
0.001  
T

J

= 25
°
C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
2
4
6
8
10  
V

S
D

–
S
ource-to-Drain Voltage (V)  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
Source Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
1.0  
0.4  
200  
190  
180  
170  
160  
150  
I

D

= 10 mA  
– 0.2  
– 0.8  
– 1.4  
– 2.0  
I

D

= 5 mA  
I

D

= 250 μA  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
T
J
– Junction
T
e
mperature (°C)  
T

J

– Temperature (
°
C)  
Threshold Voltage  
Drain Source Breakdown vs. Junction Temperature  
服务热线:400-655-8788  
4

VBM1158N  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
1000  
I

DM

Limited  
100  
100 μ
s  
1 m
s  
Limited by R

D
S
(on)  

*
10  
1
10 m
s  
100 m
s
, 1
s
, 10
s
, DC  
BVD
SS
Limited  
0.1  
0.01  
T

C

= 25
°
C  
S
ingle Pul
s
e  
0.01  
0.1  
1
10  
100  
1000  
V

D
S

– Drain-to-
S
ource Voltage (V)  
* V

GS

> minimum V

GS

at which R

D
S
(on)

i
s s
pecified  
Safe Operating Area  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
1000  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
服务热线:400-655-8788  
5

VBM1158N  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
2
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
S
qu
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
10  
1
Note  
•
The characteristics shown in the two graphs  
– Normalized Transient Thermal Impedance Junction to Ambient (25 °C)  
– Normalized Transient Thermal Impedance Junction to Case (25 °C)  
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single  
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part  
mounted on printed circuit board – FR4, size 1″ x 1″ x 0.062″, double sided with 2 oz. copper, 100 % on both sides. The part capabilities  
can widely vary depending on actual application parameters and operating conditions.  
服务热线:400-655-8788  
6

TO-220AB  
MILLIMETERS  
MIN.  
INCHES  
A
E
DIM.  
MAX.  
4.65  
1.01  
1.73  
0.61  
15.49  
12.70  
10.51  
2.67  
5.28  
1.40  
6.48  
2.92  
14.02  
3.82  
3.94  
3.00  
MIN.  
MAX.  
0.183  
0.040  
0.068  
0.024  
0.610  
0.500  
0.414  
0.105  
0.208  
0.055  
0.255  
0.115  
0.552  
0.150  
0.155  
0.118  
F
A
b
4.25  
0.69  
1.20  
0.36  
14.85  
12.19  
10.04  
2.41  
4.88  
1.14  
6.09  
2.41  
13.35  
3.32  
3.54  
2.60  
0.167  
0.027  
0.047  
0.014  
0.585  
0.480  
0.395  
0.095  
0.192  
0.045  
0.240  
0.095  
0.526  
0.131  
0.139  
0.102  
Ø P  
b(1)  
c
D
D2  
E
e
e(1)  
F
1
3
2
H(1)  
J(1)  
L
*
M
L(1)  
Ø P  
Q
b(1)  
ECN: T14-0413-Rev. P, 16-Jun-14  
DWG: 5471  
Note  
* M = 1.32 mm to 1.62 mm (dimension including protrusion)  
Heatsink hole for HVM  
C
b
e
J(1)  
e(1)  
D2  
服务热线:400-655-8788  
7

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data are subject to change without notice.  
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representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
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any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
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including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
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Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
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product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
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aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
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aiwan VBsemi products are not intended for use in medical, life saving,  
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aiwan VBsemi such applications using client did not express their  
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aiwan VBsemi people who are related to product design applications and  
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2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
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