VBsemi-Elec-VBZE40P10

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VBsemi-Elec-VBZE40P10
VBZE40P10  
P-Channel 100 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
V

DS

(V)  
•
Halogen-free According to IEC 61249-2-21  
Definition  
• TrenchFET

®

Power MOSFET  
• Package with Low Thermal Resistance  
• 100 % R

g

and UIS Tested  
– 100  
0.033  
0.036  
– 40  
R

DS(on)

(
) at V

GS

= – 10 V  

DS(on)

(
) at V

GS

= – 4.5 V  
R
I

D

(A)  
Configuration  
Single  
• Compliant to RoHS Directive 2002/95/EC  
S
TO-252  
G
Drain Connected to
T
a
b  
D
G
D
S
P-Channel MOSFET  
Top View  
ABSOLUTE MAXIMUM RATINGS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
– 100  
20  
UNIT  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

T

C

= 25 °C  
– 40  
– 22  
– 50  
I

D  

Continuous Drain Current  
T

C

= 125 °C  
Continuous Source Current (Diode Conduction)

a  

Pulsed Drain Current

b  

I

S  

A
I

DM  

I

AS  

– 150  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
– 44  
L = 0.1 mH  
E

AS  

96  
136  
mJ  
W
T

C

= 25 °C  
Maximum Power Dissipation

b  

P

D  

T

C

= 125 °C  
45  
T

J

, T

stg  

Operating Junction and Storage Temperature Range  
– 55 to + 175  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
R

thJA  

LIMIT  
50  
UNIT  
PCB Mount

c  

Junction-to-Ambient  
°C/W  
R

thJC  

Junction-to-Case (Drain)  
1.1  
Notes  
a. Package
 
limited.  
b. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
c. When
 
mounted on 1″ square PCB (FR-4 material).  
d. Parametric
 
verification ongoing.  
服务热线:400-655-8788  
1

VBZE40P10  
SPECIFICATIONS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= – 250 μA  
V

DS

= V

GS

, I

D

= – 250 μA  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
– 100  
–
–
V
– 1.0  
–
-2.5  
V

DS

= 0 V, V

GS  

=
20 V  
–
–
100  
nA  
μA  
A
V

GS

= 0 V  

GS

= 0 V  
V

DS

= – 100 V  
V

DS

= – 100 V, T

J

= 125 °C  
V

DS

= – 100 V, T

J

= 175 °C  
V

DS


– 5 V  
–
–
–
– 1  
I

DSS  

V
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

–
– 50  
V

GS

= 0 V  
V

GS

= – 10 V  
V

GS

= – 10 V  
–
–
– 250  
I

D(on)  

– 30  
–
–
–
–
–
–
–
I

D

= – 9.2 A  
–
–
–
–
–
0.033  
0.065  
0.081  
0.037  
35  
V

GS

= – 10 V  

GS

= – 10 V  
I

D

= – 9.2 A, T

J

= 125 °C  
I

D

= – 9.2 A, T

J

= 175 °C  
I

D

= – 7.7 A  
Drain-Source On-State Resistance

a  

R

DS(on)  

V
V

GS

= – 4.5 V  
Forward Transconductance

b  

Dynamic

b  

g

fs  

V

DS

= – 15 V, I

D

= – 9.2 A  
S
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
Total Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
–
–
4433  
301  
208  
96  
–
–
V

GS

= 0 V  
V

DS

= – 25 V, f = 1 MHz  
pF  
–
–
–
144  
–
Q

gs  

Q

gd  

R

g  

V

GS

= – 10 V  
V

DS

= – 50V, I

D

= – 9.2 A  
f = 1 MHz  
–
8.4  
23.5  
3.13  
11  
nC  
–
–
1.5  
–
4.7  
17  
17  
117  
23  
Turn-On Delay Time

c  

Rise Time

c  

Turn-Off Delay Time

c  

Fall Time

c  

t

d(on)  

t

r  

t

d(off)  

t

f  

–
11  
V

DD

= – 50 V, R

L

= 6.49
  
ns  
I

D

– 7.7 A, V

GEN

= – 10 V, R

g

= 1.0
  
–
78  
–
15  
Source-Drain Diode Ratings and Characteristics

b  

Pulsed Current

a  

I

SM  

–
–
–
– 150  
– 1.5  
A
V
V

SD  

I

F

= – 7.7 A, V

GS

= 0 V  
Forward Voltage  
– 0.8  
Notes  
a. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
b. Guaranteed
 
by design, not subject to production testing.  
c. Independent
 
of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

VBZE40P10  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
40  
32  
24  
16  
8
40  
32  
24  
16  
8
V

GS

= 10 V thru 4 V  
T

C

= 25
°
C  
V

GS

= 3 V  
T

C

= 125
°
C  
T

C

= – 55
°
C  
0
0
0
2
4
6
7
8
0
2
4
6
8
10  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Output Characteristics  
Transfer Characteristics  
10  
8
100  
80  
60  
40  
20  
0
T

C

= – 55
°
C  
T

C

= 25
°
C  
6
T

C

= 25
°
C  
T

C

= 125
°
C  
4
2
T

C

= 125
°
C  
T

C

= – 55
°
C  
0
0
10  
20  
30  
40  
50  
0
2
4
6
8
10  
I

D

– Drain Current (A)  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
Transfer Characteristics  
Transconductance  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
C

i
ss  

V

GS

= 4.5 V  
V

GS

= 10 V  
C

r
ss  

C

o
ss  

0
8
16  
24  
32  
40  
0
20  
40  
60  
80  
100  
V

D
S

– Drain-to-
S
ource Voltage (V)  
I

D

– Drain Current (A)  
On-Resistance vs. Drain Current  
Capacitance  
服务热线:400-655-8788  
3

VBZE40P10  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
2.5  
2.0  
1.5  
1.0  
0.5  
10  
8
I

D

= 9.2 A  
I

D

= 9.2 A  
V

D
S

= 50 V  
V

GS

= 10 V  
6
V

GS

= 4.5 V  
4
2
0
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
0
10 20 30 40 50 60 70 80 90
 
100  
T

J

– Junction Temperature (
°
C)  
Q

g

– Total
G
ate Charge (nC)  
Gate Charge  
On-Resistance vs. Junction Temperature  
100  
10  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
T

J

= 150
°
C  
1
0.1  
T

J

= 25
°
C  
T

J

= 150
°
C  
0.01  
0.001  
T

J

= 25
°
C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
2
4
6
8
10  
V

S
D

–
S
ource-to-Drain Voltage (V)  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
Source Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
1.1  
105  
110  
115  
120  
125  
130  
135  
–
–
–
–
–
–
–
I

D

= 10 mA  
0.8  
0.5  
I

D

= 250 μA  
I

D

= 5 mA  
0.2  
– 0.1  
– 0.4  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
T

J

– Junction Temperature (
°
C)  
T

J

– Temperature (
°
C)  
Threshold Voltage  
Drain Source Breakdown vs. Junction Temperature  
服务热线:400-655-8788  
4

VBZE40P10  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
1000  
I

DM

Limited  
100  
10  
100 μ
s  
1 m
s  
10 m
s  
100 m
s  
1
s
,10
s
, DC  
1
Limited by R

D
S
(on)  

*
T

C

= 25
°
C  
S
ingle Pul
s
e  
0.1  
BVD
SS
Limited  
0.01  
0.01  
0.1  
1
10  
100  
V

D
S

– Drain-to-
S
ource Voltage (V)  
* V

GS

> minimum V

GS

at which R

D
S
(on)

i
s s
pecified  
Safe Operating Area  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
Square
W
ave Pulse D
u
r
ation (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
服务热线:400-655-8788  
5

VBZE40P10  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
1
D
u
ty Cycle = 0.5  
0.2  
N
otes:  
0.1  
0.1  
P
DM  
0.05  
t
1
t
2
t
t
1
2
1. D
u
ty Cycle, D =  
2. Per Unit Base = R  
= 50 °C/
W  
thJA  
(t)  
3. T
 
– T  
= P  
Z
JM  
A
DM thJA  
0.02  
Single P
u
lse  
4. S
u
rface Mo
u
nted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
100  
1000  
10  
S
qu
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
Note  
•
The characteristics shown in the two graphs  
– Normalized Transient Thermal Impedance Junction to Ambient (25 °C)  
– Normalized Transient Thermal Impedance Junction to Case (25 °C)  
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single  
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part  
mounted on printed circuit board – FR4, size 1″ x 1″ x 0.062″, double sided with 2 oz. copper, 100 % on both sides. The part capabilities  
can widely vary depending on actual application parameters and operating conditions.  
服务热线:400-655-8788  
6

VBZE40P10  
TO-252AA Case Outline  
E
A
MILLIMETERS  
INCHES  
C2  
b3  
DIM.  
A
MIN.  
MAX.  
2.38  
0.127  
0.88  
1.14  
5.46  
0.61  
0.89  
6.22  
–
MIN.  
MAX.  
0.094  
0.005  
0.035  
0.045  
0.215  
0.024  
0.035  
0.245  
–
2.18  
–
0.086  
–
A1  
b
0.64  
0.76  
4.95  
0.46  
0.46  
5.97  
4.10  
6.35  
4.32  
9.40  
0.025  
0.030  
0.195  
0.018  
0.018  
0.235  
0.161  
0.250  
0.170  
0.370  
b2  
b3  
C
C2  
D
D1  
E
6.73  
–
0.265  
–
E1  
H
b
C
b2  
e
10.41  
0.410  
A1  
e1  
e
2.28 BSC  
4.56 BSC  
1.40  
0.090 BSC  
0.180 BSC  
e1  
L
1.78  
1.27  
1.02  
1.52  
0.055  
0.070  
0.050  
0.040  
0.060  
L3  
L4  
L5  
0.89  
–
0.035  
–
1.01  
0.040  
ECN: T13-0592-Rev. A, 02-Sep-13
 
DWG: 6019  
E1  
Note  
Dimension L3 is for reference only.  
•
服务热线:400-655-8788  
7

VBZE40P10  
RECOMMENDED MINIMUM
P
A
DS FOR D
P
A
K (TO-252)  
0.224  
(5.690)  
0.180  
0.055  
(4.572)  
(1.397)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
服务热线:400-655-8788  
8

VBZE40P10  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
product.(www.VBsemi.com)  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
injury or death, use or sale of products used in
T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
The information provided in this document and the company’s products without a license, express or implied,  
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product  
names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
oHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as inconsistent.(www.VBsemi.com)  
Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.