Vishay-Intertech-IRFRC20TRRPBF
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IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
V
DS
(V)
DS(on)
(
)
Q
g
(Max.) (nC)
600
• Repetitive Avalanche Rated
4.4
R
V
GS
= 10 V
• Surface Mount (IRFRC20, SiHFRC20)
18
3.0
• Straight Lead (IRFUC20, SiHFUC20)
• Available in Tape and Reel
• Fast Switching
Q
gs
(nC)
gd
(nC)
Q
8.9
Configuration
Single
• Ease of Paralleling
D
• Material
categorization: For definitions of compliance
D
P
A
K
I
P
A
K
(TO-252)
(TO-251)
DESCRIPTION
D
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFUC, SiHFUC series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
D
G
S
G
S
D
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
SiHFUC20-GE3
Lead (Pb)-free and
Halogen-free
SiHFRC20-GE3
SiHFRC20TRL-GE3
SiHFRC20TR-GE3
SiHFRC20TRR-GE3
IRFRC20PbF
SiHFRC20-E3
IRFRC20TRLPbF
a
SiHFRC20TL-E3
a
IRFRC20TRPbF
a
SiHFRC20T-E3
a
IRFRC20TRRPbF
a
SiHFRC20TR-E3
a
IRFUC20PbF
SiHFUC20-E3
Lead (Pb)-free
Note
a. See
device orientation.
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
600
UNIT
Drain-Source Voltage
Gate-Source Voltage
V
DS
V
V
GS
20
T
C
= 25 °C
2.0
Continuous Drain Current
V
GS
at 10 V
I
D
T
C
= 100 °C
1.3
A
Pulsed Drain Current
a
I
DM
8.0
Linear Derating Factor
0.33
0.020
74
W/°C
Linear Derating Factor (PCB Mount)
e
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
E
AS
I
AR
mJ
A
2.0
Repetitive Avalanche Energy
a
E
AR
4.2
mJ
Maximum Power Dissipation
T
C
= 25 °C
42
P
D
W
V/ns
°C
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery dV/dt
c
T
A
= 25 °C
2.5
dV/dt
3.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d
T
J
, T
stg
– 55 to + 150
260
for 10 s
Notes
a. Repetitive
rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 37 mH, R
g
= 25
, I
AS
= 2.0 A (see fig. 12).
c. I
SD
2.0 A, dI/dt
40 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6
mm from case.
e. When
mounted on 1″ square PCB (FR-4 or G-10 material).
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Maximum Junction-to-Ambient
R
thJA
R
thJA
R
thJC
–
–
110
Maximum Junction-to-Ambient
(PCB Mount)
a
–
–
–
–
50
°C/W
Maximum Junction-to-Case (Drain)
3.0
Note
a. When
mounted on 1″ square PCB (FR-4 or G-10 material).
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX. UNIT
Static
Drain-Source Breakdown Voltage
V
DS
V
DS
/T
J
V
GS(th)
I
GSS
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
600
–
–
V
V/°C
V
V
DS
Temperature Coefficient
–
2.0
–
0.88
–
Gate-Source Threshold Voltage
Gate-Source Leakage
–
–
–
–
–
–
4.0
100
100
500
4.4
–
V
GS
=
20 V
nA
V
DS
= 600 V, V
GS
= 0 V
–
Zero Gate Voltage Drain Current
I
DSS
μA
V
DS
= 480 V, V
GS
= 0 V, T
J
= 125 °C
–
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
R
DS(on)
g
fs
V
GS
= 10 V
I
D
= 1.2 A
b
–
V
DS
= 50 V, I
D
= 1.2 A
1.4
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
C
iss
C
oss
C
rss
Q
g
–
–
–
–
–
–
–
–
–
–
350
48
8.6
–
–
–
V
GS
= 0 V,
V
DS
= – 25 V,
pF
nC
f = 1.0 MHz, see fig. 5
–
18
3.0
8.9
–
I
D
= 2.0 A, V
DS
= 360 V,
see fig. 6 and 13
b
Q
gs
Q
gd
t
d(on)
t
r
V
GS
= 10 V
–
–
10
23
30
25
–
V
DD
= 300 V, I
D
= 2.0 A,
ns
R
g
= 18
, R
D
= 135
, see fig. 10
b
Turn-Off Delay Time
Fall Time
t
d(off)
t
f
–
–
D
Between lead,
Internal Drain Inductance
L
D
L
S
–
–
4.5
7.5
–
–
6 mm (0.25″) from
package and center of
die contact
nH
G
Internal Source Inductance
S
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
D
MOSFET symbol
showing the
integral reverse
p – n junction diode
I
S
–
–
–
–
2.0
8.0
A
G
Pulsed Diode Forward Current
a
I
SM
S
Body Diode Voltage
V
SD
t
rr
T
J
= 25 °C, I
S
= 2.0 A, V
GS
= 0 V
b
T
J
= 25 °C, I
F
= 2.0 A, dI/dt = 100 A/μs
b
–
–
–
–
1.6
580
1.3
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
290
0.67
ns
μC
Q
rr
t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
Notes
a. Repetitive
rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse
width
300 μs; duty cycle
2 %.
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Fig. 1 – Typical Output Characteristics, T
C
= 25 °C
Fig. 3 – Typical Transfer Characteristics
Fig. 2 – Typical Output Characteristics, T
C
= 150 °C
Fig. 4 – Normalized On-Resistance vs. Temperature
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
3
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
Fig. 7 – Typical Source-Drain Diode Forward Voltage
Fig. 5 – Typical Capacitance vs. Drain-to-Source Voltage
Fig. 8 – Maximum Safe Operating Area
Fig. 6 – Typical Gate Charge vs. Gate-to-Source Voltage
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
4
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
R
D
V
DS
V
GS
D.U.T.
R
g
+
V
–
DD
10 V
Pulse width
≤
1 µs
Duty factor
≤
0.1 %
Fig. 10a – Switching Time Test Circuit
V
DS
90 %
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig. 9 – Maximum Drain Current vs. Case Temperature
Fig. 10b – Switching Time Waveforms
Fig. 11 – Maximum Effective Transient Thermal Impedance, Junction-to-Case
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
L
V
DS
V
DS
Vary t
p
to obtain
required I
AS
t
p
V
DD
D.U.T
I
AS
R
g
+
V
DD
–
V
DS
10 V
0.01
Ω
t
p
I
AS
Fig. 12b – Unclamped Inductive Waveforms
Fig. 12a – Unclamped Inductive Test Circuit
Fig. 12c – Maximum Avalanche Energy vs. Drain Current
Current regulator
Same type as D.U.T.
50 k
Ω
Q
G
V
GS
12 V
0.2 µF
0.3 µF
Q
GS
Q
GD
+
–
V
DS
D.U.T.
V
G
V
GS
3 mA
Charge
I
G
I
D
Current sampling resistors
Fig. 13a – Basic Gate Charge Waveform
Fig. 13b – Gate Charge Test Circuit
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
6
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
Peak Dio
d
e Recovery
d
V/
d
t Test Circuit
+
–
Circuit layout con
s
ideration
s
•
Low
s
tray inductance
•
G
round plane
•
Low leakage inductance
current tran
s
former
D.U.T.
+
–
–
+
R
g
•
dV/dt controlled by R
g
•
Driver
s
ame type a
s
D.U.T.
•
I
S
D
controlled by duty factor “D”
•
D.U.T. – device under te
s
t
+
–
V
DD
Driver gate drive
P.W.
P.W.
D =
Period
Period
V
GS
= 10 V
a
D.U.T. l
S
D
waveform
D.U.T. V
D
S
waveform
Rever
s
e
recovery
current
Body diode forward
current
dI/dt
Diode recovery
dV/dt
V
DD
Re-applied
voltage
Body diode forward drop
Inductor current
I
S
D
Ripple
≤
5 %
Note
a. V
GS
= 5 V for logic level device
s
Fig. 14 – For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
S13-0166-Rev. E, 04-Feb-13
Document Number: 91285
7
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Package Information
Vishay Siliconix
TO-252AA Case Outline
VERSION 1: FACILITY CODE = Y
E
A
C2
b3
E1
b
C
b2
e
A1
e1
MILLIMETERS
DIM.
A
MIN.
2.18
–
MAX.
2.38
0.127
0.88
1.14
5.46
0.61
0.89
6.22
–
A1
b
0.64
0.76
4.95
0.46
0.46
5.97
4.10
6.35
4.32
9.40
b2
b3
C
C2
D
D1
E
6.73
–
E1
H
10.41
e
2.28 BSC
4.56 BSC
e1
L
1.40
0.89
–
1.78
1.27
1.02
1.52
L3
L4
L5
1.01
Note
Dimension L3 is for reference only
•
Revision: 16-Dec-2019
Document Number: 71197
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Package Information
Vishay Siliconix
VERSION 2: FACILITY CODE = N
e
E
A
b3
E1
c2
E1/2
e
2x b2
2x e
3x b
DETAIL “B”
(b)
0.25
C A B
C
H
b1
SEATING
PLANE
GAUGE
PLANE
DETAIL “B”
C
L
C
(L1)
MILLIMETERS
MILLIMETERS
DIM.
L
MIN.
MAX.
DIM.
A
MIN.
2.18
–
MAX.
2.39
0.13
0.89
0.79
1.13
5.46
0.61
0.56
0.60
6.22
–
1.50
1.78
L1
L2
L3
L4
L5
L6
2.74 ref.
A1
b
0.51 BSC
0.65
0.64
0.76
4.95
0.46
0.41
0.46
5.97
5.21
6.35
4.32
0.89
–
1.27
1.02
1.49
0.85
10°
b1
b2
b3
c
1.14
0.65
0°
c1
c2
D
1
2
0°
15°
25°
35°
Notes
D1
E
•
•
•
•
Dimensioning and tolerance confirm to ASME Y14.5M-1994
All dimensions are in millimeters. Angles are in degrees
Heat sink side flash is max. 0.8 mm
6.73
–
E1
e
2.29 BSC
Radius on terminal is optional
H
9.94
10.34
ECN: E19-0649-Rev. Q, 16-Dec-2019
DWG: 5347
Revision: 16-Dec-2019
Document Number: 71197
2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Package Information
Vishay Siliconix
TO-251AA (HIGH VOLTAGE)
4
3
A
E1
E
Thermal
P
A
D
A
4
0.010
M
A B
C
0.25
c2
b
4
L2
4
A
θ
1
θ
2
D1
4
B
C
3
Seating
plane
5
C
B
C
L3
L1
(Dat
u
m A)
L
B
A
A1
3 x
b
2
3 x
b
c
V
ie
w
A – A
M
0.010
C A B
0.25
2 x e
Base
metal
5
Plating
(c)
b
1,
b
3
Lead tip
5
c1
(
b
,
b
2)
Section B – B and C – C
MILLIMETERS
INCHES
MILLIMETERS
INCHES
MAX.
DIM.
A
MIN.
2.18
0.89
0.64
0.65
0.76
0.76
4.95
0.46
0.41
0.46
5.97
MAX.
2.39
1.14
0.89
0.79
1.14
1.04
5.46
0.61
0.56
0.86
6.22
MIN.
0.086
0.035
0.025
0.026
0.030
0.030
0.195
0.018
0.016
0.018
0.235
MAX.
0.094
0.045
0.035
0.031
0.045
0.041
0.215
0.024
0.022
0.034
0.245
DIM.
D1
E
MIN.
5.21
6.35
4.32
MAX.
MIN.
0.205
0.250
0.170
–
6.73
–
–
0.265
–
A1
b
E1
e
b1
b2
b3
b4
c
2.29 BSC
2.29 BSC
L
8.89
1.91
0.89
1.14
0′
9.65
2.29
1.27
1.52
15′
0.350
0.075
0.035
0.045
0′
0.380
0.090
0.050
0.060
15′
L1
L2
L3
θ
1
θ
2
c1
c2
D
25′
35′
25′
35′
ECN: S-82111-Rev. A, 15-Sep-08
DWG: 5968
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension are shown in inches and millimeters.
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005″) per side. These dimensions are measured at the
outermost extremes of the plastic body.
4. Thermal pad contour optional with dimensions b4, L2, E1 and D1.
5. Lead dimension uncontrolled in L3.
6. Dimension b1, b3 and c1 apply to base metal only.
7. Outline conforms to JEDEC outline TO-251AA.
Document Number: 91362
Revision: 15-Sep-08
1
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product.
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications.
Such statements are not binding
statements about the suitability of products for a particular application.
It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts.
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay.
Product names and markings noted herein may be trademarks of their respective owners.
© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2021
Document Number: 91000
1
