Vishay-Intertech-IRLL110TRPBF
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IRLL110, SiHLL110
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Surface mount
V
DS
(V)
DS(on)
(
)
Q
g
(Max.) (nC)
100
• Available in tape and reel
• Dynamic dV/dt rating
• Repetitive avalanche rated
• Logic-level gate drive
• R
DS(on)
specified at V
GS
= 4 V and 5 V
• Fast switching
R
V
GS
= 5.0 V
0.54
6.1
2.6
Q
gs
(nC)
gd
(nC)
Available
Q
3.3
Configuration
Single
• Material
categorization: for definitions of compliance
D
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
SO
T
–
223
D
G
The SOT-223 package is designed for surface-mounting
using vapor phase, infrared, or wave soldering techniques.
Its unique package design allows for easy automatic
pick-and-place as with other SOT or SOIC packages but
has the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation of
greater than 1.25 W is possible in a typical surface mount
application.
S
D
G
S
Marking code: LB
N-Channel MOSFET
ORDERING INFORMATION
SOT-223
Tube
SOT-223
Package
Tape and Reel
SiHLL110TR-GE3
IRLL110TRPbF
a
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
–
IRLL110PbF
Note
a. See
device orientation.
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
100
UNIT
Drain-Source Voltage
Gate-Source Voltage
V
DS
V
V
GS
10
T
C
= 25 °C
1.5
Continuous Drain Current
V
GS
at 5.0 V
I
D
T
C
= 100 °C
0.93
12
A
Pulsed Drain Current
a
I
DM
Linear Derating Factor
0.025
0.017
50
W/°C
Linear Derating Factor (PCB Mount)
e
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
E
AS
I
AR
mJ
A
1.5
Repetitive Avalanche Energy
a
E
AR
0.31
3.1
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
W
V/ns
°C
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery dV/dt
c
T
A
= 25 °C
2.0
dV/dt
5.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d
T
J
, T
stg
-55 to +150
300
for 10 s
Notes
a. Repetitive
rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 25 V, starting T
J
= 25 °C, L = 25 mH, R
g
= 25
, I
AS
= 1.5 A (see fig. 12).
c. I
SD
5.6 A, dI/dt
75 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6
mm from case.
e. When
mounted on 1″ square PCB (FR-4 or G-10 material).
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRLL110, SiHLL110
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYP.
MAX.
UNIT
Maximum Junction-to-Ambient
R
thJA
R
thJC
–
–
60
40
(PCB Mount)
a
°C/W
Maximum Junction-to-Case (Drain)
Note
a. When
mounted on 1″ square PCB (FR-4 or G-10 material).
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX. UNIT
Static
Drain-Source Breakdown Voltage
V
DS
V
DS
/T
J
V
GS(th)
I
GSS
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
100
–
–
V
V/°C
V
V
DS
Temperature Coefficient
–
0.12
–
Gate-Source Threshold Voltage
Gate-Source Leakage
1.0
–
–
–
–
–
–
–
2.0
100
25
V
GS
=
10 V
–
nA
V
DS
= 100 V, V
GS
= 0 V
–
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
I
DSS
μA
V
DS
= 80 V, V
GS
= 0 V, T
J
= 125 °C
–
250
0.54
0.76
–
V
GS
= 5.0 V
GS
= 4.0 V
I
D
= 0.90 A
b
–
–
R
DS(on)
g
fs
V
I
D
= 0.75 A
Forward Transconductance
Dynamic
V
DS
= 25 V, I
D
= 0.90 A
0.57
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
C
iss
C
oss
C
rss
Q
g
–
–
–
–
–
–
–
–
–
–
250
80
15
–
–
–
V
GS
= 0 V,
V
DS
= 25 V,
pF
f = 1.0 MHz, see fig. 5
–
6.1
2.6
3.3
–
I
D
= 5.6 A, V
DS
= 80 V,
see fig. 6 and 13
b
Q
gs
Q
gd
t
d(on)
t
r
V
GS
= 5.0 V
–
nC
–
9.3
47
16
18
–
V
DD
= 50 V, I
D
= 5.6 A,
R
g
= 12
, R
D
= 8.4
ns
Turn-Off Delay Time
Fall Time
t
d(off)
t
f
–
–
D
Between lead,
Internal Drain Inductance
L
D
L
S
–
–
4.0
6.0
–
–
6 mm (0.25″) from
package and center of
die contact
nH
G
Internal Source Inductance
S
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
MOSFET symbol
showing the
integral reverse
p – n junction diode
D
I
S
–
–
–
–
1.5
12
A
G
Pulsed Diode Forward Current
a
I
SM
S
Body Diode Voltage
V
SD
t
rr
T
J
= 25 °C, I
S
= 1.5 A, V
GS
= 0 V
b
T
J
= 25 °C, I
F
= 5.6 A, dI/dt = 100 A/μs
b
–
–
–
–
2.5
130
0.65
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
110
0.50
ns
μC
Q
rr
t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
Notes
a. Repetitive
rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse
width
300 μs; duty cycle
2 %.
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRLL110, SiHLL110
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Fig. 1 – Typical Output Characteristics
Fig. 3 – Typical Transfer Characteristics
Fig. 2 – Typical Output Characteristics
Fig. 4 – Normalized On-Resistance vs. Temperature
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
3
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRLL110, SiHLL110
Vishay Siliconix
Fig. 7 – Typical Source-Drain Diode Forward Voltage
Fig. 5 – Typical Capacitance vs. Drain-to-Source Voltage
Fig. 8 – Maximum Safe Operating Area
Fig. 6 – Typical Gate Charge vs. Gate-to-Source Voltage
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
4
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRLL110, SiHLL110
Vishay Siliconix
R
D
V
DS
V
GS
D.U.T.
R
g
+
–
V
DD
5 V
Pulse width
≤
1 µs
Duty factor
≤
0.1 %
Fig. 10a – Switching Time Test Circuit
V
DS
90 %
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig. 9 – Maximum Drain Current vs. Case Temperature
Fig. 10b – Switching Time Waveforms
Fig. 11 – Maximum Effective Transient Thermal Impedance, Junction-to-Case
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRLL110, SiHLL110
Vishay Siliconix
L
V
DS
V
DS
Vary t
p
to obtain
required I
AS
t
p
V
DD
D.U.T
I
AS
R
g
+
–
V
DD
V
DS
5 V
0.01
Ω
t
p
I
AS
Fig. 12b – Unclamped Inductive Waveforms
Fig. 12a – Unclamped Inductive Test Circuit
Fig. 12c – Maximum Avalanche Energy vs. Drain Current
Current regulator
Same type as D.U.T.
50 k
Ω
Q
G
12 V
0.2 µF
0.3 µF
5.0 V
V
G
Q
GS
Q
GD
+
–
V
DS
D.U.T.
V
GS
3 mA
Charge
I
G
I
D
Current sampling resistors
Fig. 13a – Basic Gate Charge Waveform
Fig. 13b – Gate Charge Test Circuit
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
6
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
IRLL110, SiHLL110
Vishay Siliconix
Peak Dio
d
e Recovery
d
V/
d
t Test Circuit
+
Circuit layout con
s
ideration
s
•
Low
s
tray inductance
•
G
round plane
D.U.T.
•
Low leakage inductance
current tran
s
former
–
+
–
–
+
R
g
•
dV/dt controlled by R
g
•
Driver
s
ame type a
s
D.U.T.
•
I
S
D
controlled by duty factor “D”
•
D.U.T. – device under te
s
t
+
–
V
DD
Driver gate drive
P.W.
P.W.
D =
Period
Period
V
GS
= 10 V
a
D.U.T. l
S
D
waveform
D.U.T. V
D
S
waveform
Rever
s
e
recovery
current
Body diode forward
current
dI/dt
Diode recovery
dV/dt
V
DD
Re-applied
voltage
Body diode forward drop
Inductor current
I
S
D
Ripple
≤
5 %
Note
a. V
GS
= 5 V for logic level device
s
Fig. 14 – For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
S15-1195-Rev.
F
,
2
5-May-15
Document Number: 91320
7
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Package Information
Vishay Siliconix
SOT-223 (HIGH VOLTAGE)
B
D
3
A
0.0
8
(0.003)
B1
C
M
M
0.10 (0.004)
C B
A
4
3
H
E
M
M
0.20 (0.00
8
) C
A
L1
4 x L
1
2
3
3 x B
0.10 (0.004)
C B
e
θ
M
M
e1
4 x C
MILLIMETERS
INCHES
DIM.
A
MIN.
1.55
0.65
2.95
0.25
6.30
3.30
MAX.
1.80
0.85
3.15
0.35
6.70
3.70
MIN.
0.061
0.026
0.116
0.010
0.248
0.130
MAX.
0.071
0.033
0.124
0.014
0.264
0.146
B
B1
C
D
E
e
2.30 BSC
4.60 BSC
0.0905 BSC
0.181 BSC
e1
H
6.71
0.91
7.29
–
0.264
0.036
0.287
–
L
L1
θ
0.061 BSC
0.0024 BSC
–
10′
–
10′
ECN: S-82109-Rev. A, 15-Sep-08
DWG: 5969
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions are shown in millimeters (inches).
3. Dimension do not include mold flash.
4. Outline conforms to JEDEC outline TO-261AA.
Document Number: 91363
Revision: 15-Sep-08
1
Legal Disclaimer Notice
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product.
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications.
Such statements are not binding
statements about the suitability of products for a particular application.
It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts.
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay.
Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
