Vishay-Intertech-SI1062X-T1-GE3

Part #Vishay-Intertech-SI1062X-T1-GE3
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Vishay-Intertech-SI1062X-T1-GE3
New Product  
Si1062X  
Vishay Siliconix  
N-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
•
•
T
r
enchFET

®

Power MOSFET  
V

DS

(V)  
R

DS(on)

(
) Max.  
0.420 at V

GS

= 4.5 V  
0.492 at V

GS

= 2.5 V  
0.597 at V

GS

= 1.8 V  
0.762 at V

GS

= 1.5 V  
I

D

(A)  
0.5  
Q

g

(Typ.)  
Gate-Source ESD Protected: 1000 V  
Material categorization:  
For definitions of compliance please see  
0.2  
20  
1 nC  
0.2  
APPLICATIONS  
0.05  
•
•
Load/Power Switching for Portable Devices  
Drivers: Relays,
 
Solenoids, Lamps, Hammers, Displays,  
Memories  
•
•
Battery Operated Systems  
Power Supply Converter Circuits  
SC-89 (3-LEADS)  
G
S
1
2
Marking Code  
J
XX  
3
D
Lot Tracea
b
ility  
and Date Code  
Part # Code  
T
o
p
V
ie
w  
Orderin
g
Information:
Si1062X-T1-GE3 (Lead (P
b
)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
20  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

8
0.53

a, b  

T

A

= 25 °C  
T

A

= 70 °C  
Continuous Drain Current (T

J

= 150 °C)

a  

I

D  

0.43

a, b  

2
A
I

DM  

I

S  

Pulsed Drain Current (t = 300 µs)  
0.18

a, b  

0.22

a, b  

T

A

= 25 °C  
Continuous Source-Drain Diode Current  
A
W
°C  
T

A

= 25 °C  
Maximum Power Dissipation

a  

P

D  

0.14

a, b  

T

A

= 70 °C  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 150  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
R

thJA  

Typ.  
Max.  
530  
Unit  
t

5 s  
440  
540  
Maximum Junction-to-Ambient

b  

°C/W  
Steady State  
650  
Notes:  
a. Surface
 
mounted on 1″ x 1″ FR4 board.  
b. t
 
= 5 s.  
For technical questions, contact:
pmostechsupport@visha
y
.
com  
This document is subject to change without notice.  
Document Number: 62661  
S12-2732-Rev. B, 12-Nov-12  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

New Product  
Si1062X  
Vishay Siliconix  
SPECIFICATIONS
(T =
 
25 °C, unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
Drain-Source Breakdown Voltage  
V

DS

T
e
mperature Coefficient  
V

DS  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
20  
V
mV/°C  
V
V

DS

/T

J  

V

GS(th)

/T

J  

V

GS(th)  

11  
V

GS(th)

T
e
mperature Coefficient  
– 1.8  
Gate-Source Threshold Voltage  
V

DS

= V

GS

, I

D

= 250 µA  
0.4  
1
30  
1
V

DS

= 0
V
,
V

GS  

V

DS

= 0
V
,
V

GS  

=
8 V  
Gate-Source Leakage  
I

GSS  

=
4.5 V  
µA  
A
V

DS

= 20
V
,
V

GS

= 0 V  
V

DS

= 20
V
,
V

GS

= 0
V
,
T

J

= 85 °C  
V

DS

=
5
V
,
V

GS

= 4.5 V  
V

GS

= 4.5
V
,
I

D

= 0.5 A  
1
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

I

DSS  

10  
I

D(on)  

2
0.350  
0.410  
0.459  
0.510  
7.5  
0.420  
0.492  
0.597  
0.762  
V

GS

= 2.5
V
,
I

D

= 0.2 A  
Drain-Source On-State Resistance

a  

R

DS(on)  

S
V

GS

= 1.8
V
,
I

D

= 0.2 A  
V

GS

= 1.5
V
,
I

D

= 0.05 A  
V

DS

= 10
V
,
I

D

= 0.5 A  
Forward
T
r
ansconductance  
Dynamic

b  

g

fs  

Input Capacitance  
C

iss  

C

oss  

C

rss  

43  
14  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
V

DS

= 10
V
,
V

GS

= 0
V
, f = 1
M
Hz  
V

DS

= 10
V
,
V

GS

= 8
V
,
I

D

= 0.5 A  
pF  
8
1.8  
1
2.7  
2
T
o
tal Gate Charge  
Q

g  

nC  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
T
u
rn-On Delay Time  
Rise Time  
Q

gs  

Q

gd  

R

g  

V

DS

= 10
V
,
V

GS

= 4.5
V
,
I

D

= 0.5 A  
f = 1 MHz  
0.16  
0.13  
12.2  
2
t

d(on)  

t

r  

t

d(off)  

t

f  

4
14  
24  
30  
20  
V

DD

= 10
V
,
R

L

= 20
  
ns  
I

D

0.4 A, V

GEN

= 4.5
V
,
R

g

= 1
  
T
u
rn-Off Delay Time  
Fall Time  
16  
11  
Drain-Source Body Diode Characteristics  
Pulse Diode Forward Current

a  

Body Diode Voltage  
I

SM  

V

SD  

t

rr  

2
1.2  
15  
4
A
V
I

S

= 0.4 A  
0.8  
10  
2
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
ns  
nC  
Q

rr  

t

a  

I

F

= 0.4 A, dI/dt = 100 A/µs  
5
ns  
Reverse Recovery Rise Time  
t

b  

5
Notes:  
a. Pulse test; pulse width
300 µs, duty cycle
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
For technical questions, contact:
pmostechsupport@visha
y
.
com  
This document is subject to change without notice.  
2
Document Number: 62661  
S12-2732-Rev. B, 12-Nov-12  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

New Product  
Si1062X  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
10

-4  

0.8  
10

-5  

0.6  
T

J

= 150
°
C  
10

-6  

0.4  
T

J

= 25
°
C  
T

J

= 25
°
C  
10

-7  

0.2  
10

-8  

10

-9  

0
0
4
7
11  
14  
0
0
0
2
4
6
8
10  
12  
14  
V

GS

– Gate-to-Source Voltage (V)  
V

GS

– Gate-Source Voltage (V)  
Gate Current vs. Gate-Source Voltage  
Gate Current vs. Gate-Source Voltage  
2
1.5  
1
0.5  
0.4  
0.3  
0.2  
0.1  
0
V

GS

= 5 V thru 2 V  
V

GS

= 1.5 V  
T

C

= 25
°
C  
0.5  
0
T

C

= 125
°
C  
V

GS

= 1 V  
T

C

= – 55
°
C  
1.2 1.5  
0.5  
1
1.5  
2
0
0.3  
0.6  
0.9  
V

DS

– Drain-to-Source Voltage (V)  
V

GS

– Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
60  
45  
30  
15  
0
0.8  
0.6  
0.4  
0.2  
C

iss  

V

GS

= 1.8 V  
V

GS

= 1.5 V  
V

GS

= 2.5 V  
V

GS

= 4.5 V  
C

oss  

C

rss  

0
5
10  
15  
20  
0.5  
1
1.5  
2
V

DS

– Drain-to-Source Voltage (V)  
I

D

– Drain Current (A)  
On-Resistance vs. Drain Current  
Capacitance  
For technical questions, contact:
pmostechsupport@visha
y
.
com  
This document is subject to change without notice.  
Document Number: 62661  
S12-2732-Rev. B, 12-Nov-12  
3
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

New Product  
Si1062X  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
8
6
4
2
0
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
I

D

= 0.5 A  
I

D

= 0.5 A  
V

GS

= 4.5 V, 2.5 V  
V

DS

= 10 V  
V

DS

= 5 V  
V

DS

= 16 V  
0
0.5  
1
1.5  
2
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
Q

g

– Total Gate Charge (nC)  
T

J

– Junction Temperature (
°
C)  
Gate Charge  
On-Resistance vs. Junction Temperature  
10  
0.8  
0.65  
0.5  
I

D

= 0.5 A  
T

J

= 150
°
C  
T

J

= 125  
1
T

J

= 25
°
C  
0.35  
0.2  
T

J

= 25
°
C  
0.1  
0.0  
0.3  
0.6  
0.9  
1.2  
0
1
2
3
4
5
V

SD

– Source-to-Drain Voltage (V)  
V

GS

– Gate-to-Source Voltage (V)  
Soure-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
10  
8
0.7  
0.6  
0.5  
0.4  
0.3  
I

D

= 250 μA  
6
4
2
0
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
Time (s)  
T

J

– Temperature (
°
C)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
For technical questions, contact:
pmostechsupport@visha
y
.
com  
This document is subject to change without notice.  
4
Document Number: 62661  
S12-2732-Rev. B, 12-Nov-12  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

New Product  
Si1062X  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
0.24  
0.18  
0.12  
0.06  
0
10  
100 μs  
1 ms  
1

Limited by R

DS(on)  

*
10 ms  
0.1  
0.01  
100 ms  
1 s  
DC, 10 s  
T

A

= 25
°
C  
Single Pulse  
BVDSS Limited  
10  
0.001  
0.1  
1
100  
0
25  
50  
75  
100  
125  
150  
V

DS

– Drain-to-Source Voltage (V)  
* V

GS

> minimum V

GS

at which R

DS(on)

is specified  
T

A

– Ambient Temperature (
°
C)  
Safe Operating Area, Junction-to-Ambient  
Power Derating, Junction-to-Ambient  
* The power dissipation P

D

is based on T

J(max)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.001  
0.01  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
For technical questions, contact:
pmostechsupport@visha
y
.
com  
This document is subject to change without notice.  
Document Number: 62661  
S12-2732-Rev. B, 12-Nov-12  
5
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
SC89Ć3  
X
E
D
A
C
H
L
DETAIL X  
3
MILLIMETERS  
INCHES  
Dim  
Min  
0.60  
0.23  
0.10  
1.50  
0.75  
Max  
0.80  
0.33  
0.20  
1.70  
0.95  
Min  
Max  
0.031  
0.013  
0.008  
0.067  
0.037  
0.024  
0.009  
0.004  
0.059  
0.030  
A
b
C
D
E
1
2
1.00 BSC  
0.50 BSC  
1.50  
0.30  
0.040 BSC  
0.020 BSC  
e
e1  
b
e

1  

H
L
e
1.70  
0.50  
0.059  
0.012  
0.067  
0.020  
ECN: S-03946—Rev. B, 09-Jul-01  
DWG: 5869  
Document Number: 71377  
06-Jul-01  
1

Application Note 826  
Vishay Siliconix  
RECOMMENDED MINIMUM
P
A
DS FOR SC-89: 3-Lead  
RECOMMENDED MINIMUM PADS FOR SC-89:
 
3-LEAD  
0.0200  
0.0150  
)
)
(0.51  
(0.38  
0.0250  
0.0150  
)
)
(0.64  
(0.38  
0.0550  
)
(1.40  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
20  
Document Number: 72604  
Revision: 21-Jan-08  

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1