Vishay-Intertech-SI2301BDS-T1-GE3

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Vishay-Intertech-SI2301BDS-T1-GE3
Si2301BDS  
Vishay Siliconix  
P-Channel 2.5 V (G-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
Halogen-free According to IEC 61249-2-21  
I

D

(A)

b  

– 2.4  
Definition  
V

DS

(V)  
R

DS(on)

(
)  
•
•
•
T
r
enchFET

®

Power MOSFET  
0.100 at V

GS

= – 4.5 V  
0.150 at V

GS

= – 2.5 V  
– 20  
100 % R

g

T
e
sted  
– 2.0  
Compliant to RoHS Directive 2002/95/EC  
TO-236  
(SOT-23)  
G
S
1
2
3
D
Top View  
Si2301 BDS (L1)*  
* Marking Code  
Ordering Information:  
Si2301BDS-T1-E3 (Lead (Pb)-free)  
Si2301BDS-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
5 s  
Steady State  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
– 20  
ꢀ
V
V

GS  

T

A

= 25 °C  

A

= 70 °C  
– 2.4  
– 1.9  
– 2.2  
– 1.ꢀ  
Continuous Drain Current (T

J

= 150 °C)

b  

I

D  

T
A
Pulsed Drain Current

a  

Continuous Source Current (Diode Conduction)

b  

I

DM  

I

S  

– 10  
– 0.72  
0.9  
– 0.6  
0.7  
T

A

= 25 °C  
T

A

= 70 °C  
Power Dissipation

b  

P

D  

W
0.57  
0.45  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
120  
Maximum  
145  
Unit  
Maximum Junction-to-Ambient

b  

Maximum Junction-to-Ambient

c  

R

thJA  

°C/W  
140  
175  
Notes:  
a. Pulse width limited by maximum junction temperature.  
b. Surface mounted on FR4 board, t
5 s.  
c. Surface mounted on FR4 board.  
* Pb containing terminations are not RoHS compliant, exemptions may apply.  
Document Number: 72066  
S11-2044-Rev. F, 17-Oct-11  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Si2301BDS  
Vishay Siliconix  
SPECIFICATIONS
(T =
 
25 °C, unless otherwise noted)  
J
Limits  
Typ.  
Parameter  
Symbol  
Test Conditions  
Min.  
Max.  
Unit  
Static  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= – 250 µA  
V

DS

= V

GS

, I

D

= – 250 µA  
Drain-Source Breakdown Voltage  
– 20  
V
Gate Threshold Voltage  
Gate-Body Leakage  
– 0.45  
– 0.95  
100  
– 1  
V

DS

= 0
V
,
V

GS  

=
ꢀ V  
nA  
µA  
V

DS

= – 20
V
,
V

GS

= 0 V  

DS

= – 20
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
V

DS

– 5
V
,
V

GS

= – 4.5 V  
V

DS

– 5
V
,
V

GS

= – 2.5 V  
V

GS

– 4.5
V
,
I

D

= – 2.ꢀ A  
I

DSS  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

V
– 10  
– 6  
– 3  
I

D(on)  

A
0.0ꢀ0  
0.110  
6.5  
0.100  
0.150  
Drain-Source On-State Resistance

a  

R

DS(on)  

V

GS

= – 2.5
V
,
I

D

= – 2 A  
Forward
T
r
ansconductance

a  

Diode Forward Voltage  
g

fs  

V

DS

= – 5
V
,
I

D

= – 2.ꢀ A  
I

S

= – 0.75 A, V

GS

= 0 V  
S
V
V

SD  

– 0.ꢀ0  
– 1.2  
10  
Dynamic

b  

Q

g  

Q

gs  

Q

gd  

R

g  

T
o
tal Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
4.5  
0.7  
1.1  
ꢀ
V

DS

= – 6
V
,
V

GS

= – 4.5 V  
nC  
I

D

– 2.ꢀ A  
f = 1 MHz  
2
16  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
375  
95  
V

DS

= – 6
V
,
V

GS

= 0
V
, f = 1
M
Hz  
pF  
65  
Switching

c  

t

d(on)  

t

r  

t

d(off)  

t

f  

20  
40  
30  
20  
30  
60  
45  
30  
T
u
rn-On Time  
V

DD

= – 6
V
,
R

L

= 6
  
I

D

– 1 A, V

GEN

= – 4.5 V  
R

g

= 6
  
ns  
T
u
rn-Off Time  
Notes:  
a. Pulse test: pulse width
300 µs duty cycle

2 %.  
b. For DESIGN AID ONLY, not subject to production testing.  
c. Switching time is essentially independent of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
2
Document Number: 72066  
S11-2044-Rev. F, 17-Oct-11  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Si2301BDS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
10  
10  
V
GS  
= 5 thru 2.5 V  
T
= – 55 °C  
C
ꢀ
ꢀ
2 V  
25 °C  
125 °C  
6
6
4
4
1.5 V  
2
2
1 V  
4
0
0
0.0  
0
0
0
1
2
3
5
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
V
– Drain-to-Source Voltage (V)  
V
– Gate-to-Source Voltage (V)  
DS  
GS  
Output Characteristics  
Transfer Characteristics  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
ꢀ00  
600  
400  
200  
0
C
iss  
V
GS  
= 2.5 V  
C
oss  
V
GS  
= 4.5 V  
ꢀ
C
rss  
2
4
6
10  
0
4
ꢀ
12  
16  
20  
I
D
– Drain Current (A)  
V
DS  
– Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current  
Capacitance  
1.6  
1.4  
1.2  
1.0  
0.ꢀ  
0.6  
5
4
3
2
1
0
V
= 4.5 V  
V
D
= 10 V  
DS  
= 2.ꢀ A  
GS  
= 2.ꢀ A  
I
D
I
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
1
2
3
4
5
T
– Junction
T
e
mperature (°C)  
Q
– Total Gate Charge (nC)  
J
g
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 72066  
S11-2044-Rev. F, 17-Oct-11  
3
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Si2301BDS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
10  
T
= 150 °C  
J
I
D
= 2.ꢀ A  
1
T
= 25 °C  
J
0.1  
0
1
2
3
4
5
0
0.2  
0.4  
0.6  
0.ꢀ  
1.0  
1.2  
V
GS  
– Gate-to-Source Voltage (V)  
V
SD  
– Source-to-Drain Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
10  
ꢀ
0.4  
0.3  
0.2  
6
I
D
= 250 µA  
0.1  
4
0.0  
T
A
= 25 °C  
2
0
– 0.1  
– 0.2  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
Time (s)  
100  
1000  
T
–
T
e
mperature (°C)  
J
Threshold Voltage  
Single Pulse Power  
100  
10
µ
s  
100
µ
s  
10  
Limited by  
DS(on)*  
R
1 ms  
1
10 ms  
T
A
= 25 °C  
Single Pulse  
100 ms  
0.1  
DC, 100 s, 10 s, 1 s  
0.01  
0.1  
1
10  
100  
V
DS  
– Drain-to-Source Voltage (V)  
* V  
GS  
minimum V
 
at which R
 
is specified  
GS  
DS(on)  
Square Wave Pulse Duration (s)  
Safe Operating Area  
4
Document Number: 72066  
S11-2044-Rev. F, 17-Oct-11  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Si2301BDS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
t
1
t
2
t
t
1
2
0.02  
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 62.5
°
C/W  
thJA  
(t)  
3. T

JM

–
T =
 
P  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
Document Number: 72066  
S11-2044-Rev. F, 17-Oct-11  
5
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
SOT-23 (TO-236): 3-LEAD  
b
3
E
1
E
1
2
e
S
e
1
D
0.10 mm  
0.004″  
C
C
0.25 mm  
q
A
2
A
G
au
ge Pl
a
ne  
S
e
a
ting Pl
a
ne  
S
e
a
ting Pl
a
ne  
C
A
1
L
L
1
MILLIMETERS  
INCHES  
Dim  
Min  
0.89  
0.01  
Max  
1.12  
0.10  
Min  
0.0
3
5  
0.0004  
Max  
0.044  
0.004  
A
A

1  

A

2  

0.88  
0.
3
5  
0.085  
2.80  
2.10  
1.20  
1.02  
0.50  
0.18  
3
.04  
2.64  
1.40  
0.0
3
46  
0.014  
0.00
3  
0.110  
0.08
3  
0.047  
0.040  
0.020  
0.007  
0.120  
0.104  
0.055  
b
c
D
E
E

1  

e
0.95 BSC  
1.90 BSC  
0.0
3
74 Ref  
e

1  

0.0748 Ref  
L
0.40  
0.60  
8°  
0.016  
0.024  
8°  
L

1  

0.64 Ref  
0.50 Ref  
0.025 Ref  
0.020 Ref  
S
q
3
°  
3
°  
ECN: S-0
3
946-Rev. K, 09-Jul-01  
DWG: 5479  
Document Number: 71196  
09-Jul-01  
1

Application Note 826  
Vishay Siliconix  
RECOMMENDED MINIMUM
P
A
DS FOR SO
T
–
23  
0.037  
0.022  
(0.950)  
(0.559)  
0.053  
(1.341)  
0.097  
(2.459)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
Document Number: 72609  
Revision: 21-Jan-08  
25  

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 01-Jan-2021  
Document Number: 91000  
1