Vishay-Intertech-SI4931DY-T1-E3
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Si4931DY
Vishay Siliconix
Dual P-Channel 12-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
V
DS
(V)
R
DS(on)
(
Ω
)
I
D
(A)
– 8.9
– 8.1
– 3.6
Definition
0.018 at V
GS
= – 4.5 V
0.022 at V
GS
= – 2.5 V
0.028 at V
GS
= – 1.8 V
•
•
•
TrenchFET
®
Power MOSFET
Advanced High Cell Density Process
Compliant to RoHS Directive 2002/95/EC
– 12
APPLICATIONS
Load Switching
•
S
S
2
1
SO-8
S
1
D
1
D
1
D
2
D
2
1
2
3
4
8
7
6
5
G
G
2
1
G
1
S
2
G
2
Top View
D
1
D
2
Ordering Information:
Si4931DY
-T1-E3
(Lead (Pb)-free)
Si4931DY
-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS
T =
25 °C, unless otherwise noted
A
Parameter
Symbol
10 s
Steady State
Unit
V
DS
Drain-Source Voltage
Gate-Source Voltage
– 12
8
V
V
GS
T
A
= 25 °C
T
A
= 70 °C
– 8.9
– 7.1
– 6.7
– 5.4
Continuous Drain Current (T
J
= 150 °C)
a
I
D
A
I
DM
I
S
Pulsed Drain Current
– 30
Continuous Source Current (Diode Conduction)
a
– 1.7
2.0
– 0.9
1.1
T
A
= 25 °C
T
A
= 70 °C
Maximum Power Dissipation
a
P
D
W
1.3
0.7
T
J
, T
stg
Operating Junction and Storage
T
e
mperature Range
– 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
46
Maximum
62.5
Unit
t
≤
10 s
Maximum Junction-to-Ambient
a
R
thJA
Steady State
Steady State
80
110
°C/W
R
thJF
Maximum Junction-to-Foot (Drain)
24
32
Notes:
a. Surface Mounted on 1″ x 1″ FR4 board.
Document Number: 72379
S09-0704-Rev. C, 27-Apr-09
1
Si4931DY
Vishay Siliconix
SPECIFICATIONS
T =
25 °C, unless otherwise noted
J
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
V
GS(th)
I
GSS
V
DS
= V
GS
, I
D
= – 350 µA
Gate Threshold Voltage
– 0.4
– 1.0
100
– 1
V
V
DS
= 0
V
,
V
GS
=
8 V
Gate-Body Leakage
nA
V
DS
= – 12
V
,
V
GS
= 0 V
DS
= – 12
V
,
V
GS
= 0
V
,
T
J
= 55 °C
V
DS
= – 5
V
,
V
GS
= – 4.5 V
V
GS
= – 4.5
V
,
I
D
= – 8.9 A
I
DSS
Zero Gate Voltage Drain Current
µA
A
V
– 5
On-State Drain Current
a
I
D(on)
– 30
0.0145
0.018
0.023
26
0.018
0.022
0.028
Drain-Source On-State Resistance
a
R
DS(on)
V
V
GS
= – 2.5
V
,
I
D
= – 8.1 A
GS
= – 1.8
V
,
I
D
= – 3.6 A
Ω
Forward
T
r
ansconductance
a
Diode Forward Voltage
a
Dynamic
b
g
fs
V
DS
= – 6
V
,
I
D
= – 8.9 A
I
S
= – 1.7 A, V
GS
= 0 V
S
V
V
SD
– 0.7
– 1.2
52
Q
g
Q
gs
Q
gd
R
g
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
T
u
rn-On Delay Time
Rise Time
34.5
5.1
9.6
9
V
DS
= – 6
V
,
V
GS
= – 4.5
V
,
I
D
= – 8.9 A
nC
Ω
t
d(on)
t
r
t
d(off)
t
f
25
40
70
46
V
DD
= – 6
V
,
R
L
= 6
Ω
I
D
≅
– 1 A, V
GEN
= – 4.5
V
,
R
g
= 6
Ω
T
u
rn-Off Delay Time
Fall Time
230
155
128
345
235
200
ns
t
rr
I
F
= – 1.7 A, dI/dt = 100 A/µs
Source-Drain Reverse Recovery Time
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS
25 °C unless otherwise noted
30
24
18
12
6
30
24
18
12
6
V
GS
= 5 V thru 2 V
1.5 V
1 V
T
= 125 °C
C
25 °C
– 55 °C
1.5
0
0
0.0
0.5
1.0
2.0
2.5
0
1
2
3
4
5
V
GS
– Gate-to-Source Voltage (V)
V
DS
– Drain-to-Source Voltage (V)
Transfer Characteristics
Output Characteristics
2
Document Number: 72379
S09-0704-Rev. C, 27-Apr-09
Si4931DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C unless otherwise noted
5000
4000
3000
2000
1000
0
0.10
0.08
0.06
0.04
C
iss
V
GS
= 1.8 V
C
oss
V
V
= 2.5 V
= 4.5 V
C
rss
GS
0.02
0.00
GS
0
6
12
18
24
30
0
2
4
6
8
10
12
I
– Drain Current (A)
V
DS
– Drain-to-Source Voltage (V)
D
On-Resistance vs. Drain Current
Capacitance
5
4
3
2
1
0
1.4
1.2
1.0
0.8
0.6
V
D
= 6 V
V
D
= 4.5 V
DS
= 8.9 A
GS
I =
8.9 A
I
0
10
20
30
40
– 50
– 25
0
25
T –
Junction Temperature (°C)
J
50
75
100 125 150
Q
– Total Gate Charge (nC)
g
Gate Charge
On-Resistance vs. Junction Temperature
30
10
0.10
0.08
0.06
0.04
0.02
0.00
I
D
= 8.9 A
T
= 150 °C
J
I
D
= 3.6 A
T
= 25 °C
J
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
1
2
3
4
5
V
SD
– Source-to-Drain Voltage (V)
V
GS
– Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 72379
S09-0704-Rev. C, 27-Apr-09
3
Si4931DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C unless otherwise noted
0.4
30
24
18
12
6
0.3
I
D
= 350 µA
0.2
0.1
0.0
– 0.1
– 0.2
0
-2
-1
– 50
– 25
0
25
50
75
100 125 150
10
10
1
10
100
600
T
– Temperature (°C)
Time (s)
J
Single Pulse Power
Threshold Voltage
100
I
Limited
Limited by R
*
DM
DS(on)
10
1
P(t) = 0.001
P(t) = 0.01
I
D(on)
Limited
P(t) = 0.1
P(t) = 1
P(t) = 10
DC
T
= 25 °C
A
0.1
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
V
DS
– Drain-to-Source Voltage (V)
* V
DS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
P
DM
0.1
0.05
t
1
t
2
t
t
1
2
1. Duty Cycle, D =
0.02
2. Per Unit Base = R
= 80 °C/W
thJA
(t)
3.
T
JM
–
T =
P
4. Surface Mounted
Z
A
DM thJA
Single Pulse
0.01
-4
-3
-2
-1
10
10
10
10
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
4
Document Number: 72379
S09-0704-Rev. C, 27-Apr-09
Si4931DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C unless otherwise noted
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
–
4
10
–
3
10
–
2
10
–
1
10
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
Document Number: 72379
S09-0704-Rev. C, 27-Apr-09
5
Package Information
Vishay Siliconix
S
OIC (NARROW): 8-LEAD
JEDEC P
a
rt N
u
m
b
er: M
S
-012
8
6
7
2
5
4
E
H
1
3
S
h x 45
D
C
0.25 mm (G
a
ge Pl
a
ne)
A
All Le
a
d
s
0.101 mm
q
e
B
A
1
L
0.004″
MILLIMETERS
Max
INCHES
DIM
A
Min
Min
Max
1.35
0.10
0.35
0.19
4.80
3.80
1.75
0.20
0.51
0.25
5.00
4.00
0.053
0.004
0.014
0.0075
0.189
0.150
0.069
0.008
0.020
0.010
0.196
0.157
A
1
B
C
D
E
e
1.27 BSC
0.050 BSC
H
h
5.80
0.25
0.50
0°
6.20
0.50
0.93
8°
0.228
0.010
0.020
0°
0.244
0.020
0.037
8°
L
q
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
1
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Vishay
Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product.
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
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typical requirements that are often placed on Vishay products in generic applications.
Such statements are not binding
statements about the suitability of products for a particular application.
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts.
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including but not limited to the warranty expressed therein.
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
