Vishay-Intertech-SI4966DY-T1-E3

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Vishay-Intertech-SI4966DY-T1-E3
Si4966DY  
Vishay Siliconix  
Dual N-Channel 2.5-V (G-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
Halogen-free According to IEC 61249-2-21  
V

DS

(V)  
R

DS(on)

(
Ω
)  
I

D

(A)  
7.1  
Definition  
0.025 at V

GS

= 4.5 V  
0.035 at V

GS

= 2.5 V  
•
•
•
TrenchFET

®

Power MOSFET  
100 % R

g

Tested  
20  
6.0  
Compliant to RoHS Directive 2002/95/EC  
SO-8  
D
1
D
2
S
D
1
D
1
D
2
D
2
1
2
3
4
8
7
6
5
1
G
1
S
2
2
G
G
G
2
1
Top View  
S
S
2
1
Ordering Information:
Si4966DY
-T1-E3
(Lead (Pb)-free)  
Si4966DY
-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
T =
 
25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
20  
12  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

T

A

= 25 °C  
T

A

= 70 °C  
7.1  
5.7  
40  
Continuous Drain Current (T

J

= 150 °C)

a  

I

D  

A
I

DM  

I

S  

Pulsed Drain Current (10 µs Pulse Width)  
Continuous Source Current (Diode Conduction)

a  

1.7  
T

A

= 25 °C  
T

A

= 70 °C  
2
Maximum Power Dissipation

a  

P

D  

W
1.3  
T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Limit  
Unit  
Maximum Junction-to-Ambient

a  

R

thJA  

62.5  
°C/W  
Notes:  
a. Surface Mounted on FR4 board, t
≤
10 s.  
Document Number: 70718  
S09-0869-Rev. D, 18-May-09  
1

Si4966DY  
Vishay Siliconix  
SPECIFICATIONS
T =
 
25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

GS(th)  

I

GSS  

V

DS

= V

GS

, I

D

= 250 µA  
Gate Threshold Voltage  
0.6  
1.5  
100  
1
V
V

DS

= 0
V
,
V

GS  

=
12 V  
Gate-Body Leakage  
nA  
V

DS

= 20
V
,
V

GS

= 0 V  
V

DS

= 20
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
V

DS

≥
5
V
,
V

GS

= 4.5 V  
I

DSS  

I

D(on)  

Zero Gate Voltage Drain Current  
µA  
A
5
On-State Drain Current

a  

20  
V

GS

=
4.5
V
,
I

D

= 7.1 A  
0.019  
0.025  
27  
0.025  
0.035  
Drain-Source On-State Resistance

a  

R

DS(on)  

Ω
V

GS

= 2.5
V
,
I

D

= 6.0 A  
Forward
T
r
ansconductance

a  

Diode Forward Voltage

a  

Dynamic

b  

g

fs  

V

DS

= 10
V
,
I

D

= 7.1 A  
I

S

= 1.7 A, V

GS

= 0 V  
S
V
V

SD  

1.2  
50  
Q

g  

Q

gs  

Q

gd  

R

g  

T
o
tal Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
T
u
rn-On Delay Time  
Rise Time  
25  
6.5  
4
V

DS

= 10
V
,
V

GS

= 4.5
V
,
I

D

= 7.1 A  
f = 1 MHz  
nC  
1.6  
40  
40  
90  
40  
40  
2.7  
60  
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

60  
V

DD

= 10
V
,
R

L

= 10
Ω  
I

D

≅
1 A, V

GEN

= 4.5
V
,
R

g

= 6
Ω  
T
u
rn-Off Delay Time  
Fall Time  
150  
60  
ns  
t

rr  

I

F

= 1.7 A, dI/dt = 100 A/µs  
Source-Drain Reverse Recovery Time  
80  
Notes:  
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
2
Document Number: 70718  
S09-0869-Rev. D, 18-May-09  

Si4966DY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
40  
40  
30  
20  
10  
0
V
= 5 V thru 3 V  
GS  
2.5 V  
30  
20  
10  
0
2 V  
T
= 125 °C  
C
25 °C  
1
V
,
1
.5 V  
3.5  
– 55 °C  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
4.0  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
V
DS  
– Drain-to-Source Voltage (V)  
V
GS  
– Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
4000  
3200  
2400  
1600  
800  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
C
iss  
V
GS  
= 2.5 V  
C
oss  
V
GS  
= 4.5 V  
C
rss  
0
0
4
8
12  
16  
20  
0
10  
20  
– Drain Current (A)  
30  
40  
V
– Drain-to-Source Voltage (V)  
I
D
DS  
On-Resistance vs. Drain Current  
Capacitance  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
5
4
3
2
1
0
V
I
= 4.5 V  
V
D
= 10 V  
GS  
DS  
= 7.1 A  
= 7.1 A  
I
D
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
Q
– Total Gate Charge (nC)  
T –
 
Junction
T
e
mperature (°C)  
J
g
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 70718  
S09-0869-Rev. D, 18-May-09  
3

Si4966DY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
40  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
I
D
= 7.1 A  
T
= 150 °C  
J
10  
T
= 25 °C  
J
1
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
1
2
3
4
5
V
SD  
– Source-to-Drain Voltage (V)  
V
– Gate-to-Source Voltage (V)  
GS  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.4  
0.2  
30  
24  
18  
12  
6
I
= 250
µ
A  
D
0.0  
– 0.2  
– 0.4  
– 0.6  
0
0.01  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0.10  
1.00  
Time (s)  
10.00  
T
– Temperature (°C)  
J
Single Pulse Power  
Threshold Voltage  
2
1
Duty Cycle = 0.5  
0.2  
Notes:  
0.1  
P
DM  
0.1  
0.05  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
0.02  
2. Per Unit Base = R  
= 62.5 °C/W  
thJA  
(t)  
3. T  
– T
 
= P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
30  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
4
Document Number: 70718  
S09-0869-Rev. D, 18-May-09  

Package Information  
Vishay Siliconix  
S
OIC (NARROW): 8-LEAD  
JEDEC P
a
rt N
u
m
b
er: M
S
-012  
8
6
7
2
5
4
E
H
1
3
S
h x 45  
D
C
0.25 mm (G
a
ge Pl
a
ne)  
A
All Le
a
d
s  
0.101 mm  
q
e
B
A
1
L
0.004″  
MILLIMETERS  
Max  
INCHES  
DIM  
A
Min  
Min  
Max  
1.35  
0.10  
0.35  
0.19  
4.80  
3.80  
1.75  
0.20  
0.51  
0.25  
5.00  
4.00  
0.053  
0.004  
0.014  
0.0075  
0.189  
0.150  
0.069  
0.008  
0.020  
0.010  
0.196  
0.157  
A

1  

B
C
D
E
e
1.27 BSC  
0.050 BSC  
H
h
5.80  
0.25  
0.50  
0°  
6.20  
0.50  
0.93  
8°  
0.228  
0.010  
0.020  
0°  
0.244  
0.020  
0.037  
8°  
L
q
S
0.44  
0.64  
0.018  
0.026  
ECN: C-06527-Rev. I, 11-Sep-06  
DWG: 5498  
Document Number: 71192  
11-Sep-06  
1

Application Note 826  
Vishay Siliconix  
RECOMMENDED MINIMUM
P
A
DS FOR SO-8  
0.172  
(4.369)  
0.028  
(0.711)  
0.022  
0.050  
(0.559)  
(1.270)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
22  
Document Number: 72606  
Revision: 21-Jan-08  

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1