Vishay-Intertech-SQ9945BEY-T1-GE3

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Vishay-Intertech-SQ9945BEY-T1-GE3
SQ9945BEY  
Vishay Siliconix  
Automotive Dual N-Channel 60 V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
V

DS

(V)  
• TrenchFET

®

power MOSFET  
• 100 % R

g

and UIS tested  
• AEC-Q101 qualified  
60  
0.064  
0.082  
6
R

DS(on)

(
Ω
) at V

GS

= 10 V  

DS(on)

(
Ω
) at V

GS

= 4.5 V  
R
• Material categorization:  
I

D

(A) per leg  
for definitions of compliance please see  
Configuration  
Package  
Dual  
SO-8  
S
O-8 Dual  
D

2  

D
1
D
2
D

2  

6
5
D

1  

7
D

1  

8
G
G
2
1
4
G

2  

3
S

2  

S
S
1
2
2
G

1  

1
S

1  

N-Channel MOSFET  
N-Channel MOSFET  
Top View  
ABSOLUTE MAXIMUM RATINGS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
60  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
V

DS  

V
V

GS  

20  
T
T

C

= 25 °C  
5.4  
3.1  
3.6  
21.5  
8.5  
3.6  
4
Continuous Drain Current  
I

D  

C

= 125 °C  
Continuous Source Current (Diode Conduction)

a  

Pulsed Drain Current

b  

I

S  

A
I

DM  

I

AS  

Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
E

AS  

mJ  
W
T

C

= 25 °C  
Maximum Power Dissipation

b  

P

D  

T

C

= 125 °C  
1.3  
Operating Junction and Storage Temperature Range  
T

J

, T

stg  

-55 to +175  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
R

thJA  

LIMIT  
112  
38  
UNIT  
Junction-to-Ambient  
PCB Mount

c  

°C/W  
Junction-to-Foot (Drain)  
R

thJF  

Notes  
a. Package
 
limited.  
b. Pulse
 
test; pulse width
≤
300 μs, duty cycle
≤
2 %.  
c. When
 
mounted on 1″ square PCB (FR4 material).  
S15-1873-Rev. D, 10-Aug-15  
Document Number: 71504  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQ9945BEY  
Vishay Siliconix  
SPECIFICATIONS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= 250 μA  
V

DS

= V

GS

, I

D

= 250 μA  
60  
1.5  
–
–
–
V
2
2.5  
V

DS

= 0 V, V

GS  

V

GS

= 0 V  
=
20 V  
–
100  
1
nA  
μA  
A
V

DS

= 60 V  
–
–
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

I

DSS  

V

GS

= 0 V  

GS

= 0 V  
V

DS

= 60 V, T

J

= 125 °C  
V

DS

= 60 V, T

J

= 175 °C  
V

DS

≥
5 V  
–
–
50  
V
–
–
150  
–
I

D(on)  

V

GS

= 10 V  
20  
–
–
0.045  
–
V
V
V

GS

= 10 V  

GS

= 10 V  

GS

= 10 V  
I

D

= 3.4 A  
0.064  
0.110  
0.137  
0.082  
–
I

D

= 3.4 A, T

J

= 125 °C  
I

D

= 3.4 A, T

J

= 175 °C  
I

D

= 3.7 A  
–
Drain-Source On-State Resistance

a  

R

DS(on)  

Ω
–
–
V

GS

= 4.5 V  
–
0.060  
12  
Forward Transconductance

f  

Dynamic

b  

g

fs  

V

DS

= 15 V, I

D

= 3.7 A  
–
S
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
Turn-On Delay Time

c  

Rise Time

c  

Turn-Off Delay Time

c  

Fall Time

c  

C

iss  

C

oss  

C

rss  

Q

g  

–
–
375  
70  
30  
8
470  
88  
36  
12  
1.5  
2.6  
6.66  
9
V

GS

= 0 V  
V

DS

= 25 V, f = 1 MHz  
pF  
–
–
Q

gs  

Q

gd  

R

g  

V

GS

= 10 V  
V

DS

= 30 V, I

D

= 4.3 A  
f = 1 MHz  
–
1.2  
1.7  
–
nC  
–
1.1  
–
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

6
–
2.8  
17  
1.7  
4.2  
26  
3
V

DD

= 30 V, R

L

= 8.8
Ω  
ns  
I

D

≅
3.4 A, V

GEN

= 10 V, R

g

= 1
Ω  
–
–
Source-Drain Diode Ratings and Characteristics

b  

Pulsed Current

a  

I

SM  

–
–
–
21.5  
1.1  
A
V
Forward Voltage  
V

SD  

I

F

= 2 A, V

GS

= 0 V  
0.75  
Notes  
a. Pulse
 
test; pulse width
≤
300 μs, duty cycle
≤
2 %.  
b. Guaranteed
 
by design, not subject to production testing.  
c. Independent
 
of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
S15-1873-Rev. D, 10-Aug-15  
Document Number: 71504  
2
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQ9945BEY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
20  
16  
12  
8
20  
16  
12  
8
V
= 10 V thru 5 V  
= 4 V  
GS  
V
GS  
4
4
T
= 25 °C  
C
V
= 3 V  
GS  
T
= 125 °C  
C
T
= -55 °C  
C
0
0
0
2
4
6
8
10  
0
0
0
1
2
3
4
5
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.25  
0.20  
0.15  
0.10  
0.05  
0
600  
500  
400  
300  
200  
100  
0
C
i
ss  
V
= 4.5 V  
GS  
C
o
ss  
V
= 10 V  
GS  
C
r
ss  
4
8
12  
16  
20  
0
10  
20  
30  
40  
50  
60  
V

D
S

– Drain-to-
S
ource Voltage (V)  
I

D

– Drain Current (A)  
On-Resistance vs. Drain Current  
Capacitance  
2.5  
2.1  
1.7  
1.3  
0.9  
0.5  
10  
8
I
= 4.3 A  
I
= 4.3 A  
D
D
V
= 10 V  
GS  
V
= 30 V  
D
S  
6
V
= 4.5 V  
GS  
4
2
0
2
4
6
8
10  
-50 -25  
0
25  
50  
75 100
 
125 150 175  
Q

g

– Total
G
ate Charge (nC)  
T

J

– Junction Temperature (°C)  
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 71504  
S15-1873-Rev. D, 10-Aug-15  
3
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQ9945BEY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
100  
10  
1
0.25  
0.20  
0.15  
0.10  
0.05  
0
T
= 150 °C  
J
T
= 25 °C  
J
T
= 150 °C  
J
0.1  
0.01  
T
= 25 °C  
J
0.001  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
2
4
6
8
10  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

S
D

–
S
ource-to-Drain Voltage (V)  
Source Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.6  
0.3  
75  
72  
69  
66  
63  
60  
I
= 1 mA  
D
0
-0.3  
-0.6  
-0.9  
-1.2  
I
= 5 mA  
D
I
= 250 μA  
D
-50 -25  
0
25  
50  
75 100
 
125 150 175  
-50 -25  
0
25  
50  
75 100
 
125 150 175  
T

J

– Temperature (°C)  
T

J

– Junction Temperature (°C)  
Threshold Voltage  
Drain Source Breakdown vs. Junction Temperature  
I
Limited  
DM  
Limited by R  
*
DS(on)  
10  
1
100 µs  
1 ms  
10 ms  
100 ms  
1 s  
10 s, DC  
0.1  
T
C
= 25 °C  
Single Pulse  
BVDSS Limited  
0.01  
0.01  
0.1  
1
10  
100  
V

D
S

– Drain-to-
S
ource Voltage (V)  
* V

GS

> minimum V

GS

at which R

D
S
(on)

i
s s
pecified  
Safe Operating Area  
S15-1873-Rev. D, 10-Aug-15  
Document Number: 71504  
4
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQ9945BEY  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
2
1
D
u
ty Cycle = 0.5  
0.2  
Notes:  
0.1  
0.1  
P
DM  
0.05  
t
1
t
2
t
t
1
2
1. D
u
ty Cycle, D =  
0.02  
2. Per Unit Base = R  
= 112 °C/W  
thJA  
(t)  
3.
T

JM

–
T =
 
P  
Z
A
DM thJA  
Single P
u
lse  
4. S
u
rface Mo
u
nted  
0.01  
–
4  
10  
–
3  
10  
–
2  
10  
–
1  
10  
1
10  
100  
600  
Sq
u
are Wave P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
–
4  
10  
–
3  
10  
–
2  
10  
–
1  
10  
1
10  
Sq
u
are Wave P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Note  
•
The characteristics shown in the two graphs  
– Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)  
– Normalized Transient Thermal Impedance Junction-to-Foot (25 °C)  
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single  
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part  
mounted on printed circuit board – FR4, size 1″ x 1″ x 0.062″, double sided with 2 oz. copper, 100 % on both sides. The part capabilities  
can widely vary depending on actual application parameters and operating conditions.  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
S15-1873-Rev. D, 10-Aug-15  
Document Number: 71504  
5
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQ9945BEY  
Vishay Siliconix  
REVISION HISTORY

a  

REVISION  
DATE  
DESCRIPTION OF CHANGE  
D
04-Aug-15  
• Revised
 
R

g

minimum limit  
Note  
a. As
 
of April 2014  
S15-1873-Rev. D, 10-Aug-15  
Document Number: 71504  
6
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
S
OIC (NARROW): 8-LEAD  
JEDEC P
a
rt N
u
m
b
er: M
S
-012  
8
6
7
2
5
4
E
H
1
3
S
h x 45  
D
C
0.25 mm (G
a
ge Pl
a
ne)  
A
All Le
a
d
s  
0.101 mm  
q
e
B
A
1
L
0.004″  
MILLIMETERS  
Max  
INCHES  
DIM  
A
Min  
Min  
Max  
1.35  
0.10  
0.35  
0.19  
4.80  
3.80  
1.75  
0.20  
0.51  
0.25  
5.00  
4.00  
0.053  
0.004  
0.014  
0.0075  
0.189  
0.150  
0.069  
0.008  
0.020  
0.010  
0.196  
0.157  
A

1  

B
C
D
E
e
1.27 BSC  
0.050 BSC  
H
h
5.80  
0.25  
0.50  
0°  
6.20  
0.50  
0.93  
8°  
0.228  
0.010  
0.020  
0°  
0.244  
0.020  
0.037  
8°  
L
q
S
0.44  
0.64  
0.018  
0.026  
ECN: C-06527-Rev. I, 11-Sep-06  
DWG: 5498  
Document Number: 71192  
11-Sep-06  
1

Application Note 826  
Vishay Siliconix  
RECOMMENDED MINIMUM
P
A
DS FOR SO-8  
0.172  
(4.369)  
0.028  
(0.711)  
0.022  
0.050  
(0.559)  
(1.270)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
22  
Document Number: 72606  
Revision: 21-Jan-08  

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1