Vishay-Intertech-SQD50N04-4M5L-GE3

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Vishay-Intertech-SQD50N04-4M5L-GE3
SQD50N04-4m5L  
Vishay Siliconix  
Automotive N-Channel 40 V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
V

DS

(V)  
• TrenchFET

®

Power MOSFET  
• Package with Low Thermal Resistance  
• AEC-Q101 Qualified  
40  
R

DS(on)

(
) at V

GS

= 10 V  
R

DS(on)

(
) at V

GS

= 4.5 V  
0.0035  
0.0042  
50  
• 100 % R

g

and UIS Tested  
I

D

(A)  
• Material categorization:
 
For definitions of compliance please see  
Configuration  
Single  
TO-252  
D
G
Drain Connected to
T
a
b  
D
G
S
N-Channel MOSFET  
S
Top View  
ORDERING INFORMATION  
Package  
TO-252  
SQD50N04-4m5L-GE3  
Lead (Pb)-free and Halogen-free  
ABSOLUTE MAXIMUM RATINGS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
V

DS  

40  
V
Gate-Source Voltage  
V

GS  

20  
T

C

= 25 °C  
50  
Continuous Drain Current

a  

I

D  

T

C

= 125 °C  
50  
Continuous Source Current (Diode Conduction)

a  

Pulsed Drain Current

b  

I

S  

50  
A
I

DM  

I

AS  

E

AS  

200  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
55  
151  
L = 0.1 mH  
T

C

= 25 °C  
mJ  
W
136  
Maximum Power Dissipation

b  

P

D  

T

C

= 125 °C  
45  
Operating Junction and Storage Temperature Range  
T

J

, T

stg  

– 55 to + 175  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
R

thJA  

LIMIT  
50  
UNIT  
Junction-to-Ambient  
PCB Mount

c  

°C/W  
Junction-to-Case (Drain)  
R

thJC  

1.1  
Notes  
a. Package
 
limited.  
b. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
c. When
 
mounted on 1″ square PCB (FR-4 material).  
S12-2006-Rev. C, 20-Aug-12  
Document Number: 70623  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQD50N04-4m5L  
Vishay Siliconix  
SPECIFICATIONS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= 250 μA  
V

DS

= V

GS

, I

D

= 250 μA  
40  
1.5  
–
–
–
–
–
–
–
–
–
V
2.5  
V

DS

= 0 V, V

GS  

=
20 V  
100  
1
nA  
μA  
A
V

GS

= 0 V  
V

DS

= 40 V  
V

DS

= 40 V, T

J

= 125 °C  
V

DS

= 40 V, T

J

= 175 °C  
V

DS


5 V  
–
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

I

DSS  

V

GS

= 0 V  
V

GS

= 0 V  
V

GS

= 10 V  
–
50  
150  
–
–
I

D(on)  

50  
–
V
V

GS

= 10 V  

GS

= 10 V  
I

D

= 20 A  
0.0030 0.0035  
I

D

= 20 A, T

J

= 125 °C  
I

D

= 20 A, T

J

= 175 °C  
I

D

= 20 A  
–
–
–
0.0056  
0.0068  
Drain-Source On-State Resistance

a  

R

DS(on)  

V

GS

= 10 V  
V

GS

= 4.5 V  
–
–
0.0035 0.0042  
Forward Transconductance

b  

Dynamic

b  

g

fs  

V

DS

= 15 V, I

D

= 15 A  
–
105  
–
S
Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
Total Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
Turn-On Delay Time

c  

Rise Time

c  

Turn-Off Delay Time

c  

Fall Time

c  

C

iss  

C

oss  

C

rss  

Q

g  

–
–
–
–
–
–
1
–
–
–
–
4880  
560  
250  
85  
14  
14  
2
5860  
670  
300  
130  
–
V

GS

= 0 V  
V

DS

= 25 V, f = 1 MHz  
pF  
Q

gs  

Q

gd  

R

g  

V

GS

= 10 V  
V

DS

= 20 V, I

D

= 50 A  
f = 1 MHz  
nC  
–
3
t

d(on)  

t

r  

t

d(off)  

t

f  

9
11  
14  
47  
14  
11  
39  
11  
V

DD

= 20 V, R

L

= 0.4
  
I

D

50 A, V

GEN

= 10 V, R

g

= 1
  
ns  
Source-Drain Diode Ratings and Characteristics

b  

Pulsed Current

a  

I

SM  

–
–
–
200  
1.5  
A
V
Forward Voltage  
V

SD  

I

F

= 30 A, V

GS

= 0 V  
0.9  
Notes  
a. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
b. Guaranteed
 
by design, not subject to production testing.  
c. Independent
 
of operating temperature.
  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
S12-2006-Rev. C, 20-Aug-12  
Document Number: 70623  
2
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQD50N04-4m5L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
V
= 10 V thru 4 V  
GS  
T
= 25 °C  
C
V
= 3 V  
GS  
T
= 125 °C  
C
T
= – 55 °C  
4
C
0
3
6
9
12  
15  
0
1
2
3
5
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Transfer Characteristics  
Output Characteristics  
300  
240  
180  
120  
60  
0.010  
0.008  
0.006  
0.004  
0.002  
0.000  
T
= – 55 °C  
C
T
= 25 °C  
C
V
= 4.5 V  
GS  
T
= 125 °C  
C
V
= 10 V  
40  
GS  
0
0
14  
28  
42  
56  
70  
0
20  
60  
80  
100  
I
– Drain Current (A)  
I

D

– Drain Current (A)  
D
On-Resistance vs. Drain Current  
Transconductance  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
10  
8
I
= 50 A  
D
C
i
ss  
6
V
= 20 V  
D
S  
4
C
o
ss  
2
C
r
ss  
0
0
10  
20  
30  
40  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Q

g

– Total
G
ate Charge (nC)  
Gate Charge  
Capacitance  
S12-2006-Rev. C, 20-Aug-12  
Document Number: 70623  
3
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQD50N04-4m5L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
2.3  
2.0  
1.7  
1.4  
1.1  
0.8  
0.5  
52  
50  
48  
46  
44  
42  
40  
I
= 10 mA  
D
I
= 20 A  
D
V
= 10 V  
GS  
V
= 4.5 V  
GS  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
T

J

– Junction Temperature (°C)  
T

J

– Junction Temperature (°C)  
Drain Source Breakdown vs. Junction Temperature  
0.030  
On-Resistance vs. Junction Temperature  
100  
10  
0.024  
0.018  
0.012  
0.006  
0.000  
T
= 150 °C  
J
1
T
= 25 °C  
J
0.1  
0.01  
T
= 150 °C  
J
T
= 25 °C  
J
0.001  
0
2
4
6
8
10  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

S
D

–
S
ource-to-Drain Voltage (V)  
On-Resistance vs. Gate-to-Source Voltage  
Source Drain Diode Forward Voltage  
0.7  
0.2  
– 0.3  
– 0.8  
– 1.3  
I
= 5 mA  
D
I
= 250 μA  
D
– 1.8  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
T

J

– Temperature (°C)  
Threshold Voltage  
S12-2006-Rev. C, 20-Aug-12  
Document Number: 70623  
4
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQD50N04-4m5L  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
I
Limited  
DM  
100  
10  
Limited by R  
*
D
S
(on)  
100 μ
s
 
I
Limited  
D
1 m
s  
10 m
s  
100 m
s
, 1
s
, 10
s
, DC  
1
0.1  
T
C
= 25 °C  
S
ingle Pul
s
e  
BVD
SS
Limited  
0.01  
0.01  
0.1  
1
10  
100  
V

D
S

– Drain-to-
S
ource Voltage (V)  
* V

GS

> minimum V

GS

at which R

D
S
(on)

i
s s
pecified  
Safe Operating Area  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
1000  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
S12-2006-Rev. C, 20-Aug-12  
Document Number: 70623  
5
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQD50N04-4m5L  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
Note  
•
The characteristics shown in the two graphs
  
– Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
  
– Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
  
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single  
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part  
mounted on printed circuit board – FR4, size 1″ x 1″ x 0.062″, double sided with 2 oz. copper, 100 % on both sides. The part capabilities  
can widely vary depending on actual application parameters and operating conditions.  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
S12-2006-Rev. C, 20-Aug-12  
Document Number: 70623  
6
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
TO-252AA Case Outline  
E
A
MILLIMETERS  
INCHES  
MAX.  
C2  
b3  
DIM.  
A
MIN.  
MAX.  
2.38  
0.127  
0.88  
1.14  
5.46  
0.61  
0.89  
6.22  
–
MIN.  
0.086  
–
2.18  
–
0.094  
0.005  
0.035  
0.045  
0.215  
0.024  
0.035  
0.245  
–
A1  
b
0.64  
0.76  
4.95  
0.46  
0.46  
5.97  
4.10  
6.35  
4.32  
9.40  
0.025  
0.030  
0.195  
0.018  
0.018  
0.235  
0.161  
0.250  
0.170  
0.370  
b2  
b3  
C
C2  
D
D1  
E
6.73  
–
0.265  
–
E1  
H
b
C
b2  
e
10.41  
0.410  
A1  
e1  
e
2.28 BSC  
4.56 BSC  
1.40  
0.090 BSC  
0.180 BSC  
e1  
L
1.78  
1.27  
1.02  
1.52  
0.055  
0.070  
0.050  
0.040  
0.060  
L3  
L4  
L5  
0.89  
–
0.035  
–
1.01  
0.040  
ECN: T13-0592-Rev. A, 02-Sep-13
 
DWG: 6019  
E1  
Note  
Dimension L3 is for reference only.  
•
Revision: 02-Sep-13  
Document Number: 64424  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Application Note 826  
Vishay Siliconix  
RECOMMENDED MINIMUM
P
A
DS FOR D
P
A
K (TO-252)  
0.224  
(5.690)  
0.180  
0.055  
(1.397)  
(4.572)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
Document Number: 72594  
Revision: 21-Jan-08  
3

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1