Vishay-Intertech-SQJ402EP-T1-GE3

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Vishay-Intertech-SQJ402EP-T1-GE3
SQJ402EP  
Vishay Siliconix  
Automotive N-Channel 100 V (D-S) 175 °C MOSFET  
FEATURES  
• TrenchFET

®

Power MOSFET  
• AEC-Q101 Qualified

d  

PRODUCT SUMMARY  
V

DS

(V)  
100  
0.0110  
0.0140  
32  
• 100 % R

g

and UIS Tested  
• Material categorization:  
For definitions of compliance please see  
R

DS(on)

(
) at V

GS

= 10 V  
R

DS(on)

(
) at V

GS

= 4.5 V  
I

D

(A)  
Configuration  
Single  
D
PowerPAK

®

SO-8L Single  
G
D
4
G
3
S
S
N-Channel MOSFET  
2
S
1
S
ORDERING INFORMATION  
Package  
PowerPAK SO-8L  
SQJ402EP-T1-GE3  
Lead (Pb)-free and Halogen-free  
ABSOLUTE MAXIMUM RATINGS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
V

DS  

100  
V
V

GS  

20  
T

C

= 25 °C  
32  
Continuous Drain Current

a  

I

D  

T

C

= 125 °C  
32  
Continuous Source Current (Diode Conduction)

a  

Pulsed Drain Current

b  

I

S  

32  
A
I

DM  

I

AS  

E

AS  

75  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
31  
L = 0.1 mH  
48  
mJ  
W
T

C

= 25 °C  
83  
27  
Maximum Power Dissipation

b  

P

D  

T

C

= 125 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)

e, f  

T

J

, T

stg  

– 55 to + 175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
R

thJA  

LIMIT  
65  
UNIT  
Junction-to-Ambient  
PCB Mount

c  

°C/W  
Junction-to-Case (Drain)  
R

thJC  

1.8  
Notes  
a. Package
 
limited.  
b. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
c. When
 
mounted on 1″ square PCB (FR-4 material).  
d. Parametric
 
verification ongoing.  
e. See
 
solder profile (

). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
f. Rework
 
conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S13-1414-Rev. B, 24-Jun-13  
Document Number: 67997  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQJ402EP  
Vishay Siliconix  
SPECIFICATIONS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= 250 μA  
V

DS

= V

GS

, I

D

= 250 μA  
100  
–
2.0  
–
–
V
1.5  
–
2.5  
V

DS

= 0 V, V

GS  

=
20 V  
100  
1
nA  
μA  
A
V

GS

= 0 V  
V

GS

= 0 V  
V

GS

= 0 V  
V

GS

= 10 V  
V

DS

= 100 V  
V

DS

= 100 V, T

J

= 125 °C  
V

DS

= 100 V, T

J

= 175 °C  
V

DS


5 V  
–
–
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

I

DSS  

–
–
50  
150  
–
–
–
I

D(on)  

30  
–
–
V
V

GS

= 10 V  

GS

= 10 V  
I

D

= 10.7 A  
0.0090 0.0110  
I

D

= 10.7 A, T

J

= 125 °C  
I

D

= 10.7 A, T

J

= 175 °C  
I

D

= 9.5 A  
–
–
–
0.0170  
0.0210  
Drain-Source On-State Resistance

a  

R

DS(on)  

V

GS

= 10 V  
V

GS

= 4.5 V  
–
–
0.0115 0.0140  
Forward Transconductance

b  

Dynamic

b  

g

fs  

V

DS

= 15 V, I

D

= 10.7 A  
–
54  
–
S
Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
Total Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
Turn-On Delay Time

c  

Rise Time

c  

Turn-Off Delay Time

c  

Fall Time

c  

C

iss  

C

oss  

C

rss  

Q

g  

–
1829  
722  
62  
2286  
903  
78  
51  
–
V

GS

= 0 V  
V

DS

= 25 V, f = 1 MHz  
–
pF  
–
–
34  
Q

gs  

Q

gd  

R

g  

V

GS

= 10 V  
V

DS

= 50 V, I

D

= 10 A  
f = 1 MHz  
–
6
nC  
–
13  
–
0.65  
1.39  
10  
2
t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
15  
15  
40  
11  
10  
V

DD

= 50 V, R

L

= 5
  
I

D

10 A, V

GEN

= 10 V, R

g

= 1
  
ns  
27  
7
Source-Drain Diode Ratings and Characteristics

b  

Pulsed Current

a  

I

SM  

–
–
–
75  
A
V
Forward Voltage  
V

SD  

I

F

= 7 A, V

GS

= 0 V  
0.77  
1.2  
Notes  
g. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
h. Guaranteed
 
by design, not subject to production testing.  
i. Independent
 
of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
S13-1414-Rev. B, 24-Jun-13  
Document Number: 67997  
2
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQJ402EP  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
80  
64  
48  
32  
16  
0
80  
64  
48  
32  
16  
0
V

GS

= 10 V thru 7 V  
V

GS

= 4 V  
T

C

= 25
°
C  
T

C

= 125
°
C  
V

GS

= 3 V  
T

C

= – 55
°
C  
0
2
4
6
8
10  
0
0
0
3
6
9
12  
15  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Output Characteristics  
Transfer Characteristics  
100  
80  
60  
40  
20  
0
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
T

C

= – 55
°
C  
T

C

= 25
°
C  
T

C

= 125
°
C  
T

C

= 25
°
C  
T

C

= 125
°
C  
T

C

= – 55
°
C  
5
10  
15  
20  
25  
0
1
2
3
4
5
I

D

– Drain Current (A)  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
Transconductance  
Transfer Characteristics  
4000  
3200  
2400  
1600  
800  
0.025  
0.020  
0.015  
0.010  
0.005  
0.000  
V

GS

= 4.5 V  
C

i
ss  

C

o
ss  

V

GS

= 10 V  
C

r
ss  

0
20  
40  
60  
80  
100  
0
16  
32  
48  
64  
80  
V

D
S

– Drain-to-
S
ource Voltage (V)  
I

D

– Drain Current (A)  
Capacitance  
On-Resistance vs. Drain Current  
S13-1414-Rev. B, 24-Jun-13  
Document Number: 67997  
3
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQJ402EP  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
100  
10  
8
I

D

= 10 A  
10  
V

D
S

= 50 V  
T

J

= 150
°
C  
1
6
0.1  
4
T

J

= 25
°
C  
0.01  
0.001  
2
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
8
16  
24  
32  
40  
V

S
D

–
S
ource-to-Drain Voltage (V)  
Q

g

– Total
G
ate Charge (nC)  
Gate Charge  
Source Drain Diode Forward Voltage  
2.5  
2.0  
1.5  
1.0  
0.5  
0.5  
0.1  
V

GS

= 10 V  
I

D

= 20 A  
I

D

= 5 mA  
– 0.3  
– 0.7  
– 1.1  
– 1.5  
I

D

= 250 μA  
V

GS

= 4.5 V  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
T

J

– Junction Temperature (
°
C)  
T

J

– Temperature (
°
C)  
On-Resistance vs. Junction Temperature  
Threshold Voltage  
0.05  
0.04  
0.03  
0.02  
0.01  
0.00  
125  
120  
115  
110  
105  
100  
I

D

= 1 mA  
T

J

= 25
°
C  
T

J

= 150
°
C  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
0
2
4
6
8
10  
T

J

– Junction Temperature (
°
C)  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
On-Resistance vs. Gate-to-Source Voltage  
Drain Source Breakdown vs. Junction Temperature  
S13-1414-Rev. B, 24-Jun-13  
Document Number: 67997  
4
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQJ402EP  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
100  
I

DM

Limited  
100 μ
s  
10  
I

D

Limited  
1 m
s  
10 m
s  
1
100 m
s  
1
s
, 10
s
, DC  
Limited by R

D
S
(on)  

*
0.1  
BVD
SS
Limited  
T

C

= 25
°
C  
S
ingle Pul
s
e  
0.01  
0.01  
0.1  
1
10  
100  
1000  
V

D
S

– Drain-to-
S
ource Voltage (V)  
* V

GS

> minimum V

GS

at which R

D
S
(on)

i
s s
pecified  
Safe Operating Area  
1
Duty Cycle = 0.5  
0.2  
Notes:  
P
DM  
0.1  
0.1  
t
0.05  
1
t
2
t
t
1
2
1. Duty Cycle, D =  
0.02  
2. Per Unit Base = R  
= 65 °C/W  
thJA  
(t)  
Z
Single Pulse  
3.
T

JM

–
T =
 
P  
A
DM thJA  
4. Surface Mounted  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
S13-1414-Rev. B, 24-Jun-13  
Document Number: 67997  
5
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQJ402EP  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
Single Pulse  
0.02  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
Note  
•
The characteristics shown in the two graphs  
– Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)  
– Normalized Transient Thermal Impedance Junction-to-Case (25 °C)  
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single  
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part  
mounted on printed circuit board – FR4, size 1″ x 1″ x 0.062″, double sided with 2 oz. copper, 100 % on both sides. The part capabilities  
can widely vary depending on actual application parameters and operating conditions.  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
S13-1414-Rev. B, 24-Jun-13  
Document Number: 67997  
6
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Ordering Information  
Vishay Siliconix  
PowerPAK

®

SO-8L  
Ordering codes for the SQ rugged series power MOSFETs in the PowerPAK SO-8L package:  
DATASHEET PART NUMBER  
SQJ200EP  
SQJ202EP  
SQJ401EP  
SQJ402EP  
SQJ403EEP  
SQJ403EP  
SQJ410EP  
SQJ412EP  
SQJ416EP  
SQJ418EP  
SQJ422EP  
SQJ423EP  
SQJ431EP  
SQJ443EP  
SQJ444EP  
SQJ446EP  
SQJ456EP  
SQJ457EP  
SQJ459EP  
SQJ460AEP  
SQJ461EP  
SQJ463EP  
SQJ465EP  
SQJ469EP  
SQJ474EP  
SQJ476EP  
SQJ479EP  
SQJ486EP  
SQJ488EP  
SQJ500AEP  
SQJ840EP  
SQJ844AEP  
SQJ850EP  
SQJ858AEP  
SQJ868EP  
SQJ886EP  
SQJ910AEP  
SQJ912AEP  
SQJ940EP  
SQJ942EP  
SQJ951EP  
SQJ952EP  
SQJ956EP  
SQJ960EP  
SQJ963EP  
SQJ968EP  
SQJ980AEP  
SQJ992EP  
OLD ORDERING CODE

a  

NEW ORDERING CODE  
SQJ200EP-T1_GE3  
SQJ202EP-T1_GE3  
SQJ401EP-T1_GE3  
SQJ402EP-T1_GE3  
SQJ403EEP-T1_GE3  
SQJ403EP-T1_GE3  
SQJ410EP-T1_GE3  
SQJ412EP-T1_GE3  
SQJ416EP-T1_GE3  
SQJ418EP-T1_GE3  
SQJ422EP-T1_GE3  
SQJ423EP-T1_GE3  
SQJ431EP-T1_GE3  
SQJ443EP-T1_GE3  
SQJ444EP-T1_GE3  
SQJ446EP-T1_GE3  
SQJ456EP-T1_GE3  
SQJ457EP-T1_GE3  
SQJ459EP-T1_GE3  
SQJ460AEP-T1_GE3  
SQJ461EP-T1_GE3  
SQJ463EP-T1_GE3  
SQJ465EP-T1_GE3  
SQJ469EP-T1_GE3  
SQJ474EP-T1_GE3  
SQJ476EP-T1_GE3  
SQJ479EP-T1_GE3  
SQJ486EP-T1_GE3  
SQJ488EP-T1_GE3  
SQJ500AEP-T1_GE3  
SQJ840EP-T1_GE3  
SQJ844AEP-T1_GE3  
SQJ850EP-T1_GE3  
SQJ858AEP-T1_GE3  
SQJ868EP-T1_GE3  
SQJ886EP-T1_GE3  
SQJ910AEP-T1_GE3  
SQJ912AEP-T1_GE3  
SQJ940EP-T1_GE3  
SQJ942EP-T1_GE3  
SQJ951EP-T1_GE3  
SQJ952EP-T1_GE3  
SQJ956EP-T1_GE3  
SQJ960EP-T1_GE3  
SQJ963EP-T1_GE3  
SQJ968EP-T1_GE3  
SQJ980AEP-T1_GE3  
SQJ992EP-T1_GE3  
–
–
SQJ401EP-T1-GE3  
SQJ402EP-T1-GE3  
SQJ403EEP-T1-GE3  
–
SQJ410EP-T1-GE3  
SQJ412EP-T1-GE3  
–
–
SQJ422EP-T1-GE3  
–
SQJ431EP-T1-GE3  
SQJ443EP-T1-GE3  
–
–
SQJ456EP-T1-GE3  
–
–
–
SQJ461EP-T1-GE3  
SQJ463EP-T1-GE3  
SQJ465EP-T1-GE3  
SQJ469EP-T1-GE3  
–
–
–
SQJ486EP-T1-GE3  
SQJ488EP-T1-GE3  
SQJ500AEP-T1-GE3  
SQJ840EP-T1-GE3  
SQJ844AEP-T1-GE3  
SQJ850EP-T1-GE3  
SQJ858AEP-T1-GE3  
–
SQJ886EP-T1-GE3  
SQJ910AEP-T1-GE3  
SQJ912AEP-T1-GE3  
SQJ940EP-T1-GE3  
SQJ942EP-T1-GE3  
SQJ951EP-T1-GE3  
–
SQJ956EP-T1-GE3  
SQJ960EP-T1-GE3  
SQJ963EP-T1-GE3  
SQJ968EP-T1-GE3  
SQJ980AEP-T1-GE3  
SQJ992EP-T1-GE3  
Note  
a. Old
 
ordering code is obsolete and no longer valid for new orders  
Revision: 01-Jul-16  
Document Number: 65804  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
PowerPAK

®

SO-8L Case Outline  
for Al Parts  
Revision: 07-Sep-15  
Document Number: 66934  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
MILLIMETERS  
NOM.  
1.07  
–
INCHES  
DIM.  
MIN.  
1.00  
0.00  
0.33  
0.44  
4.80  
MAX.  
1.14  
0.127  
0.48  
0.58  
5.00  
MIN.  
0.039  
0.00  
NOM.  
0.042  
–
MAX.  
0.045  
0.005  
0.019  
0.023  
0.197  
A
A1  
b
0.41  
0.51  
4.90  
0.094  
0.47  
0.25  
5.13  
4.90  
3.96  
1.73  
1.27 BSC  
6.15  
4.37  
2.85  
–
0.013  
0.017  
0.189  
0.016  
0.020  
0.193  
0.004  
0.019  
0.010  
0.202  
0.193  
0.156  
0.068  
0.050 BSC  
0.242  
0.172  
0.112  
–
b1  
b2  
b3  
b4  
c
0.20  
5.00  
4.80  
3.86  
1.63  
0.30  
5.25  
5.00  
4.06  
1.83  
0.008  
0.197  
0.189  
0.152  
0.064  
0.012  
0.207  
0.197  
0.160  
0.072  
D
D1  
D2  
D3  
e
E
6.05  
4.27  
2.75  
–
6.25  
4.47  
2.95  
0.15  
0.82  
1.22  
0.238  
0.168  
0.108  
–
0.246  
0.176  
0.116  
0.006  
0.032  
0.048  
E1  
E2  
F
L
0.62  
0.92  
0.72  
1.07  
0.51  
0.23  
0.41  
2.82  
2.96  
–
0.024  
0.036  
0.028  
0.042  
0.020  
0.009  
0.016  
0.111  
0.117  
–
L1  
K
W
W1  
W2  
W3  
q
0°  
10°  
0°  
10°  
ECN: C15-1203-Rev. A, 07-Sep-15  
DWG: 6044  
Note  
•
Millimeters will gover  
Revision: 07-Sep-15  
Document Number: 66934  
2
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

PAD Pattern  
Vishay Siliconix  
RECOMMENDED MINIMUM PAD FOR PowerPAK

®

SO-8L SINGLE  
5.000  
(0.197)  
0.510  
(0.020)  
4.061  
(0.160)  
3.630  
(0.143)  
0.595  
(0.023)  
0.610  
(0.024)  
0.710  
(0.028)  
2.715  
(0.107)  
0.860  
(0.034)  
0.410  
(0.016)  
0.820  
(0.032)  
1.905  
1.270  
(0.075)  
(0.050)  
7.250  
(0.285)  
Recommended Minimum Pad
s
 
Dimen
s
ion
s
in mm (inche
s
)  
Revision: 07-Feb-12  
Document Number: 63818  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Legal Disclaimer Notice  
Vishay  
Disclaimer  
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time. All
 
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
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