Vishay-Intertech-SQM120P06-07L-GE3

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Vishay-Intertech-SQM120P06-07L-GE3
SQM120P06-07L  
Vishay Siliconix  
Automotive P-Channel 60 V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
V

DS

(V)  
• TrenchFET

®

Power MOSFET  
• Package with Low Thermal Resistance  
• 100 % R

g

and UIS Tested  
– 60  
R

DS(on)

(
) at V

GS

= – 10 V  
R

DS(on)

(
) at V

GS

= – 4.5 V  
0.0067  
0.0088  
– 120  
• AEC-Q101 Qualified

d  

I

D

(A)  
• Material categorization:
 
For definitions of compliance please see  
Configuration  
Single  
TO-263  
S
G
G
D
S
D
P-Channel MOSFET  
Top View  
ORDERING INFORMATION  
Package  
TO-263  
SQM120P06-07L-GE3  
Lead (Pb)-free and Halogen-free  
ABSOLUTE MAXIMUM RATINGS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
V

DS  

– 60  
V
Gate-Source Voltage  
V

GS  

20  
– 120  
– 98  
T

C

= 25 °C

a  

T

C

= 125 °C  
Continuous Drain Current

a  

I

D  

Continuous Source Current (Diode Conduction)

a  

Pulsed Drain Current

b  

I

S  

– 120  
– 480  
– 80  
A
I

DM  

I

AS  

E

AS  

Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
T

C

= 25 °C  
320  
mJ  
W
375  
Maximum Power Dissipation

b  

P

D  

T

C

= 125 °C  
125  
Operating Junction and Storage Temperature Range  
T

J

, T

stg  

– 55 to + 175  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
R

thJA  

LIMIT  
40  
UNIT  
Junction-to-Ambient  
PCB Mount

c  

°C/W  
Junction-to-Case (Drain)  
R

thJC  

0.40  
Notes  
a. Package
 
limited.  
b. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
c. When
 
mounted on 1″ square PCB (FR-4 material).  
d. Parametric
 
verification ongoing.  
S12-1847-Rev. B, 30-Jul-12  
Document Number: 67026  
1
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQM120P06-07L  
Vishay Siliconix  
SPECIFICATIONS
(T

C

= 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

DS  

V

GS(th)  

I

GSS  

V

GS

= 0 V, I

D

= – 250 μA  
V

DS

= V

GS

, I

D

= – 250 μA  
– 60  
–
–
V
– 1.5  
– 2.0  
– 2.5  
V

DS

= 0 V, V

GS  

=
20 V  
–
–
–
–
–
–
100  
– 1  
nA  
μA  
A
V

GS

= 0 V  
V

GS

= 0 V  
V

DS

= – 60 V  
V

DS

= – 60 V, T

J

= 125 °C  
V

DS

= – 60 V, T

J

= 175 °C  
V

DS


– 5 V  
–
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

I

DSS  

–
– 50  
– 250  
–
V

GS

= 0 V  
–
I

D(on)  

V

GS

= – 10 V  
– 120  
V

GS

= – 10 V  

GS

= – 10 V  
I

D

= – 30 A  
–
–
–
–
–
0.0056 0.0067  
V
I

D

= – 30 A, T

J

= 125 °C  
I

D

= – 30 A, T

J

= 175 °C  
I

D

= – 20 A  
–
–
0.0110  
0.0130  
Drain-Source On-State Resistance

a  

R

DS(on)  

V

GS

= – 10 V  
V

GS

= – 4.5 V  
0.0070 0.0088  
90  
Forward Transconductance

b  

Dynamic

b  

g

fs  

V

DS

= – 15 V, I

D

= – 30 A  
–
S
Input Capacitance  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
Total Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
Turn-On Delay Time

c  

Rise Time

c  

Turn-Off Delay Time

c  

Fall Time

c  

C

iss  

C

oss  

C

rss  

Q

g  

–
–
11 423
 
14 280  
V

GS

= 0 V  
V

DS

= – 25 V, f = 1 MHz  
1034  
809  
180  
31  
1295  
1015  
270  
–
pF  
–
–
Q

gs  

Q

gd  

R

g  

V

GS

= – 10 V
 
V

DS

= – 30 V, I

D

= – 110 A  
–
nC  
–
43  
–
f = 1 MHz  
1.1  
–
2.27  
15  
3.5  
23  
t

d(on)  

t

r  

t

d(off)  

t

f  

–
23  
35  
V

DD

= – 30 V, R

L

= 0.27
  
I

D

– 110 A, V

GEN

= – 10 V, R

g

= 1
  
ns  
–
97  
146  
48  
–
32  
Source-Drain Diode Ratings and Characteristics

b  

Pulsed Current

a  

I

SM  

–
–
–
– 480  
– 1.5  
A
V
Forward Voltage  
V

SD  

I

F

= – 100 A, V

GS

= 0 V  
– 0.95  
Notes  
a. Pulse
 
test; pulse width
300 μs, duty cycle
2 %.  
b. Guaranteed
 
by design, not subject to production testing.  
c. Independent
 
of operating temperature.
  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.
 
S12-1847-Rev. B, 30-Jul-12  
Document Number: 67026  
2
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQM120P06-07L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
150  
120  
90  
60  
30  
0
200  
160  
120  
80  
V
= 10 V thru 5 V  
GS  
V
= 4 V  
GS  
T
= 25 °C  
C
40  
T
= 125 °C  
V
= 3 V  
C
GS  
T
= – 55 °C  
4
C
0
0
1
2
3
5
0
0
0
3
6
9
12  
15  
80  
60  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Output Characteristics  
Transfer Characteristics  
200  
160  
120  
80  
0.020  
0.016  
0.012  
0.008  
0.004  
0
T
= – 55 °C  
C
T
= 25 °C  
C
V
= 4.5 V  
GS  
V
= 10 V  
GS  
T
= 125 °C  
C
40  
0
16  
32  
48  
64  
0
20  
40  
60  
80  
100  
120  
I
– Drain Current (A)  
D
I

D

– Drain Current (A)  
On-Resistance vs. Drain Current  
Transconductance  
15 000  
12 500  
10 000  
7500  
5000  
2500  
0
10  
8
I
= 110 A  
D
C
i
ss  
V
= 30 V  
D
S  
6
4
2
C
o
ss  
C
r
ss  
0
10  
20  
30  
40  
50  
0
20 40 60 80
 
100 120 140 160 180 200  
V

D
S

– Drain-to-
S
ource Voltage (V)  
Q

g

– Total
G
ate Charge (nC)  
Capacitance  
Gate Charge  
S12-1847-Rev. B, 30-Jul-12  
Document Number: 67026  
3
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQM120P06-07L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
(T

A

= 25 °C, unless otherwise noted)  
2.0  
1.7  
1.4  
1.1  
0.8  
0.5  
100  
I
= 30 A  
D
10  
V
= 10 V  
GS  
T
= 150 °C  
J
1
T
= 25 °C  
J
0.1  
0.01  
0.001  
– 50
 
– 25  
0
T

J

– Junction Temperature (°C)  
On-Resistance vs. Junction Temperature  
25  
50  
75 100
 
125 150 175  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V

S
D

–
S
ource-to-Drain Voltage (V)  
Source Drain Diode Forward Voltage  
1.2  
0.9  
0.05  
0.04  
0.03  
0.02  
0.01  
0
I
= 250 μA  
D
0.6  
I
= 5 mA  
D
0.3  
0
T
= 150 °C  
J
– 0.3  
– 0.6  
T
= 25 °C  
8
J
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
0
2
4
6
10  
T

J

– Temperature (°C)  
V

GS

–
G
ate-to-
S
ource Voltage (V)  
On-Resistance vs. Gate-to-Source Voltage  
Threshold Voltage  
– 60  
I
= 10 mA  
D
– 64  
– 68  
– 72  
– 76  
– 80  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
T
J
– Junction
T
e
mperature (°C)  
Drain Source Breakdown vs. Junction Temperature  
S12-1847-Rev. B, 30-Jul-12  
Document Number: 67026  
4
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQM120P06-07L  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
I
Limited  
DM  
1000  
100  
10  
Limited by  
DS(on)
*  
100 µs  
R
I
D
Limited  
1 ms  
10 ms  
100 ms, 1 s, 10 s, DC  
1
0.1  
T
= 25 °C  
C
Single Pulse  
BVDSS Limited  
0.01  
0.01  
0.1  
1
10  
100  
V
DS  
– Drain-to-Source Voltage (V)  
Safe Operating Area  
1
0.1  
0.01  
0.001  
0.0001  
10

-4  

10

-3  

10

-2  

10

-1  

1
10  
100  
1000  
Sq
uare Wave Pul
s
e Duration (
s
)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
S12-1847-Rev. B, 30-Jul-12  
Document Number: 67026  
5
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

SQM120P06-07L  
Vishay Siliconix  
THERMAL RATINGS
(T

A

= 25 °C, unless otherwise noted)  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-3  
-2  
-1  
-4  
10  
10  
10  
1
10  
Sq
u
are Wave P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
Note  
•
The characteristics shown in the two graphs
  
– Normalized Transient Thermal Impedance Junction to Ambient (25 °C)
  
– Normalized Transient Thermal Impedance Junction to Case (25 °C)
  
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single  
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part  
mounted on printed circuit board – FR4, size 1″ x 1″ x 0.062″, double sided with 2 oz. copper, 100 % on both sides. The part capabilities  
can widely vary depending on actual application parameters and operating conditions.  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see

.  
S12-1847-Rev. B, 30-Jul-12  
Document Number: 67026  
6
For technical questions, contact:

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Package Information  
Vishay Siliconix  
TO-263 (D

2

PAK): 3-LEAD  
-B-  
A
E
c2  
6
E1  
K
-A-  
E3  
A
e
A
b2  
b
c
Detail “A”  
E2  
M
M
A
0.010  
PL  
2
INCHES  
MIN.  
MILLIMETERS  
MIN.  
DIM.  
A
MAX.  
0.190  
0.039  
0.035  
0.055  
0.018  
0.028  
0.017  
0.027  
0.055  
0.380  
0.240  
0.042  
0.055  
0.052  
0.410  
–
MAX.  
4.826  
0.990  
0.889  
1.397  
0.457  
0.711  
0.431  
0.685  
1.397  
9.652  
6.096  
1.067  
1.397  
1.321  
10.414  
–
0° – 5°  
0.160  
0.020  
0.020  
0.045  
0.013  
0.023  
0.013  
0.023  
0.045  
0.340  
0.220  
0.038  
0.045  
0.044  
0.380  
0.245  
0.355  
0.072  
4.064  
0.508  
0.508  
1.143  
0.330  
0.584  
0.330  
0.584  
1.143  
8.636  
5.588  
0.965  
1.143  
1.118  
9.652  
6.223  
9.017  
1.829  
b
L1  
b1  
b2  
DE
T
A
IL A (RO
T
A
T
ED 90°)  
Thin lead  
c*  
Thick lead  
Thin lead  
b
c1  
Thick lead  
b1  
c2  
D
D1  
D2  
D3  
D4  
E
S
ECTION A-A  
E1  
E2  
E3  
e
0.375  
0.078  
9.525  
1.981  
0.100 BSC  
2.54 BSC  
K
0.045  
0.575  
0.090  
0.040  
0.050  
0.055  
0.625  
0.110  
0.055  
0.070  
1.143  
14.605  
2.286  
1.016  
1.270  
1.397  
15.875  
2.794  
1.397  
1.778  
L
Notes  
1. Plane B includes maximum features of heat sink tab and plastic.  
2. No more than 25 % of L1 can fall above seating plane by  
max. 8
 
mils.  
3. Pin-to-pin coplanarity max. 4 mils.  
4. *: Thin lead is for SUB, SYB.  
L1  
L2  
L3  
L4  
M
0.010 BSC  
0.254 BSC  
–
0.002  
–
0.050  
Thick lead is for SUM, SYM, SQM.  
5. Use inches as the primary measurement.  
6. This feature is for thick lead.  
ECN: T13-0707-Rev. K, 30-Sep-13  
DWG: 5843  
Revison: 30-Sep-13  
Document Number: 71198  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

AN826  
Vishay Siliconix  
2
RECOMMENDED MINIMUM PADS FOR D PAK:
 
3-Lead  
0.420  
(10.668)  
0.145  
(3.683)  
0.135  
(3.429)  
0.200  
0.050  
(5.080)  
(1.257)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
Document Number:
 
73397  
11-Apr-05  
1

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1