Vishay-Intertech-SUM65N20-30-E3

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Vishay-Intertech-SUM65N20-30-E3
SUM65N20-30  
Vishay Siliconix  
N-Channel 200-V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
•
•
•
TrenchFET

®

Power MOSFET  
175 °C Junction Temperature  
V

(BR)DSS

(V)  
r

DS(on)

(
Ω
)  
I

D

(A)  
65

a  

RoHS  
0.030 at V

GS

= 10 V  
200  
COMPLIANT  
Low Thermal Resistance Package  
100 % R

g

Tested  
APPLICATIONS  
•
Isolated DC/DC Converters  
D
TO-263  
G
G
D S  
Top View  
S
Ordering Information:
SUM65N20-30-E3 (Lead (Pb)-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS
T =
 
25 °C, unless otherwise noted  
C
Parameter  
Symbol  
Limit  
200  
20  
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

65

a  

T

C

= 25 °C  
Continuous Drain Current (T

J

= 175 °C)  
I

D  

37

a  

140  
35  
T

C

= 125 °C  
A
I

DM  

I

AS  

Pulsed Drain Current  
Avalanche Current  
Single Pulse Avalanche Energy

b  

L = 0.1 mH  
T

C

= 25 °C  
E

AS  

61  
mJ  
W
375

c  

3.75  
Maximum Power Dissipation

b  

P

D  

T

A

= 25 °C

d  

T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 175  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Limit  
40  
Unit  
PCB Mount (TO-263)

d  

R

thJA  

Junction-to-Ambient  
°C/W  
R

thJC  

Junction-to-Case (Drain)  
0.4  
Notes:  
a. Package limited.  
b. Duty cycle
≤
1 %.  
c. See SOA curve for voltage derating.  
d. When Mounted on 1″ square PCB (FR-4 material).  
Document Number: 71702  
S-80272-Rev. D, 11-Feb-08  
1

SUM65N20-30  
Vishay Siliconix  
SPECIFICATIONS
T =
 
25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

(BR)DSS  

V

GS(th)  

I

GSS  

V

DS

= 0
V
,
I

D

= 250 µA  
V

DS

= V

GS

, I

D

= 250 µA  
Drain-Source Breakdown Voltage  
200  
2
V
Gate-Threshold Voltage  
Gate-Body Leakage  
4
V

DS

= 0
V
,
V

GS  

=
20 V  
100  
1
nA  
V

DS

= 200
V
,
V

GS

= 0 V  

DS

= 200
V
,
V

GS

= 0
V
,
T

J

= 125 °C  

DS

= 200
V
,
V

GS

= 0
V
,
T

J

= 175 °C  
V

DS

≥
5
V
,
V

GS

= 10 V  
I

DSS  

I

D(on)  

r

DS(on)  

g

fs  

V
V
Zero Gate Voltage Drain Current  
On-State Drain Current

a  

50  
250  
µA  
A
120  
25  
V

GS

= 10
V
,
I

D

= 30 A  
0.023  
0.030  
0.063  
0.084  
Drain-Source On-State Resistance

a  

V

GS

= 10
V
,
I

D

= 30 A, T

J

= 125 °C  

GS

= 10
V
,
I

D

= 30 A, T

J

= 175 °C  
V

DS

= 15
V
,
I

D

= 30 A  
Ω
S
V
Forward
T
r
ansconductance

a  

Dynamic

b  

C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
5100  
480  
210  
90  
V

GS

= 0
V
,
V

DS

= 25
V
, f = 1
M
Hz  
Output Capacitance  
Reverse
T
r
ansfer Capacitance  
pF  
T
o
tal Gate Charge

c  

Gate-Source Charge

c  

Gate-Drain Charge

c  

Gate Resistance  
T
u
rn-On Delay Time

c  

Rise Time

c  

130  
Q

gs  

Q

gd  

R

g  

V

DS

= 100
V
,
V

GS

= 10
V
,
I

D

= 85 A  
23  
nC  
34  
0.5  
1.7  
24  
3.3  
35  
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

220  
45  
330  
70  
V

DD

= 100
V
,
R

L

= 1.5
Ω  
ns  
T
u
rn-Off Delay Time

c  

Fall Time

c  

I

D

≅
65 A, V

GEN

= 10
V
,
R

g

= 2.5
Ω  
200  
300  
Source-Drain Diode Ratings and Characteristics
T

C

= 25 °C

b  

I

S  

I

SM  

Continuous Current  
65  
140  
1.5  
200  
12  
A
Pulsed Current  
Forward Voltage

a  

V

SD  

t

rr  

I

F

= 65 A, V

GS

= 0 V  
1.0  
130  
8
V
ns  
A
Reverse Recovery Time  
Peak Reverse Recovery Current  
Reverse Recovery Charge  
I

RM(REC)  

Q

rr  

I

F

= 50 A, di/dt = 100 A/µs  
0.52  
1.2  
µC  
Notes:  
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.  
b. Guaranteed by design, not subject to production testing.  
c. Independent of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
2
Document Number: 71702  
S-80272-Rev. D, 11-Feb-08  

SUM65N20-30  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
140  
140  
120  
100  
80  
V
GS  
= 10 thru 7 V  
6 V  
120  
100  
80  
60  
40  
20  
0
60  
T
= 125 °C  
40  
C
5 V  
4 V  
25 °C  
3
20  
– 55 °C  
6
0
0
2
4
6
8
10  
0
1
2
4
5
7
V
DS  
– Drain-to-Source Voltage (V)  
V
GS  
– Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
180  
150  
120  
90  
0.060  
0.045  
0.030  
0.015  
0.000  
T
= – 55 °C  
25 °C  
C
V
GS  
= 10 V  
125 °C  
60  
30  
0
0
20  
40  
I
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
– Drain Current (A)  
I
D
– Drain Current (A)  
D
Transconductance  
On-Resistance vs. Drain Current  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
20  
16  
12  
8
V
D
= 100 V  
DS  
= 65 A  
I
C
iss  
4
C
rss  
C
oss  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
V
DS  
– Drain-to-Source Voltage (V)  
Q
– Total Gate Charge (nC)  
g
Capacitance  
Gate Charge  
Document Number: 71702  
S-80272-Rev. D, 11-Feb-08  
3

SUM65N20-30  
Vishay Siliconix  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
3.0  
100  
10  
1
V
D
= 10 V  
GS  
= 30 A  
I
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
T =
 
150 °C  
J
T =
 
25 °C  
J
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
0
0.3  
0.6  
0.9  
1.2  
T –
 
Junction Temperature
(
°
C)  
J
V
SD  
– Source-to-Drain Voltage (V)  
On-Resistance vs. Junction Temperature  
Source-Drain Diode Forward Voltage  
1000  
100  
240  
230  
220  
210  
200  
190  
180  
I
D
= 1.0 mA  
I
(A) at T
 
= 25 °C  
A
AV  
10  
1
I
AV  
(A) at T
 
= 150 °C  
A
0.1  
– 50
 
– 25  
0
25  
50  
75 100
 
125 150 175  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t
in  
(s)  
T –
 
Junction Temperature (°C)  
J
Drain Source Breakdown  
vs. Junction Temperature  
Avalanche Current vs. Time  
4
Document Number: 71702  
S-80272-Rev. D, 11-Feb-08  

SUM65N20-30  
Vishay Siliconix  
THERMAL RATINGS  
1000  
75  
r
DS(on)  
Limited*  
60  
45  
30  
15  
0
10 µs  
100  
10  
100 µs  
1 ms  
10 ms  
100 ms  
DC  
1
T
= 25 °C  
C
Single Pulse  
0.1  
0
25  
50  
75  
100  
125  
150  
175  
0.1  
1
10  
100  
1000  
V
– Drain-to-Source Voltage (V)  
DS  
T
– Ambient Temperature
(
°
C)  
C
* V  
>
minimum V  
at which r  
is specified  
GS  
GS  
DS(on)  
Maximum Avalanche and Drain Current  
vs. Case Temperature  
Safe Operating Area  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
–
4  
–
3  
10  
–
2  
10  
–
1  
10  
10  
1
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
Document Number: 71702  
S-80272-Rev. D, 11-Feb-08  
5

Package Information  
Vishay Siliconix  
TO-263 (D

2

PAK): 3-LEAD  
-B-  
A
E
c2  
6
E1  
K
-A-  
E3  
A
e
A
b2  
b
c
Detail “A”  
E2  
M
M
A
0.010  
PL  
2
INCHES  
MIN.  
MILLIMETERS  
MIN.  
DIM.  
A
MAX.  
0.190  
0.039  
0.035  
0.055  
0.018  
0.028  
0.017  
0.027  
0.055  
0.380  
0.240  
0.042  
0.055  
0.052  
0.410  
–
MAX.  
4.826  
0.990  
0.889  
1.397  
0.457  
0.711  
0.431  
0.685  
1.397  
9.652  
6.096  
1.067  
1.397  
1.321  
10.414  
–
0° – 5°  
0.160  
0.020  
0.020  
0.045  
0.013  
0.023  
0.013  
0.023  
0.045  
0.340  
0.220  
0.038  
0.045  
0.044  
0.380  
0.245  
0.355  
0.072  
4.064  
0.508  
0.508  
1.143  
0.330  
0.584  
0.330  
0.584  
1.143  
8.636  
5.588  
0.965  
1.143  
1.118  
9.652  
6.223  
9.017  
1.829  
b
L1  
b1  
b2  
DE
T
A
IL A (RO
T
A
T
ED 90°)  
Thin lead  
c*  
Thick lead  
Thin lead  
b
c1  
Thick lead  
b1  
c2  
D
D1  
D2  
D3  
D4  
E
S
ECTION A-A  
E1  
E2  
E3  
e
0.375  
0.078  
9.525  
1.981  
0.100 BSC  
2.54 BSC  
K
0.045  
0.575  
0.090  
0.040  
0.050  
0.055  
0.625  
0.110  
0.055  
0.070  
1.143  
14.605  
2.286  
1.016  
1.270  
1.397  
15.875  
2.794  
1.397  
1.778  
L
Notes  
1. Plane B includes maximum features of heat sink tab and plastic.  
2. No more than 25 % of L1 can fall above seating plane by  
max. 8
 
mils.  
3. Pin-to-pin coplanarity max. 4 mils.  
4. *: Thin lead is for SUB, SYB.  
L1  
L2  
L3  
L4  
M
0.010 BSC  
0.254 BSC  
–
0.002  
–
0.050  
Thick lead is for SUM, SYM, SQM.  
5. Use inches as the primary measurement.  
6. This feature is for thick lead.  
ECN: T13-0707-Rev. K, 30-Sep-13  
DWG: 5843  
Revison: 30-Sep-13  
Document Number: 71198  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

AN826  
Vishay Siliconix  
2
RECOMMENDED MINIMUM PADS FOR D PAK:
 
3-Lead  
0.420  
(10.668)  
0.145  
(3.683)  
0.135  
(3.429)  
0.200  
0.050  
(5.080)  
(1.257)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
Document Number:
 
73397  
11-Apr-05  
1

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product.
 
To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications.
 
Such statements are not binding  
statements about the suitability of products for a particular application.
 
It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All
 
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts.
 
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay.
 
Product names and markings noted herein may be trademarks of their respective owners.  
© 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 01-Jan-2019  
Document Number: 91000  
1