Vishay-Intertech-VS-25TTS12S-M3

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Vishay-Intertech-VS-25TTS12S-M3
VS-25TTS08S-M3, VS-25TTS12S-M3 Series  
Vishay Semiconductors  
Thyristor, Surface Mount, Phase Control SCR, 16 A  
FEATURES  
• Meets
 
MSL level 1, per J-STD-020,  
LF maximum peak of 245 °C  
Anode  
2, 4  
• Designed  
and  
qualified  
according  
JEDEC

®

-JESD 47  
2
• Material
 
categorization: for definitions of  
compliance please see

1
1
3
3
Cathode Gate  
APPLICATIONS  
D

2

PAK (TO-26
3
AB)  
• Input rectification (soft start)  
• Vishay input diodes, switches and output rectifiers which  
are available in identical package outlines  
PRIMARY CHARACTERISTICS  
I

T(AV)  

16 A  
V

DRM

/V

RRM  

800 V, 1200 V  
1.25 V  
DESCRIPTION  
The VS-25TTS…S-M3 high voltage series of silicon  
controlled rectifiers are specifically designed for medium  
power switching and phase control applications. The glass  
passivation technology used has reliable operation up to  
125 °C junction temperature.  
V

TM  

I

GT  

45 mA  
T

J  

-40 to +125 °C  
D

2

PAK (TO-263AB)  
Single SCR  
Package  
Circuit configuration  
OUTPUT CURRENT IN TYPICAL APPLICATIONS  
APPLICATIONS  
SINGLE-PHASE BRIDGE  
THREE-PHASE BRIDGE  
UNITS  
NEMA FR-4 or G10 glass fabric-based epoxy  
with 4 oz. (140 μm) copper  
3.5  
5.5  
A
Aluminum IMS, R

thCA

= 15 °C/W  
8.5  
13.5  
25.0  
Aluminum IMS with heatsink, R

thCA

= 5 °C/W  
16.5  
Note  
T

A

= 55 °C, T

J

= 125 °C, footprint 300 mm

2  

•
MAJOR RATINGS AND CHARACTERISTICS  
PARAMETER  
TEST CONDITIONS  
VALUES  
16  
UNITS  
I

T(AV)  

Sinusoidal waveform  
A
I

RMS  

25  
V

RRM

/V

DRM  

800 to 1200  
350  
V
A
I

TSM  

V

T  

16 A, T

J

= 25 °C  
1.25  
V
dV/dt  
dI/dt  
T

J  

500  
V/μs  
A/μs  
°C  
150  
-40 to +125  
VOLTAGE RATINGS  
V

RRM

, MAXIMUM PEAK  
REVERSE VOLTAGE  
V
V

DRM

, MAXIMUM PEAK  
DIRECT VOLTAGE  
V
I

RRM

/I

DRM

,  
AT 125 °C  
mA  
PART NUMBER  
VS-25TTS08S-M3  
VS-25TTS12S-M3  
800  
800  
10  
1200  
1200  
Revision: 30-Nov-2021  
Document Number: 96414  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

VS-25TTS08S-M3, VS-25TTS12S-M3 Series  
Vishay Semiconductors  
ABSOLUTE MAXIMUM RATINGS  
VALUES  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
UNITS  
A
TYP. MAX.  
Maximum average on-state current  
Maximum RMS on-state current  
I

T(AV)  

I

RMS  

T

C

= 93 °C, 180° conduction half sine wave  
16  
25  
10 ms sine pulse, rated V

RRM

applied  
10 ms sine pulse, no voltage reapplied  
10 ms sine pulse, rated V

RRM

applied  
10 ms sine pulse, no voltage reapplied  
t = 0.1 ms to 10 ms, no voltage reapplied  
16 A, T

J

= 25 °C  
300  
350  
450  
630  
6300  
1.25  
12.0  
1.0  
Maximum peak, one-cycle,  
non-repetitive surge current  
I

TSM  

I

2

t  
Maximum I

2

t for fusing  
A

2

s  
Maximum I

2

√
t for fusing  
Maximum on-state voltage drop  
On-state slope resistance  
Threshold voltage  
I

2

√
t  
V

TM  

r

t  

A

2

√
s  
V
m
Ω  
V
T

J

= 125 °C  
V

T(TO)  

T

J

= 25 °C  
0.5  
Maximum reverse and direct leakage current  
Holding current  
I

RM

/I

DM  

V

R

= rated V

RRM

/V

DRM  

T

J

= 125 °C  
10  
Anode supply = 6 V,  
VS-25TTS08,  
mA  
I

H  

resistive load, initial I

T

= 1 A,  
VS-25TTS12  
–
150  
T

J

= 25 °C  
Maximum latching current  
I

L  

Anode supply = 6 V, resistive load, T

J

= 25 °C  
T

J

= T

J

max., linear to 80 %, V

DRM

= R

g

– k = open  
200  
500  
150  
Maximum rate of rise of off-state voltage  
Maximum rate of rise of turned-on current  
dV/dt  
dI/dt  
V/μs  
A/μs  
TRIGGERING  
PARAMETER  
SYMBOL  
P

GM  

TEST CONDITIONS  
VALUES  
8.0  
UNITS  
Maximum peak gate power  
Maximum average gate power  
Maximum peak positive gate current  
Maximum peak negative gate voltage  
W
P

G(AV)  

+ I

GM  

2.0  
1.5  
A
V
– V

GM  

10  
Anode supply = 6 V, resistive load, T

J

= – 10 °C  
Anode supply = 6 V, resistive load, T

J

= 25 °C  
Anode supply = 6 V, resistive load, T

J

= 125 °C  
Anode supply = 6 V, resistive load, T

J

= – 10 °C  
Anode supply = 6 V, resistive load, T

J

= 25 °C  
Anode supply = 6 V, resistive load, T

J

= 125 °C  
60  
Maximum required DC gate current to trigger  
Maximum required DC gate voltage to trigger  
I

GT  

45  
mA  
20  
2.5  
V

GT  

2.0  
V
1.0  
Maximum DC gate voltage not to trigger  
Maximum DC gate current not to trigger  
V

GD  

I

GD  

0.25  
2.0  
T

J

= 125 °C, V

DRM

= rated value  
mA  
SWITCHING  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
Typical turn-on time  
Typical reverse recovery time  
Typical turn-off time  
t

gt  

t

rr  

t

q  

T

J

= 25 °C  
0.9  
4
μs  
T

J

= 125 °C  
110  
Revision: 30-Nov-2021  
Document Number: 96414  
2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

VS-25TTS08S-M3, VS-25TTS12S-M3 Series  
Vishay Semiconductors  
THERMAL AND MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
Maximum junction and storage  
temperature range  
T

J

, T

Stg  

-40 to +125  
°C  
Maximum thermal resistance,  
junction to case  
R

thJC  

DC operation  
1.1  
40  
°C/W  
Typical thermal resistance,  
junction to ambient (PCB mount)  
(1)  
R

thJA  

2
g
Approximate weight  
Marking device  
0.07  
oz.  
25TTS08S  
25TTS12S  
Case style D

2

PAK (TO-263AB)  
Note  
When mounted on 1″ square (650 mm

2

) PCB of FR-4 or G-10 material 4 oz. (140 μm] copper 40 °C/W.  
For recommended footprint and soldering techniques refer to application note #AN-994  
(1)  
130  
120  
110  
100  
90  
25  
20  
15  
10  
5
180°  
120°  
90°  
R
(DC) = 1.1 °C/ W  
thJC  
60°  
30°  
Conduction Angle  
RM S Lim it  
30°  
60°  
Conduction Angle  
90°  
10  
120°  
180°  
15  
T = 125°C  
J
0
0
5
20  
0
4
8
12  
16  
20  
Aver
a
ge On-
s
t
ate Current (A)  
Average On-
s
t
ate Current (A)  
Fig. 1 – Current Rating Characteristics  
Fig. 3 – On-State Power Loss Characteristics  
130  
120  
110  
100  
90  
35  
DC  
R
(DC) = 1.1 °C
/
W  
thJC  
180°  
120°  
90°  
30  
25  
20  
15  
10  
5
60°  
30°  
Conduction
P
e
riod  
RM S L
i
m it  
Conduction
P
e
riod  
90°  
120°  
60°  
10  
T =
 
125°C  
J
DC  
25  
30°  
180°  
20  
0
80  
0
5
15  
30  
0
5
10  
15  
20  
25  
30  
Aver
a
ge On-
s
t
ate Current (A)  
Average On-
s
t
ate Cu
r
rent (A)  
Fig. 2 – Current Rating Characteristics  
Fig. 4 – On-State Power Loss Characteristics  
Revision: 30-Nov-2021  
Document Number: 96414  
3
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

VS-25TTS08S-M3, VS-25TTS12S-M3 Series  
Vishay Semiconductors  
400  
350  
300  
250  
200  
150  
At Any
R
a
ted
L
o
ad Condit
i
o
n And With  
Maximum Non
R
e
petitive
S
u
r
g
e Current  
Ver
s
u
s
P
u
l
s
e T
r
a
i
n Dur
a
t
i
o
n. Control  
R
a
ted V  
Appl
i
e
d
F
o
l
lowing
S
u
rge.  
RRM  
Initi
a
l T =
1
25°C  
Of Condu
c
t
ion May Not
B
e
M
a
i
nt
a
i
ned.  
J
350  
300  
250  
200  
150  
100  
Initi
a
l T =
1
25°C  
J
at 60
 
Hz 0.0083 s  
at 50
 
Hz 0.0100 s  
No Voltage
R
e
app
l
i
e
d  
R
a
ted V  
RRM  
R
e
app
l
ied  
0.01  
0.1  
P
u
l
s
e
T
r
a
 
in Dura
 
t ion
 
(
s
)  
1
1
10  
100  
Numbe
r
O
f
E
q
ual Amp
l
itude
H
a
lf Cy
c
l
e Current
P
u
l
s
e
s(
N
)  
Fig. 5 – Maximum Non-Repetitive Surge Current  
Fig. 6 – Maximum Non-Repetitive Surge Current  
1000  
100  
10  
T = 25°C  
J
T = 125°C  
J
1
0
1
2
3
4
5
I
n
s
t
antaneousOn
–
s
t
ate Vo
l
t
age (V)  
Fig. 7 – On-State Voltage Drop Characteristics  
Revision: 30-Nov-2021  
Document Number: 96414  
4
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

VS-25TTS08S-M3, VS-25TTS12S-M3 Series  
Vishay Semiconductors  
10  
S
t
eady
S
t
ate Value  
(DC Oper
a
t
i
o
n)  
1
D = 0.50  
D = 0.33  
D = 0.25  
D = 0.17  
D = 0.08  
0.1  
Si n g l e Pu
l
s
e  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
S
q
u
a
r
e W
a
v
e Pul
s
e
D
uration (
s
)  
Fig. 8 – Gate Characteristics  
100  
10  
1
R
e
ctangu
l
a
r gate pul
s
e  
(1)
P
G
M = 40 W, tp = 1 ms  
(2)
P
G
M = 20 W, tp = 2 ms  
(3)
P
G
M = 8 W, tp = 5 ms  
(4)
P
G
M = 4 W, tp = 10 ms  
a)
R
e
commended
l
o
ad
l
ine for  
r
a
ted di
/
dt:
1
0 V, 20
o
hms  
tr = 0.5 µ
s
,
t
p >= 6 µs  
b
)
R
e
commended load line for  
<= 30
%
r
ated d
i
/
dt:
1
0 V, 65 ohms  
tr =
1
µ
s
,
t
p >= 6 µs  
(
a
)  
(b)  
(2)  
(
3
)  
(1)  
(
4
)  
V
G
D  
I
G
D  
F
r
e
quency
L
i
mited by
P
G
(AV)  
10 100  
0.1  
0.001  
0.01  
0.1  
1
In
s
t
a
n
taneous Gate Current (A)  
Fig. 9 – Thermal Impedance Z

thJC

Characteristics  
Revision: 30-Nov-2021  
Document Number: 96414  
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

VS-25TTS08S-M3, VS-25TTS12S-M3 Series  
Vishay Semiconductors  
ORDERING INFORMATION TABLE  
Device code  
VS-  
25  
T
T
S
12  
S
TRL -M3  
1
2
3
4
5
6
7
8
9
1
–
–
–
Vishay Semiconductors product  
Current rating (25 = 25 A)  
Circuit configuration:  
T = single thyristor  
Package:  
T = D

2

PAK (TO-263AB)  
Type of silicon:  
2
3
4
5
–
–
08 = 800 V  
12 = 1200 V  
S = standard recovery rectifier  
Voltage rating: voltage code x 100 = V

RRM  

S = surface mountable  
None = tube  
TRL = tape and reel (left oriented)  
TRR = tape and reel (right oriented)  
6
7
8
–
–
–
–
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free  
9
ORDERING INFORMATION
(Example)  
PREFERRED P/N  
BASE QUANTITY  
PACKAGING DESCRIPTION  
Antistatic plastic tubes  
VS-25TTS08S-M3  
50  
800  
800  
50  
VS-25TTS08STRL-M3  
VS-25TTS08STRR-M3  
VS-25TTS12S-M3  
13″ diameter plastic tape and reel  
13″ diameter plastic tape and reel  
Antistatic plastic tubes  
VS-25TTS12STRL-M3  
VS-25TTS12STRR-M3  
800  
800  
13″ diameter plastic tape and reel  
13″ diameter plastic tape and reel  
LINKS TO RELATED DOCUMENTS  
Dimensions  
Part marking information  
Packaging information  
Revision: 30-Nov-2021  
Document Number: 96414  
6
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Outline Dimensions  
Vishay Semiconductors  
D

2

PAK  
DIMENSIONS
in millimeters and inches  
Conforms to JEDEC

®

outline D

2

P
AK (
S
MD-220)  
B
A
Pad layout  
A
(E)  
(2)(3)  
E
A
c2  
11.00  
MIN.  
(0.43)  
(3)  
D
L1  
4
2
9.65  
MIN.  
(0.3
8
)  
(D1) (3)  
Detail A  
17.90 (0.70)  
15.00 (0.625)  
H
(2)  
1
3
3.
8
1  
MIN.  
L2  
(0.15)  
B
B
2.32  
MIN.  
(0.0
8
)  
A
B
2.64 (0.103)  
2.41 (0.096)  
2 x
b
2  
2 x
b  
C
(3)  
E1  
c
View A – A  
0.004 M  
0.010 M  
M
B
A
2 x
 
e  
Base  
Metal  
Plating  
(4)  
b
1,
b
3  
H
Gauge  
plane  
(4)  
c1  
(c)  
B
0° to
8
°  
L
Seating  
plane  
L3  
A1  
(
b
,
b
2)  
Lead tip  
L4  
Detail “A”  
Section B – B and C – C  
Scale: None  
Rotated 90 °CW  
Scale:
8
:1  
MILLIMETERS  
INCHES  
MILLIMETERS  
INCHES  
SYMBOL  
NOTES  
SYMBOL  
NOTES  
MIN.  
4.06  
0.00  
0.51  
0.51  
1.14  
1.14  
0.38  
0.38  
1.14  
8.51  
MAX.  
4.83  
0.254  
0.99  
0.89  
1.78  
1.73  
0.74  
0.58  
1.65  
9.65  
MIN.  
0.160  
0.000  
0.020  
0.020  
0.045  
0.045  
0.015  
0.015  
0.045  
0.335  
MAX.  
0.190  
0.010  
0.039  
0.035  
0.070  
0.068  
0.029  
0.023  
0.065  
0.380  
MIN.  
6.86  
9.65  
7.90  
MAX.  
8.00  
MIN.  
MAX.  
0.315  
0.420  
0.346  
A
A1  
b
D1  
E
0.270  
0.380  
0.311  
3
2, 3  
3
10.67  
8.80  
E1  
e
b1  
b2  
b3  
c
4
4
4
2
2.54 BSC  
0.100 BSC  
H
14.61  
1.78  
–
15.88  
2.79  
1.65  
1.78  
0.575  
0.070  
–
0.625  
0.110  
0.066  
0.070  
L
L1  
L2  
L3  
L4  
3
c1  
c2  
D
1.27  
0.050  
0.25 BSC  
0.010 BSC  
4.78  
5.28  
0.188  
0.208  
Notes  
(1)  
Dimensioning and tolerancing per ASME Y14.5 M-1994  
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at  
the outmost extremes of the plastic body  
(2)  
(3)  
(4)  
(5)  
(6)  
(7)  
Thermal pad contour optional within dimension E, L1, D1 and E1  
Dimension b1 and c1 apply to base metal only  
Datum A and B to be determined at datum plane H  
Controlling dimension: inches  
Outline conforms to JEDEC

®

outline TO-263AB  
Revision: 13-Jul-17  
Document Number: 96164  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH
A
T

Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product  
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in  
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating  
parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts.  
Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited  
to the warranty expressed therein.  
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and  
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of  
any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.  
Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website  
or for that of subsequent links.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please  
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.  
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© 2023 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 01-Jan-2023  
Document Number: 91000  
1