Walsin-Tech-Corp-RFANT3216120A1T

Part #Walsin-Tech-Corp-RFANT3216120A1T
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Walsin-Tech-Corp-RFANT3216120A1T
Approval sheet  
MULTILAYER CERAMIC ANTENNA  
RFANT Series –
RoHS Compliance  
2.4 GHz ISM Band Working Frequency  
P/N: RFANT3216120A1T Series  
*Contents in this sheet are subject to change without prior notice  
.
Page 1 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
FR
A
T
URES  
1. Surface
 
Mounted Devices with a small dimension of 3.2 X 1.6 X1.2 mm

3

meet future miniaturization trend.  
2. LTCC
 
process  
3. High
 
stability in Temperature / Humidity Change  
APPLIC
A
T
IONS  
1. 2.4GHz
 
ISM band RF applications  
2.
Bluetooth, Wireless, HomeRF  
CONSTRUCTION  
1. Feeding  
2. Identification
 
Mark  
3.
Soldering terminal  
DIMENSIONS  
Figure  
Symbol  
L
Dimension (mm)  
3.20 ± 0.20  
a
a
a
a
W
W
T
1.60 ± 0.10  
1.20 ± 0.10  
0.25 ± 0.15  
L
T
a
Page 2 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
ELECTRICAL CHARACTERISTICS  
RFANT3216120A1T  
Specification  
Working Frequency Range  
Fc (GHz)  
2450 ± 50 MHz  
2.5  
Gain (dBi)  
2 (Typical)  
2.7nH  
Series 1  
Series 2  
Matching component valve  
–
* This frequency must be adjusted to 2.45GHz with matching circuit.  
SOLDER LAND PATTERN DESIGN  
Figure  
Series 1  
Series 2  
Empty Area  
6×6 mm  
19.4  
45mm  
Unit : mm  
Soldering Pad  
50
Ω
Feed  
line  
Ground  
50
Ω
Transmission Line  
20mm  
6
1.63  
2.3  
0.8  
1.83 1.36  
0.88  
0.54  
0.8  
1.66  
3.43  
1.6  
6
0.34  
1.88  
0.36  
Page 3 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
Antenna on Test Board ( Thickness 1.2mm)  
0
.
8
m
m  
1.
6
6
m
m  
1.6
m
m  
Empty Area  
6×6 mm  
1
9
.
4
m
m  
50
Ω
F
e
e
d  
l
i
ne  
GROUND  
Antenna S11 on Test Board  
Page 4 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
RADIATION PATTERN  
Radiation Pattern and Gain were dependent on measurement board design. The specification of RFANT3216120A1T  
antenna was measured based on the PCB size and installation position as shown in the below figure Test Board  
Z
Y
X
GROUND  
Vertical  
Horizontal  
Y – Z  
Plane  
Average  
Gain=  
0.859 dBi  
Peak Gain = 2.13dBi  
Average Gain = 0.62 dBi  
Peak Gain= -6.47dBi  
Average Gain=-11.86dBi  
X – Z  
Plane  
Average  
Gain=  
-1.804 dBi  
Peak Gain= 1.07 dBi  
Peak Gain= -7.43 dBi  
Average Gain= -2.21 dBi  
Average Gain= -12.30dBi  
X – Y  
Plane  
Average  
Gain=  
-2.365 dBi  
Peak Gain= 1.84 dBi  
Peak Gain= -9.98 dBi  
Average Gain= -2.57 dBi  
Average Gain= -15.53dBi  
Page 5 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
RELIABILITY TEST  
Test item  
Test condition / Test method  
Specification  
Solderability  
JIS C 0050-4.6  
*Solder bath temperature
:
235
±
5
°
C  
*Immersion time
:
2
±
0.5 sec  
At least 95% of a surface of each terminal  
electrode must be covered by fresh solder.  
JESD22-B102D  
*Solder
:
Sn3Ag0.5Cu for lead-free  
Leaching  
*Solder bath temperature
:
260
±
5
°
C  
*Leaching immersion time
:
30
±
0.5 sec  
*Solder : SN63A  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
(Resistance to dissolution  
of metallization)  
IEC 60068-2-58  
Resistance to soldering heat  
JIS C 0050-5.4  
*Preheating temperature
:
120~150
℃
,  
1 minute.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Solder temperature
:
270
±
5
°
C  
*Immersion time
:
10
±
1 sec  
*Solder
:
Sn3Ag0.5Cu for lead-free  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
Measurement to be made after keeping at  
room temperature for 24
±
2 hrs  
Drop
T
e
st  
JIS C 0044  
*Height
:
75 cm  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*
T
e
st Surface
:
Rigid surface of concrete or  
steel.  
*Times
:
6 surfaces for each units
;
2 times  
for each side.  
Adhesive Strength  
of
T
e
rmination  
*Pressurizing force
:
 
No remarkable damage or removal of the  
termination.  
5N(
≦
0603)
;
10N(>0603)  
JIS C 0051- 7.4.3  
*Test time
:
10±1 sec  
Bending test  
The middle part of substrate shall be  
pressurized by means of the pressurizing  
rod at a rate of about 1 mm/s per second  
until the deflection becomes 1mm/s and  
then pressure shall be maintained for 5
±
1  
sec.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
JIS C 0051- 7.4.1  
Measurement to be made after keeping at  
room temperature for 24
±
2 hours  
Page 6 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
T
e
mperature cycle  
JIS C 0025  
1. 30
±
3 minutes at -40
°
C
±
3
°
C,  
2. 10~15
 
minutes at room temperature,  
3. 30
±
3 minutes at +85
°
C
±
3
°
C,  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
4. 10~15
 
minutes at room temperature,  
T
o
tal 100 continuous cycles  
Measurement to be made after keeping at  
room temperature for 24
±
2 hrs  
Vibration  
*Frequency
:
10Hz~55Hz~10Hz(1min)  
*
T
o
tal amplitude
:
1.5mm  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
JIS C 0040  
*
T
e
st times
:
6hrs.(Two hrs each in three  
mutually perpendicular directions)  
High temperature  
JIS C 0021  
*
T
e
mperature
:
85
°
C
±
2
°
C  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*
T
e
st duration
:
1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24
±
2 hrs  
Humidity  
*Humidity
:
90% to 95% R.H.  
*
T
e
mperature
:
40
±
2
°
C  
*Time
:
1000+24/-0 hrs.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
(steady conditions)  
JIS C 0022  
Measurement to be made after  
keeping at room temperature for 24
±
2  
hrs  
※
500hrs measuring the first data then  
1000hrs data  
Low temperature  
JIS C 0020  
*
T
e
mperature
:
-40
°
C
±
2
°
C  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*
T
e
st duration
:
1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24
±
2 hrs  
Page 7 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2  
Fig 2. Infrared soldering profile  
ORDERIND CODE  
RF  
ANT  
321612  
0
A
1
T
Walsin  
Product code  
Dimension code  
Unit of  
Application  
Specification  
Packing  
dimension  
0 :
 
0.1 mm  
1 :
 
1.0 mm  
RF device  
ANT : Antenna  
Per 2 digits of  
Length, Width,  
Thickness :  
e.g. :  
A :
 
2.4GHZ ISM  
Band  
Design Code  
T : 7” Reeled  
321612 =  
Length 32,  
Width 16,  
Thickness 12  
Minimum Ordering Quantity:
 
2000 pcs per reel.  
PACKAGING  
Plastic Tape specifications
(unit :mm)  
A
A
A
A
A
Index  
Ao  
Bo  
Φ
D  
T
W
Dimension (mm)  
1.95
±
0.10  
3.45
±
0.10  
1.55
±
0.05  
1.30
±
0.10  
8.20 +0.10  
-0.30  
Index  
E
F
Po  
P1  
P2  
Dimension (mm)  
1.75
±
0.10  
3.50
±
0.05  
4.00
±
0.10  
4.00
±
0.10  
2.00
±
0.10  
Page 8 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010  

Approval sheet  
Reel dimensions  
B
A
C
Index  
A
B
C
Dimension (mm)  
Φ
178  
Φ
60.0  
Φ
13.5  
Typing Quantity: 2000 pieces per 7” reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for the  
prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft
 
equipment  
(2) Aerospace
 
equipment  
(3) Undersea
 
equipment  
(4) Medical
 
equipment  
(5) Disaster
 
prevention / crime prevention equipment  
(6) Traffic
 
signal equipment  
(7) Transportation
 
equipment (vehicles, trains, ships, etc.)  
(8) Applications
 
of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products
 
should be used in 6 months from the day of WALSIN outgoing inspection, which can be  
confirmed.  
(2) Storage
 
environment condition.  
ꢀ
ꢀ
ꢀ
ꢀ
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: -10 to +40
℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
ꢀ
ꢀ
ꢀ
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 9 of 9  
ASC_RFANT3216120A1T_V04  
Apr. 2010