Wild-Goose-WGP10N50SE

Part #Wild-Goose-WGP10N50SE
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Wild-Goose-WGP10N50SE
WGP10N50SE  
500V N-Channel MOSFET  
TO-220  
WGP10N50SE  
Features  
1
2 3  
□
Low Intrinsic Capacitances  
□
Excellent Switching Characteristics  
□
Extended Safe Operating Area  
□
Unrivalled Gate Charge : 28 nC (Typ.)  
□
V
DSS
=500V,I
D
=10A  
□
Lower R

DS(on)

: 0.70 Ω (Max) @V
G
=10V  
1.Gate (G)  
2.Drain (D)  
3.Source (S)  
□
100% Avalanche Tested  
Absolute Maximum Ratings
(Ta=25
℃
unless otherwise noted)  
Symbol  
Parameter  
Value  
500  
10.0  
5.7  
Unit  
V

DSS  

Drain-Source Voltage  
Drain Current  
V
T

j

=25
℃  
I

D  

A
T

j

=100
℃  
V

GSS  

E

AS  

Gate-Source Voltage  
±30  
V
Single Pulse Avalanche Energy (note1)  
190  
10.0  
mJ  
I

AR  

P

D  

T

j  

Avalanche Current (note2)  
Power Dissipation (Tj=25
℃
)  
Junction Temperature(Max)  
Storage Temperature  
A
W
℃
℃
50  
150  
T

stg  

-55~+150  
Maximum lead temperature for soldering purpose,1/8” from  
case for 5 seconds  
TL  
300  
℃
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
1.88  
62.5  
Unit  
℃
/W  
℃
/W  
R

θJC  

R

θJA  

Thermal Resistance,Junction to Case  
Thermal Resistance,Junction to Ambient  
–
–
WildGoose Semiconductor Rev.1.0HL, 2015  
1

WGP10N50SE  
500V N-Channel MOSFET  
Electrical Characteristics
 
(Ta=25
℃
unless otherwise noted)  
Symbol  
Parameter  
Test Condition  
Min.  
Typ. Max Units  
Off Characteristics  
BV

DSS  

△
BV

DSS  

△T

J  

Drain-Sourse Breakdown Voltage  
500  
—  
—  
0.55  
—  
—  
—  
V
ID=250
μ
A
,
VGS=0  
/
Breakdown Voltage Temperature
 
I

D

=250
μ
A ,Reference  
V/
℃  
Conficient  
to 25
℃  
Vds=500V, Vgs=0V  
Vds=400V, Tc=125
℃  
—  
1
μ
A  
μ
A  
nA  
IDSS  
IGSSF  
IGSSR  
Zero Gate Voltage Drain Current  
10  
Gate-body leakage Current,  
Forward  
—  
—  
—  
—  
100  
Vgs=+30V, Vds=0V  
Vgs=-30V, Vds=0V  
Gate-body leakage Current,  
Reverse  
-100  
nA  
On Characteristics  
V

GS(th)  

Date Threshold Voltage  
Id=250uA,Vds=Vgs  
Id=4.5A,Vgs=10V  
2
—  
4
V
Static Drain-Sourse  
On-Resistance  
0
R

DS(on)  

—  
0.7  
Ω
0.65  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
—  
—  
—  
1012  
160  
20  
—  
—  
—  
pF  
pF  
pF  
VDS=25V
,
VGS=0
,  
Output Capacitance  
f=1.0MHz  
Reverse Transfer Capacitance  
Switching Characteristics  
Td(on)  
Tr  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Sourse Charge  
Gate-Drain Charge  
—  
—  
—  
—  
—  
—  
25  
95  
55  
60  
28  
7
60  
200  
120  
130  
36  
nS  
nS  
nS  
nS  
nC  
nC  
nC  
VDD=250V
,
ID=10A
,  
RG=25
Ω
(Note 3,4)  
Td(off)  
Tf  
Qg  
VDS=400,VGS=10V
,  
Qgs  
Qgd  
—  
ID=1
0
A
(
Note 3,4)  
12.5  
—  
Drain-Sourse Diode Characteristics and Maximum Ratings  
I

S  

Maximun Continuous Drain-Sourse Diode Forward Current  
Maximun Plused Drain-Sourse DiodeForwad Current  
—  
—  
—  
—  
9
A
A
I

SM  

36  
Drain-Sourse Diode Forward  
V

SD  

Id=10A  
—  
—  
1.45  
V
Voltage  
trr  
Qrr  
Reverse Recovery Time  
Reverse Recovery Charge  
I

S

=10.0A,V

GS

=0V  
—  
—  
300  
2.2  
—  
—  
nS  
di

F

/dt=100A/
μ
s
(Note3)  
μ
C  
1, L=8mH, IAS=1
0
A
,
 
V
DD=50
V
,
R
G=25
Ω
,
S
tarti
n
g
T
J
 
=25°C  
2, Repetitive Rating : Pulse width limited by maximum junction temperature  
3, Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2%  
*Notes  
4, Essentially Independent of Operating Temperature  
WildGoose Semiconductor Rev.1.0HL, 2015  
2

WGP10N50SE  
500V N-Channel MOSFET  
Typical Characteristics  
V

GS  

To
p
:  
15.0 V  
10.
0
V  
8.
0
V  
7.
0
V  
6.
0
V  
5.
5
V  
10

1  

10

1  

150

o  

C
5.0  
V
Botto
m
:
4
.
5
V  
-55

o

C  
25

o  

C
10

0  

10

0  

※
Notes :  
μ
※
Notes :  
1.
250 s
 
Puls
e
T
est  
1.
V

DS

= 40V  
2.
250 s
 
PulseTest  
℃
2. T

C

=
2
5  
μ
10

-1  

10

-1  

10

-1  

10

0  

10

1  

2
4
6
8
10  
V

GS

, Gate-Source Voltage [V]  
V

DS

, Drain-Sourc
e
V
oltag
e
[
V]  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
2.0  
1.5  
V

GS

= 10V  
10

1  

1.0  
0.5  
10

0  

V

GS

= 20V  
150
℃
 
※
Notes :  
1.
V

GS

=
0
V  
2.
250 s
 
PulseTest  
25
℃  
※
℃
Note : T

J

= 25  
20  
μ
10

-1  

0.2  
0
5
10  
15  
25  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
I

D

, Drain Current [A]  
V

SD

, Source-Drain voltage [V]  
Figure 3. On-Resistance Variation vs  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation with Source Current  
and Temperature  
2000  
1600  
1200  
800  
12  
C

iss

= C

gs

+ C

gd

(C

ds

= shorted)  
C

oss

= C

ds

+ C

gd  

C

rss

= C

gd  

V

D
S

= 100V  
10  
8
V

D
S

= 250V  
V

DS

= 400V  
C

iss  

C

oss  

6
※
Note
s
;  
1.
V

G
S

= 0 V  
2.
f = 1
M
Hz  
4
2
0
C

rss  

400  
0
※
Note : I

D

= 9A  
25  
10

-1  

10

0  

1
10  
0
5
10  
15  
20  
30  
Q

G

, Total Gate Charge [nC]  
V

DS

, Drain-Sourc
e
V
oltag
e
[
V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
WildGoose Semiconductor Rev.1.0HL, 2015  
3

WGP10N50SE  
500V N-Channel MOSFET  
Typical Characteristics
 
(Continued)  
1.2  
1.1  
1.0  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
※
Notes :  
0.9  
0.8  
※
Notes :  
1.
V

GS

=
0V  
1. V

GS

= 10 V  
2. I

D

= 4.5 A  
2.
I

D

=
2
50μ A  
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
T ,

J

Junction Temperature [

o

C]  
T , Junction Temperature [

o

C]  
J
Figure 8. On-Resistance Variation  
vs Temperature  
Figure 7. Breakdown VoltageVariation  
vs Temperature  
10  
Operatio
n
i
n
T
hi
s
A
rea  
10

2  

is Limited by R  
DS(on)  
10  
100
s  
1 ms  
1
0
m
s  
100 ms  
s
8
6
10

1  

DC  
10

0  

4
※
Notes :  
10

-1  

10

-2  

1. T

C

=
2
5

o  

C
2
0
2. T = 150

o

C  
J
3.
Singl
e
P
ulse  
3
10  
10

0  

10

1  

10

2  

25  
50  
75  
100  
125  
150  
℃
T

C

, Case Temperature [  
]
V

DS

, Drain-Source Voltage [V]  
Figure 10. Maximum Drain Current  
vs Case Temperature  
Figure 9-2. Maximum Safe Operating Area  
D = 0 . 5  
0
10  
0. 2  
0. 1  
※
N o te s :  
℃
/W M
 
a x .  
1 .
 
Z

θ

J

(
t)  
=
2
.
8 6  
C
2
. D u ty F a c to r , D = t

1

/t

2  

3
.
T

J M  

–
T

C  

=
P

D  

* Z
 

θ
J

(
t)  
C
M
0. 05  
-1  
10  
0. 02  
0. 01  
P

DM  

t

1  

t

2  

s ingle
 
p uls e  
-2  
10  
-5  
-4  
-3  
-2  
-1  
0
1
10  
10  
10  
10  
10  
10  
10  
t

1

, S quar e
 
W a v e
 
P uls e
 
D uration [ s ec ]  
Figure 11-2. Transient Thermal Response Curve  
WildGoose Semiconductor Rev.1.0HL, 2015  
4

WGP10N50SE  
500V N-Channel MOSFET  
Gate Charge Test Circuit & Waveform  
V

GS  

Same Type  
50KΩ  
as DUT  
Q

g  

200nF  
12V  
10V  
300nF  
V

DS  

V

GS  

Q

gs  

Q

gd  

DUT  
3mA  
Charge  
Resistive Switching Test Circuit & Waveforms  
R

L  

V

DS  

V

DS  

90%  
V

DD  

V

GS  

R

G  

10%  
V

GS  

DUT  
10V  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

off  

t

on  

Unclamped Inductive Switching Test Circuit & Waveforms  
L
BV

DSS  

2

——————–  
1
— —  
E
=  
L
I  
AS  
V

DS  

2
BV

DSS  

–
V

DD  

BV

DSS  

I

AS  

I

D  

R

G  

V

DD  

I

D

(t)  
V

DD  

V

DS

(t)  
DUT  
10V  
t

p  

t

p  

Time  
WildGoose Semiconductor Rev.1.0HL, 2015  
5

WGP10N50SE  
500V N-Channel MOSFET  
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
+
DUT  
V

DS  

I

SD  

L
Driver  
R

G  

Same Type  
as DUT  
V

DD  

V

GS  

• dv/dt controlled by R

G  

• I

SD

controlled by pulse period  
Gate Pulse Width  
————————–  
Gate Pulse Period  
D =  
V

GS  

10V  
( Driver  
)
I

FM

, Body Diode Forward Current  
I

SD  

di/dt  
( DUT )  
I

RM  

Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V

SD  

V

DS  

( DUT )  
V

DD  

Body Diode  
Forward Voltage Drop  
WildGoose Semiconductor Rev.1.0HL, 2015  
6

WGP10N50SE  
500V N-Channel MOSFET  
Package Dimension  
TO-220  
WildGoose Semiconductor Rev.1.0HL, 2015  
7