Winsok-Semicon-WSD2068

Part #Winsok-Semicon-WSD2068
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Winsok-Semicon-WSD2068
WSD2068  
Dual
N-Ch MOSFET  
General Description  
Product Summery  
BV

DSS  

The
WSD2068
is the highest performance trench  
N-ch MOSFETs with extreme high cell density ,  
which provide excellent RDSON and gate  
charge for
 
most of the small power switching  
and load
 
switch applications.  
R

DSON  

15.5
m
Ω
 
I

D  

7.5
A
 
20V  
Applications  
The
WSD2068
meet the RoHS and Green  
Product requirement with full function  
reliability approved.  
z
Power Management in Notebook Computer, Portable  
Equipment and Battery Powered Systems.  
z
DC-DC Power System  
z
ESD:2KV  
Features  
DFN
2X
3
A_EP
Pin Configuration  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
z
Excellent Cdv/dt effect decline  
z
Green Device Available  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
20  
Units  
V
Drain-Source Voltage  
V

GS  

Gate-Sou
r
ce Voltage  
±
12  
7.5  
V
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 4.5V

1  

Continuous Drain Current, V

GS

@ 4.5V

1  

Pulsed Drain Current

2  

A
6
.5  
3
0  
A
A
Total Power Dissipation

3  

Total Power Dissipation

3  

W
W
℃
℃
1.
5  
P

D

@T

A

=25
℃  
P

D

@T

A

=70
℃  
T

STG  

1.0  
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
—  
Max.  
12
0  
8
3  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1

(Steady State)  
Thermal Resistance Junction-ambient

1

(t<10S)  
R

θ
JA  

—  
Dec.2014  
Page 1  

WSD2068  
Dual
N-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
20  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=4.5V , I

D

=
5.5
A  
0.022  
12  
—  
V/
℃  
15.5  
20  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
Ω
 
—  
16  
V

GS

=2.5V , I

D

=
5.5
A  
0.
3  
0.
7  
-2.32  
—  
V

GS(th)  

Gate Threshold Voltage  
1.
0  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
mV/
℃  
V

DS

=16V , V

GS

=0V , T

J

=25
℃  
V

DS

=16V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
12V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=10A  
20  
11  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
—  
Ω
Q

g  

Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
15  
20  
—  
V

DS

=1
0
V , V

GS

=4.5V , I

D

=
5
A  
nC  
n
s  
Q

gs  

Q

gd  

T

d(on)  

T

r  

2.2  
4.2  
148  
277  
—  
—  
V

D
S

=10V , V

GS

=
10
V , R

G

=
6
Ω
,
 
I

D

=
5
A
,RL=
2
Ω  
—  
1616  
751  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
1219  
150  
1
35
0  
—  
V

DS

=1
0
V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
123  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
5
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,4  

Pulsed Source Current

2,4  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
V

G

=V

D

=0V , Force Current  
15  
—  
—  
A
V

GS

=0V , I

S

=1A , T

J

=25
℃  
—  
0.
76  
2
45  
1
105  
1.
3  
—  
V
—  
nS  
nC  
I
F
=
5
A
,
dI/dt=
1
00A/µs , T

J

=25
℃  
Q

rr  

—  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper
, t<10sec
.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Dec.2014  
Page
2  

WSD2068  
Dual
N-Ch MOSFET  
Typical Characteristics  
0.045  
10  
8
TJ = 25
Ʊ
C  
0.035  
0.025  
0.015  
0
1.8V  
6
2V  
2.5V  
4
2
3V,3.5V,4V,4.5V,6V  
0
0
1
2
0
2
4
10  
ID-Drain Current (A)  
1. On-Resistance vs. Drain Current  
VGS – Gate-to-Source Voltage (V)  
2. Transfer Characteristics  
0.08  
0.06  
0.04  
0.02  
0
100  
10  
TJ = 25
Ʊ
C  
ID = 5A  
TJ = 25
Ʊ
C  
1
0.1  
0.01  
0
2
4
0.2  
0.4  
0.6  
0.8  
1
1.2  
VSD – Source-to-Drain Voltage (V)  
VGS – Gate-to-Source Voltage (V)  
3. On-Resistance vs. Gate-to-Source Voltage  
4. Drain-to-Source Forward Voltage  
10  
8
1800  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
F = 1MHz  
6V,4.5V,4V,  
3.5V,3V  
Ciss  
2.5V  
2V  
6
1.8V  
4
2
Coss  
Crss  
0
0
0.05  
0.1  
0.15  
0.2  
0.25  
0
5
10  
15  
20  
VDS – Drain-to-Source Voltage (V)  
VDS-Drain-to-Source Voltage (V)  
5. Output Characteristics  
6. Capacitance  
Dec.2014  
Page
3  

WSD2068  
Dual
N-Ch MOSFET  
Typical Characteristics  
10  
2
1.5  
1
VDS = 10V  
ID = 5A  
8
6
4
2
0
0.5  
0
10  
20  
30  
40  
-50 -25  
0
25  
50  
75 100
 
125 150  
Qg – Total Gate Charge (nC)  
TJ -JunctionTemperature(°C)  
7. Gate Charge  
8. Normalized On-Resistance Vs  
Junction Temperature  
100  
10  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
10 uS  
100 uS  
1 mS  
10 mS  
100 mS  
1 SEC  
10 SEC  
100 SEC  
DC  
1
0.1  
0.01  
Idm limit  
Limited by  
RDS  
0
0.1  
1
10  
100  
1000  
0.001 0.01  
0.1  
1
10  
100  
1000  
VDS Drain to Source Voltage (V)  
t1 TIME (SEC)  
9. Safe Operating Area  
10. Single Pulse Maximum Power Dissipation  
1
0.1  
D = 0.5  
R

θ
JA

(t) = r(t) + R

θ
JA  

0.2  
0.1  
R

θ
JA

= 120
Ʊ
C /W  
0.05  
0.02  
Single Pulse  
P(pk)  
t

1  

t

2  

0.01  
T

J

– T

A

= P * R

θ
JA

(t)  
Duty Cycle, D = t

1

/ t

2  

0.001  
0.0001  
0.001  
0.01  
0.1  
t1 TIME (sec)  
1
10  
100  
1000  
11. Normalized Thermal Transient Junction to Ambient  
Dec.2014  
Page
4  

WSD2068  
Dual
N-Ch MOSFET  
Package Information
 
DFN2x3A-6_EP  
E1  
D
e
L
E1  
b
TOP VIEW  
BOTTOM VIEW  
A
A3  
SIDE VIEW  
DFN2x3A-6_EP  
S
RECOMMENDED LAND PATTERN  
Y
M
B
O
L
MILLIMETERS  
INCHES  
1.6  
MIN.  
MAX.  
1.00  
MIN.  
0.028  
0.000  
MAX.  
0.039  
0.002  
0.5  
A
0.70  
0.00  
0.05  
A1  
A3  
b
0.203 REF  
0.008 REF  
0.008  
0.012  
0.083  
0.071  
0.122  
0.063  
0.20  
1.90  
1.60  
2.90  
1.40  
0.30  
2.10  
1.80  
3.10  
1.60  
D
0.075  
0.063  
0.114  
0.055  
1.6  
3
E1  
E
D1  
e
0.4  
0.50 BSC  
0.02 BSC  
0.25  
L
0.30  
0.012  
0.020  
0.50  
UNIT: mm  
Dec.2014  
Page
5
 

Attention
ꢀ
 
1,
ꢀ
Any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
do
ꢀ
not
ꢀ
have
ꢀ
specifications
ꢀ
that
ꢀ
can
ꢀ
handle
ꢀ  
applications
ꢀ
that
ꢀ
require
ꢀ
extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
ꢀ
as
ꢀ
life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
ꢀ
systems,
ꢀ
or
ꢀ  
other
ꢀ
applications
ꢀ
whose
ꢀ
failure
ꢀ
can
ꢀ
be
ꢀ
reasonably
ꢀ
expected
ꢀ
to
ꢀ
result
ꢀ
in
ꢀ
serious
ꢀ
physical
ꢀ
and/or
ꢀ
material
ꢀ
damage.
ꢀ ꢀ  
Consult
ꢀ
with
ꢀ
your
ꢀ
Winsok
ꢀ
power
ꢀ
representative
ꢀ
nearest
ꢀ
you
ꢀ
before
ꢀ
using
ꢀ
any
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ  
contained
ꢀ
herein
ꢀ
in
ꢀ
such
ꢀ
applications.
ꢀ  
2,Winsok
ꢀ
power
ꢀ
assumes
ꢀ
no
ꢀ
responsibility
ꢀ
for
ꢀ
equipment
ꢀ
failures
ꢀ
that
ꢀ
result
ꢀ
from
ꢀ
using
ꢀ
products
ꢀ
at
ꢀ
values
ꢀ
that
ꢀ
exceed,
ꢀ ꢀ  
even
ꢀ
momentarily,
ꢀ
rated
ꢀ
values
ꢀ
(such
ꢀ
as
ꢀ
maximum
ꢀ
ratings,
ꢀ
operating
ꢀ
condition
ꢀ
ranges,
ꢀ
or
ꢀ
other
ꢀ
parameters)
ꢀ
listed
ꢀ
in
ꢀ  
products
ꢀ
specifications
ꢀ
of
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein.
ꢀ  
3,
ꢀ
Specifications
ꢀ
of
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
stipulate
ꢀ
the
ꢀ
performance,
ꢀ  
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
ꢀ
the
ꢀ
described
ꢀ
products
ꢀ
in
ꢀ
the
ꢀ
independent
ꢀ
state,
ꢀ
and
ꢀ
are
ꢀ
not
ꢀ
guarantees
ꢀ
of
ꢀ
the
ꢀ  
performance,
ꢀ
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
ꢀ
the
ꢀ
described
ꢀ
products
ꢀ
as
ꢀ
mounted
ꢀ
in
ꢀ
the
ꢀ
customer’s
ꢀ
products
ꢀ
or
ꢀ  
equipment.
ꢀ
T
o
ꢀ
verify
ꢀ
symptoms
ꢀ
and
ꢀ
states
ꢀ
that
ꢀ
cannot
ꢀ
be
ꢀ
evaluated
ꢀ
in
ꢀ
an
ꢀ
independent
ꢀ
device,
ꢀ
the
ꢀ
customer
ꢀ
should
ꢀ
always
ꢀ  
evaluate
ꢀ
and
ꢀ
test
ꢀ
devices
ꢀ
mounted
ꢀ
in
ꢀ
the
ꢀ
customer’s
ꢀ
products
ꢀ
or
ꢀ
equipment.
ꢀ  
4,
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ
strives
ꢀ
to
ꢀ
supply
ꢀ
high
Ͳ
quality
ꢀ
high
Ͳ
reliability
ꢀ
products.
ꢀ
However,
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ  
semiconductor
ꢀ
products
ꢀ
fail
ꢀ
with
ꢀ
some
ꢀ
probability.
ꢀ
It
ꢀ
is
ꢀ
possible
ꢀ
that
ꢀ
these
ꢀ
probabilistic
ꢀ
failures
ꢀ
could
ꢀ
give
ꢀ
rise
ꢀ
to
ꢀ
accidents
ꢀ  
or
ꢀ
events
ꢀ
that
ꢀ
could
ꢀ
endanger
ꢀ
human
ꢀ
lives
ꢀ
that
ꢀ
could
ꢀ
give
ꢀ
rise
ꢀ
to
ꢀ
smoke
ꢀ
or
ꢀ
fire,
ꢀ
or
ꢀ
that
ꢀ
could
ꢀ
cause
ꢀ
damage
ꢀ
to
ꢀ
other
ꢀ  
property.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
adopt
ꢀ
safety
ꢀ
measures
ꢀ
so
ꢀ
that
ꢀ
these
ꢀ
kinds
ꢀ
of
ꢀ
accidents
ꢀ
or
ꢀ
events
ꢀ
cannot
ꢀ
occur.
ꢀ
Such
ꢀ  
measures
ꢀ
include
ꢀ
but
ꢀ
are
ꢀ
not
ꢀ
limited
ꢀ
to
ꢀ
protective
ꢀ
circuits
ꢀ
and
ꢀ
error
ꢀ
prevention
ꢀ
circuits
ꢀ
for
ꢀ
safe
ꢀ
design,
ꢀ
redundant
ꢀ
design,
ꢀ  
and
ꢀ
structural
ꢀ
design.
ꢀ  
5,In
ꢀ
the
ꢀ
event
ꢀ
that
ꢀ
any
ꢀ
or
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products(including
ꢀ
technical
ꢀ
data,
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services)
ꢀ
described
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or
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contained
ꢀ
herein
ꢀ
are
ꢀ  
controlled
ꢀ
under
ꢀ
any
ꢀ
of
ꢀ
applicable
ꢀ
local
ꢀ
export
ꢀ
control
ꢀ
laws
ꢀ
and
ꢀ
regulations,
ꢀ
such
ꢀ
products
ꢀ
must
ꢀ
not
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be
ꢀ
exported
ꢀ
without
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obtaining
ꢀ
the
ꢀ
export
ꢀ
license
ꢀ
from
ꢀ
the
ꢀ
authorities
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concerned
ꢀ
in
ꢀ
accordance
ꢀ
with
ꢀ
the
ꢀ
above
ꢀ
law.
ꢀ  
6,
ꢀ
No
ꢀ
part
ꢀ
of
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this
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publication
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may
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be
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reproduced
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or
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transmitted
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in
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any
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form
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or
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by
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any
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means,
ꢀ
electronic
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or
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mechanical,
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including
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photocopying
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and
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recording,
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or
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any
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information
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storage
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or
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retrieval
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system,
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or
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otherwise,
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without
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the
ꢀ
prior
ꢀ  
written
ꢀ
permission
ꢀ
of
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ  
7,
ꢀ
Information
ꢀ
(including
ꢀ
circuit
ꢀ
diagrams
ꢀ
and
ꢀ
circuit
ꢀ
parameters)
ꢀ
herein
ꢀ
is
ꢀ
for
ꢀ
example
ꢀ
only;
ꢀ
it
ꢀ
is
ꢀ
not
ꢀ
guaranteed
ꢀ
for
ꢀ  
volume
ꢀ
production. Winsok
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power
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believes
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information
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herein
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is
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accurate
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and
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reliable,
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but
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no
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guarantees
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are
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made
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or
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implied
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regarding
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its
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use
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or
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any
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infringements
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of
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rights
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or
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other
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rights
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of
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third
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parties.
ꢀ  
8,
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Any
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and
ꢀ
all
ꢀ
information
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described
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or
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contained
ꢀ
herein
ꢀ
are
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subject
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to
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change
ꢀ
without
ꢀ
notice
ꢀ
due
ꢀ
to
ꢀ
product/technology
ꢀ  
improvement,etc.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
refer
ꢀ
to
ꢀ
the
ꢀ
“Delivery
ꢀ
Specification”
ꢀ
for
ꢀ
the
ꢀ
Winsok
ꢀ
power
ꢀ
product
ꢀ
that
ꢀ
you
ꢀ ꢀ  
Intend
ꢀ
to
ꢀ
use.
ꢀ  
9,
ꢀ
this
ꢀ
catalog
ꢀ
provides
ꢀ
information
ꢀ
as
ꢀ
of
ꢀ
Sep.2014. Specifications
ꢀ
and
ꢀ
information
ꢀ
herein
ꢀ
are
ꢀ
subject
ꢀ
to
ꢀ
change
ꢀ
without
ꢀ  
notice.
ꢀ