Winsok-Semicon-WSD30L68DN
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WSD30L68DN
P
-Ch MOSFET
General Description
Product Summery
The
WSD30L68DN
is the highest performance
trench P-ch
MOSFETs with extreme high cell
density ,
which provide excellent RDSON and
gate charge
for most of the synchronous buck
converter applications
.
BVDSS
RDSON
5.8
mΩ
ID
-30V
–
68
A
Applications
The
WSD30L68DN
meet the RoHS and
Green Product
requirement 100% EAS
guaranteed with
full function reliability
approved.
z
High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z
Networking DC-DC Power System
z
Load Switch
Features
z
Advanced high cell density Trench technology
DFN
3
X
3
-8
Pin Configuration
z
Super Low Gate Charge
z
Excellent CdV/dt effect decline
z
100% EAS Guaranteed
z
Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
V
DS
V
GS
Drain-Source Voltage
Gate-Sou
r
ce Voltage
Continuous Drain Current, V
GS
@ -10V
1
Continuous Drain Current, V
GS
@ -10V
1
Pulsed Drain Current
2
-30
±
20
–
68
V
V
I
D
@T
C
=25
℃
I
D
@T
C
=100
℃
I
DM
A
–
30
A
–
180
A
EAS
Single Pulse Avalanche Energy
3
125
mJ
A
I
AS
Avalanche Current
–
40
P
D
@T
C
=25
℃
P
D
@T
A
=25
℃
T
STG
Total Power Dissipation
4
Total Power Dissipation
4
69
W
W
℃
℃
2.5
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
T
J
Thermal Data
Symbol
R
θJA
Parameter
Typ.
—
Max.
Unit
℃
/W
℃
/W
℃
/W
Thermal Resistance Junction-Ambient
1
Thermal Resistance Junction-Ambient
1
(t
≤
10s)
Thermal Resistance Junction-Case
1
60
R
θJA
—
20
3.5
R
θJC
—
Page 1
Rev1.Mar.2022
WSD30L68DN
P
-Ch MOSFET
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
Parameter
Conditions
V
GS
=0V , I
D
=-250uA
Min.
-30
—
—
—
-1.
3
—
—
—
—
—
—
—
—
—
—
Typ.
—
Max.
—
Unit
V
BV
DSS
Drain-Source Breakdown Voltage
BVDSS Temperature Coefficient
△
BV
DSS
/△
T
J
Reference to 25
℃
, I
D
=-1mA
V
GS
=-10V , I
D
=-
2
0
A
-0.0232
5.8
—
V/
℃
7.8
18
R
DS(ON)
Static Drain-Source On-Resistance
2
m
Ω
10
V
GS
=-4.5V , I
D
=-
10
A
V
GS(th)
Gate Threshold Voltage
-1.
8
4.6
—
–
2.
5
—
V
V
GS
=V
DS
, I
D
=-250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
mV/
℃
V
DS
=-24V , V
GS
=0V , T
J
=25
℃
V
DS
=-24V , V
GS
=0V , T
J
=55
℃
-1
I
DSS
Drain-Source Leakage Current
uA
—
-5
V
GS
=
±
20V , V
DS
=0V
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
—
±
100
—
nA
S
10
V
DS
=-5V , I
D
=-
1
0A
R
g
V
DS
=0V , V
GS
=0V , f=1MHz
1.2
60
—
Ω
Q
g
Total Gate Charge (-4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
—
—
V
DS
=-15V , V
GS
=-
10
V , I
D
=-
18
A
9
nC
ns
Q
gs
Q
gd
T
d(on)
T
r
15
—
—
—
—
—
—
—
—
16
V
DD
=-15V , V
GS
=-10V ,
—
38
R
G
=
3.3
Ω
I
D
=-1A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
50
—
—
—
12
C
iss
C
oss
C
rss
Input Capacitance
3415
245
131
V
DS
=-
20
V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
Guaranteed Avalanche Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
EAS
Single Pulse Avalanche Energy
5
V
DD
=-25V , L=0.
5
mH , I
AS
=-
4
0
A
78
—
—
mJ
Diode Characteristics
Symbol
Parameter
Conditions
Min.
—
Typ.
—
Max.
–
70
Unit
A
I
S
I
SM
V
SD
t
rr
Continuous Source Current
1,6
Pulsed Source Current
2,6
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
V
G
=V
D
=0V , Force Current
–
180
—
—
A
V
GS
=0V , I
S
=-1A , T
J
=25
℃
—
—
—
-1
.2
—
V
22
75
nS
nC
I
F
=-
2
0
A
,
dI/dt=100A/µs
,
T
J
=25
℃
Q
rr
—
—
Note :
1.
The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper
,t
≦
10sec
.
2.
The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.
The EAS data shows Max. rating . The test condition is V
DD
=-25V,V
GS
=-10V,L=0.
5
mH,I
AS
=-
40
A
4.
The power dissipation is limited by 150
℃
junction temperature
5.
The Min. value is 100% EAS tested guarantee.
6.
The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
Page
2
Rev1.Mar.2022
WSD30L68DN
P
-Ch MOSFET
Typical Characteristics
Fig.2 On-Resistance vs G-S Voltage
Fig.1 Typical Output Characteristics
Fig.3 Source Drain Forward Characteristics
Fig.4 Gate-Charge Characteristics
Fig.5 Normalized -V
GS(th)
vs T
J
Fig.6 Normalized R
DSON
vs T
J
Page
3
Rev1.Mar.2022
WSD30L68DN
P
-Ch MOSFET
Fig.7 Capacitance
Fig.8 Safe Operating Area
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
P
DM
T
ON
SINGLE
0.01
0.001
T
D =
T
ON
/T
T
Jpeak
=
T
C
+P
D
M
XR
θJC
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.11 Unclamped Inductive Switching Waveform
Fig.10 Switching Time Waveform
Page
4
Rev1.Mar.2022
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