Winsok-Semicon-WSF2048

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Winsok-Semicon-WSF2048
WSF20
48  
N-Ch MOSFET  
General Description  
Product Summery  
The
WSF204
8
is the highest performance  
trench N-ch
 
MOSFET with extreme high cell  
density ,
 
which provide excellent RDSON and  
gate charge
 
for most of the synchronous buck  
converter applications
 
.  
BVDSS  
RDSON  
ID  
2
0V  
6.2
m
Ω
 
4
0
A  
Applications  
The
WSF204
8
meet the RoHS and  
Green Product
 
requirement , 100% EAS  
guaranteed with full
 
function reliability  
approved.  
z
High Frequency Point-of-Load Synchronous  
Buck Converter for MB/NB/UMPC/VGA  
z
Networking DC-DC Power System  
z
Load Switch  
Features  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
TO
–
252 Pin Configuration  
z
Excellent CdV/dt effect decline  
z
100% EAS Guaranteed  
z
Green Device Available  
Absolute Maximum Ratings  
Rating  
Symbol  
Parameter  
Units  
V

DS  

Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
2
0  
±
12  
4
0  
V
V
V

GS  

I

D

@T

C

=25
℃  
I

D

@T

C

=100
℃  
I

DM  

Continuous Drain Current, V

GS

@ 10V  
Continuous Drain Current, V

GS

@ 10V  
A
28  
A
80  
A
Pulsed Drain Current  
Single Pulse Avalanche Energy  
Avalanche Current  
EAS  
150  
mJ  
A
I

AS  

40  
P

D

@T

C

=25
℃  
T

STG  

Total Power Dissipation

4  

60  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 1
50  
-55 to 1
50  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
—  
Max.  
Unit  
℃
/W  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
Thermal Resistance Junction-Ambient
 
(t
≤
10s)  
Thermal Resistance Junction-Case  
62  
25  
R

θ
JA  

—  
3.8  
R

θ
JC  

—  
Rev 2: May.2019  
Page 1  

WSF20
48  
N-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
2
0  
—  
—  
—  
0.5  
—  
—  
—  
—  
1
0  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=
4.5
V , I

D

=
25
A  
0.028  
6.2  
—  
V/
℃  
10  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
Ω
 
12  
9.1  
0.75  
-6.16  
—  
V

GS

=
2
.5V , I

D

=
1
0
A  
V

GS(th)  

Gate Threshold Voltage  
1.
2  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
mV/
℃  
1
V

DS

=
20
V , V

GS

=0V , T

J

=25
℃  
V

DS

=2
0
V , V

GS

=0V , T

J

=55
℃  
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=30A  
—  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
1.
0  
15  
3.1  
—  
Ω
Q

g  

Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V

DS

=15V , V

GS

=4.5V , I

D

=15A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

1.8  
2.8  
4.5  
9.2  
18.7  
3.3  
1100  
162  
105  
—  
—  
—  
V

DD

=15V , V

GS

=10V , R

G

=3.3
Ω  
—  
I

D

=15A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
—  
—  
V

DS

=15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
Unit  
A
I

S  

Continuous Source Current  
Diode Forward Voltage  
30  
1.
2  
V

SD  

—  
—  
V
t

rr  

Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
18  
—  
—  
nS  
nC  
I
F
=
20
A , dI/dt=100A/µs , T

J

=25
℃  
Q

rr  

9.5  
Notes:  
1.
Repetitive Rating: Pulse width limited by maximum junction temperature.  
2.
Surface Mounted on FR4 Board, t ≤ 10 sec.  
3.
Pulse
T
e
st: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.  
4.
Guaranteed by design, not subject to production  
5.
E

AS

condition : Tj=25
℃
,V

DD

=10
V
,
V

G

=10
V
,
L=0.5mH,Rg=25Ω
,  
Rev 2: May.2019  
Page
2
 

WSF20
48  
N-Ch MOSFET  
Typical Characteristics  
Vds Drain-Source Voltage (V)  
Figure 1 Output Characteristics  
T

J
–  

Junction
T
e
mperature  
Figure 4 Rdson-Junction Temperature  
( )  
℃
Vgs Gate-Source Voltage (V)  
Qg Gate Charge (nC)  
Figure 2 Transfer Characteristics  
Figure 5 Gate Charge  
I

D

– Drain Current (A)  
Vsd
ource-Drain Voltage (V)  
Figure 3 Rdson-  
Drain Current  
Figure 6 S
urce- Drain Diode Forward  
Rev 2: May.2019  
Page
3  

WSF20
48  
N-Ch MOSFET  
Vds Drain-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 7 Capacitance vs Vds  
Figure 9 Power De-rating  
Vds Drain-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 8 Safe Operation Area  
Figure 10 Current De-rating  
Square Wave Pluse Duration(sec)  
Figure 11 Normalized Maximum Transient Thermal Impedance  
Rev 2: May.2019  
Page
4  

Attention
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1,
ꢀ
Any
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and
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all
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Winsok
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described
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or
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contained
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herein
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do
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not
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have
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specifications
ꢀ
that
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can
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handle
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applications
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that
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require
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extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
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as
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life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
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systems,
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or
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other
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applications
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whose
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failure
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can
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be
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reasonably
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expected
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to
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result
ꢀ
in
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serious
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physical
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and/or
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material
ꢀ
damage.
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Consult
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with
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your
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Winsok
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power
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representative
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nearest
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you
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before
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using
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any
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Winsok
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power
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products
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described
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or
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contained
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herein
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in
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such
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applications.
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for
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result
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from
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at
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values
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that
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exceed,
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even
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momentarily,
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rated
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values
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(such
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as
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maximum
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ratings,
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operating
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condition
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ranges,
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or
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other
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parameters)
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listed
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in
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specifications
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of
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any
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all
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contained
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performance,
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characteristics,
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and
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functions
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the
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described
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in
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the
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independent
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state,
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and
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are
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of
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as
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mounted
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in
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customer’s
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o
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Winsok
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power
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Semiconductor
ꢀ
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Ͳ
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to
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property.
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When
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designing
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adopt
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safety
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measures
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so
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that
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these
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kinds
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of
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accidents
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but
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not
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limited
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to
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error
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for
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design,
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redundant
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design,
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and
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structural
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design.
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obtaining
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the
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export
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license
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from
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the
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concerned
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with
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parameters)
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due
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to
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product/technology
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improvement,etc.
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When
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designing
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refer
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to
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the
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“Delivery
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Specification”
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for
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Intend
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9,
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this
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provides
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as
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of
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Sep.2014. Specifications
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herein
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are
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subject
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to
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change
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without
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notice.
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