Winsok-Semicon-WSF20N06
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WSF20N06
N-Ch MOSFET
General Description
Product Summery
The WSF
20
N
06
is the highest performance
trench
N-Ch MOSFET
with extreme high cell
density ,
which provide excellent RDSON and
gate charge
for most of the synchronous buck
converter applications
.
BVDSS
RDSON
ID
60V
35
m
Ω
25
A
Applications
The WSF
20
N
06
meet the RoHS and
Green Product
requirement
.
z
High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z
Networking DC-DC Power System
z
LCD/LED back light
Features
TO
–
252 Pin Configuration
z
Advanced high cell density Trench technology
z
Super Low Gate Charge
z
Excellent CdV/dt effect decline
z
100% EAS Guaranteed
z
Green Device Available
Absolute Maximum Ratings
Symbol
V
DS
Parameter
Rating
60
Units
V
Drain-Source Voltage
Gate-Sou
r
ce Voltage
V
GS
±
20
25
V
I
D
@T
C
=25
℃
I
D
@T
C
=100
℃
I
D
@T
A
=25
℃
I
D
@T
A
=70
℃
I
DM
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Pulsed Drain Current
2
A
27
A
8
A
10
A
1
00
38
A
EAS
Single Pulse Avalanche Energy
3
mJ
A
I
AS
Avalanche Current
14
P
D
@T
C
=25
℃
P
D
@T
A
=25
℃
T
STG
Total Power Dissipation
4
Total Power Dissipation
4
35
W
W
℃
℃
3.
3
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 1
75
-55 to
175
T
J
Thermal Data
Symbol
R
θ
JA
Parameter
Typ.
—
Max.
75
Unit
℃
/W
℃
/W
Thermal Resistance Junction-Ambient
1
Thermal Resistance Junction-Case
1
3
R
θ
JC
—
Rev 2: Apr.2019
Page 1
WSF20N06
N-Ch MOSFET
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
Parameter
Conditions
V
GS
=0V , I
D
=250uA
Min.
60
—
—
—
1.
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
Max.
—
Unit
V
BV
DSS
Drain-Source Breakdown Voltage
BV
DSS
Temperature Coefficient
△
BV
DSS
/△
T
J
Reference to 25
℃
, I
D
=1mA
V
GS
=
10
V , I
D
=
16
A
0.057
35
—
V/
℃
45
R
DS(ON)
Static Drain-Source On-Resistance
2
m
Ω
50
40
V
GS
=
5
V , I
D
=
8
A
V
GS(th)
Gate Threshold Voltage
1.
6
-5.68
—
2.5
—
V
V
GS
=V
DS
, I
D
=250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
mV/
℃
1
V
DS
=
60
V , V
GS
=0V , T
J
=25
℃
V
DS
=
60
V , V
GS
=0V , T
J
=
12
5
℃
I
DSS
Drain-Source Leakage Current
uA
100
—
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
—
±
10
—
nA
S
V
GS
=
±
16
V , V
DS
=0V
V
DS
=
2
5V , I
D
=1
8
A
25
1.7
20
R
g
V
DS
=0V , V
GS
=0V , f=1MHz
3.4
—
Ω
Q
g
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
V
DS
=
30
V , V
GS
=
10
V , I
D
=
18
A
nC
ns
Q
gs
Q
gd
T
d(on)
T
r
—
7
5
—
18
15
60
31
650
—
V
DD
=30V , V
GS
=10V ,
—
R
G
=
6.8
Ω
, I
D
=1A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
—
—
—
—
C
iss
C
oss
C
rss
Input Capacitance
V
DS
=
30
V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
95
60
Guaranteed Avalanche Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
EAS
Single Pulse Avalanche Energy
5
19
—
—
mJ
V
DD
=25V , L=0.1mH , I
AS
=15A
Diode Characteristics
Symbol
Parameter
Conditions
Min.
—
Typ.
—
Max.
25
Unit
A
I
S
I
SM
V
SD
t
rr
Continuous Source Current
1,6
Pulsed Source Current
2,6
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
V
G
=V
D
=0V , Force Current
—
—
75
A
—
—
V
V
GS
=0V , I
S
=
20
A , T
J
=25
℃
1.3
—
—
65
85
nS
nC
IF=
20
A ,dI/dt=100A/µs,TJ=25
℃
Q
rr
—
—
Note :
1.
The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t<10sec.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
The EAS data shows Max. rating . The test condition is V
DD
=25V,V
GS
=10V,L=0.1mH,I
AS
=15A
3.
4.The power dissipation is limited by 150
℃
junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
Rev 2: Apr.2019
Page
2
WSF20N06
N-Ch MOSFET
Typical Characteristics
V
DS
, Drain -Source Voltage (V)
Fig1.
Typical Output Characteristics
VGS=10V
ID=16A
V
GS
, Gate -Source Voltage (V)
Tj – Junction
T
e
mperature (°C)
Fig3.
Typical Transfer Characteristics
Fig4.
Normalized On-Resistance Vs. Temperature
Tj=25°C
I
SD
, Source-Drain Voltage (A)
V
DS
, Drain -Source Voltage (V)
Fig5.
Typical Forward Transconductance Vs. Drain Current
Fig6.
Maximum Safe Operating Area
Rev 2: Apr.2019
Page
3
WSF20N06
N-Ch MOSFET
V
SD
, Source-Drain Voltage (V)
Qg –
T
o
tal Gate Charge (nC)
Fig7.
Typical Source-Drain Diode Forward Voltage
Fig8.
Typical Gate Charge Vs.Gate-Source Voltage
Tj – Junction
T
e
mperature (°C)
V
DS
, Drain-Source Voltage (V)
Fig10.
Typical Capacitance Vs.Drain-Source Voltage
Fig9.
Threshold Voltage Vs. Temperature
Fig11.
Unclamped Inductive Test Circuit and
waveforms
Fig12.
Switching Time Test Circuit and waveforms
Rev 2: Apr.2019
Page
4
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