Winsok-Semicon-WSF3038
| Part # | Winsok-Semicon-WSF3038 |
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WS
F3038
N-Ch MOSFET
General Description
Product Summery
The
WSF3038
is the highest performance trench
N-ch MOSFETs with extreme high cell density ,
which provide excellent R
DSON
and gate charge
for most of the synchronous buck converter
applications .
BVDSS
RDSON
ID
30V
1
5
m
Ω
3
8
A
Applications
The WSF3038 meet the RoHS and Green
Product requirement
, 100% EAS guaranteed
with full
function reliability approved.
z
High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z
Networking DC-DC Power System
z
Load Switch
Features
TO
–
25
2
Pin Configuration
z
Advanced high cell density Trench technology
z
Super Low Gate Charge
z
Excellent CdV/dt effect decline
z
100% EAS Guaranteed
z
Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
V
V
DS
Drain-Source Voltage
30
±
20
3
8
V
GS
I
D
@T
C
=25
℃
I
D
@T
C
=100
℃
I
DM
Gate-Sou
r
ce Voltage
V
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Pulsed Drain Current
2
A
18
A
60
A
EAS
Single Pulse Avalanche Energy
3
72
mJ
A
I
AS
Avalanche Current
21
P
D
@T
C
=25
℃
T
STG
Total Power Dissipation
4
25
W
℃
℃
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
T
J
Thermal Data
Symbol
R
θ
JA
Parameter
Typ.
—
Max.
25
Unit
℃
/W
℃
/W
℃
/W
Thermal Resistance Junction-Ambient (<10s)
1
Thermal Resistance Junction-ambient (Steady State)
1
Thermal Resistance Junction-Case
1
R
θ
JA
—
62
R
θ
JC
—
5
Dec.2014
Page 1
WS
F3038
N-Ch MOSFET
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
Parameter
Conditions
V
GS
=0V , I
D
=250uA
Min.
30
—
—
—
1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
Max.
—
Unit
V
BV
DSS
Drain-Source Breakdown Voltage
BVDSS Temperature Coefficient
△
BV
DSS
/△
T
J
Reference to 25
℃
, I
D
=1mA
V
GS
=10V , I
D
=10A
0.023
15
—
V/
℃
20
3
5
2.5
—
R
DS(ON)
Static Drain-Source On-Resistance
2
m
Ω
V
GS
=4.5V , I
D
=5A
22
V
GS(th)
Gate Threshold Voltage
1.5
-5.2
—
V
V
GS
=V
DS
, I
D
=250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
mV/
℃
V
DS=
24V , V
GS
=0V , T
J
=25
℃
V
DS=
24V , V
GS
=0V , T
J
=55
℃
1
I
DSS
Drain-Source Leakage Current
uA
—
5
V
GS
=
±
20V , V
DS
=0V
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
—
±
100
—
nA
S
V
DS
=15V , I
D
=10A
10
R
g
V
DS=
24V , V
GS
=0V , f=1MHz
2.5
7.2
1.4
2.
6
4.1
9.8
22
—
Ω
Q
g
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
—
V
DS=
20V , V
GS
=4.5V , I
D
=1
0
A
nC
ns
Q
gs
Q
gd
T
d(on)
T
r
—
—
—
V
DD
=12V , V
GS
=10V , R
G
=3.3
Ω
,
—
I
D
=5A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
6.0
550
68
—
C
iss
C
oss
C
rss
Input Capacitance
—
V
DS
=25V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
55
—
Guaranteed Avalanche Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
EAS
Single Pulse Avalanche Energy
5
V
DD
=25V , L=0.1mH , I
AS
=10A
16
—
—
mJ
Diode Characteristics
Symbol
Parameter
Conditions
Min.
—
Typ.
—
Max.
10
Unit
A
I
S
Continuous Source Current
1,6
Pulsed Source Current
2,6
Diode Forward Voltage
2
V
G
=V
D
=0V , Force Current
I
SM
V
SD
—
—
60
A
V
GS
=0V , I
S
=15A , T
j
=25
℃
—
—
1.2
V
Note :
1.
2
The data tested by surface mounted on a 1 inch
FR-4 board with 2OZ copper
,t<10sec
.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is V
DD
=25V,V
GS
=10V,L=0.1mH,I
AS
=
10
A
4.The power dissipation is limited by 150
℃
junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
Dec.2014
Page
2
WS
F3038
N-Ch MOSFET
Typical Characteristics
12
28
24
20
16
12
I
D
=
10
A
V
GS
=10V
10
V
GS
=7V
V
GS
=5V
8
6
4
2
0
V
GS
=4.5V
V
GS
=3V
0
0.5
1
1.5
2
2
4
6
8
10
V
GS
(V)
V
DS
Drain-to-Source Voltage(V)
Fig.2 On-Resistance vs. G-S
Voltage
Fig.1 Typical Output Characteristics
6
9
T =25
J
V
DS
=20V
℃
I
D
=1
0
A
4.5
3
6
3
0
1.5
0
0
0.4
0.8
1.2
0
2.5
5
7.5
10
Q
G
, Total Gate Charge (nC)
V
SD
, Source-to-Drain Voltage (V)
Fig.3 Forward characteristics of reverse
Fig.4 Gate-charge characteristics
1.8
1.8
1.4
1.0
0.6
0.2
1.4
1
0.6
0.2
-50
0
50
100
150
-50
0
50
100
150
T
J
,Junction Temperature
T ,
Junction Temperature (
J
)
℃
(
)
Fig.5 V
GS(th)
vs. T
J
℃
Fig.6 Normalized R
DSON
vs. T
J
Dec.2014
Page
3
WS
F3038
N-Ch MOSFET
1000
100
10
1
F=1.0MHz
Ciss
10us
100us
Coss
Crss
100
10ms
100ms
DC
T =25
℃
C
Single Pulse
10
0.1
1
5
9
13
17
21
25
0.1
1
10
100
V
DS
Drain to Source Voltage(V)
VDS (V)
Fig.8 Safe operating area
Fig.7 Capacitance
1
DUTY=0.5
0.3
0.1
0.1
0.05
0.02
P
DM
T
ON
T
0.01
D = T
ON
/T
S
I
NGLE PULSE
T
J
peak = T
C
+ P
D
M
x R
θ
JC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching time waveform
Fig.11 Unclamped inductive switching wave.
Dec.2014
Page
4
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Sep.2014. Specifications
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